Entity

Time filter

Source Type

Rochester, NY, United States

Patent
Intrinsiq Materials | Date: 2012-08-28

An apparatus for forming a pattern of a nanoparticle-based ink on a substrate has a printing apparatus that is energizable to deposit the nanoparticle-based ink in a pattern on a surface of the substrate. An illumination apparatus is energizable to direct a patterned illumination to cure the deposited ink pattern on the substrate, the illumination apparatus having an array having at least a first and a second laser diode, each laser diode coupled to a channel in a laser light coupling element through an optical fiber and having an illumination lens disposed to direct illumination from the coupling element onto the surface of the substrate. A transport apparatus is energizable to provide relative motion between the substrate and the illumination apparatus.


An apparatus for forming a pattern of a nanoparticle ink on a substrate has a transport apparatus that is energizable to move the substrate in a direction and a printing apparatus that deposits the nanoparticle ink in a pattern on a surface of the moving substrate. An illumination apparatus directs a patterned illumination to cure the deposited ink pattern on the moving substrate, the illumination apparatus having a light source that generates light directed toward a uniformizer, a spatial light modulator energizable to form a patterned illumination from the uniformized light, and an illumination lens disposed to direct illumination from the spatial light modulator onto the surface of the moving substrate.


Patent
Intrinsiq Materials | Date: 2014-03-19

A conductive paste for screen application has a mixture of copper flake having a mean diameter between 1.0-8.0 micrometers and copper nanoparticles having a mean diameter from 10 nm to 100 nm, wherein the ratio of the copper flake to the nanoparticles is between 2:1 and 5:1 by weight; and a resin comprising about half of a polymer having a molecular weight in excess of 10,000 and one or more solvents.


A conductive paste for screen application to a substrate has a mixture of copper particles having a mean diameter between 1.0-5.0 micrometers and polymer-coated copper nanoparticles having a mean diameter from 10 nm to 100 nm. The ratio of the copper particles to the nanoparticles is between 2:1 and 5:1 by weight. The paste has a resin comprising a binder portion and a solvent portion, wherein the binder portion is about half of the resin by weight, and a plasticizer having a boiling point above about 200 degrees C., wherein the plasticizer is from 1-3% of the paste, by weight.


Patent
Intrinsiq Materials | Date: 2015-11-03

A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.

Discover hidden collaborations