International Institute of Information Technology Bangalore
Bangalore, India

The International Institute of Information Technology, Bangalore commonly known as IIIT-B, is a graduate school in India. Founded in 1999, it offers Integrated M.Tech., M.Tech., M.S. and PhD programs in the field of Information Technology. In February 2005, IIIT-B was conferred Deemed University status under Section 3 of the University Grants Commission Act 1956. This was re-affirmed by the Tandon Committee report in October 2009, which gave of the report) IIIT-B a score of 41 .IIIT-Bangalore is promoted by the government of Karnataka and the IT industry. IIIT-B is managed by a Governing Body with S Gopalakrishnan , executive co-chairman, Infosys Ltd., as the chairperson. Wikipedia.

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Mahapatra R.,International Institute of Information Technology Bangalore
Wireless Personal Communications | Year: 2017

Rapid progress of Internet of Things (IoT) increases the data traffic manifold, which also increases by the requirements of next generation users. Recent analysis predicts IoT technology market worth 883.55 Billion USD by 2022 and it is also predicted that mobile data traffic will grow more than 1000 times compared with the end of 2010 beyond 2020. In order to support high QoS requirements, ITU proposed IMT-2020, which is setting the stage for 5G wireless technologies with broadband data rate more than 5 Gbps, latency less than 1 ms even for high mobile user. Establishing and maintaining a successful wireless communication link among the users with simultaneously achieved all objectives becomes challenging and complex. The backhaul of nearly all wireless access networks is fiber-optic link. In order to support this tremendous amount of data, optical network has been evolved in respective way. These technological advancements and deployments are creating a new landscape in access networks, with an integration of wireless and optical technologies. As optical fiber has penetrated the access network and the latest wireless standards have demanded smaller, higher bandwidth cells, fiber connectivity has become key. This paper studies the involvement of optical backbone network technologies in support with the different 5G wireless access technologies. In particular, the development of optical networks will be discussed with advancement of wireless networks to support high performance communication and satisfy the user. © 2017 Springer Science+Business Media New York

Choudhury A.,International Institute of Information Technology Bangalore
ACM International Conference Proceeding Series | Year: 2017

Asynchronous reliable broadcast is a fundamental primitive in secure distributed computing. In an asynchronous system of n mutually distrusting parties with t of them being Byzantine corrupted, reliable broadcast is possible if and only if t < n/3. With t < n/3 there exists multi-valued asynchronous reliable broadcast protocol with optimal communication complexity of O(nℓ) bits for broadcasting ℓ-bit messages, provided ℓ is sufficiently large. In this work, we give a multi-valued asynchronous reliable broadcast protocol with t < n/2 and with communication complexity O(nℓ) bits for sufficiently large ℓ. To beat the lower bound of t < n/3, we deploy a non-equivocation mechanism, which can be instantiated using cryptography, along with a trusted hardware set-up. Such a mechanism prevents a corrupted party from sending conflicting messages to different (honest) parties. The applicability of non-equivocation mechanism has been investigated in the past to improve the fault-tolerance of secure distributed protocols in the asynchronous setting. This is the first work for deploying the nonequivocation mechanism to improve the communication complexity of asynchronous protocols. © 2017 ACM.

Das D.,International Institute of Information Technology Bangalore
Wireless Networks | Year: 2017

Though, Software Defined Networking (SDN) started with the wired networks, several architectural solutions have been proposed to incorporate SDN in the wireless domain, to improve the overall performance of the network. However, analyses of specific use cases or scenarios based on these architectural approaches have been largely unexplored. One of the architectural solutions proposed in the radio interface is to have a configurable data plane at the base station, e.g., OpenRadio, which can be programmed with different Radio Access Technologies (RATs) dynamically by the SDN controller. In this work, we further investigate the futuristic problem where schemes, like OpenRadio and SDN concepts, come into play to improve mobility of User Equipment (UE). It is a well-known fact that intra-RAT (e.g., LTE to LTE) mobility procedures have lower latency, and are far less complex than their inter-RAT (e.g., LTE to UMTS) counterparts. Hence, we can improve user experience by converting inter-RAT mobility procedures to intra-RAT counterparts. We already proposed this scenario in our previous work, and results showed substantial mobility improvements. However, this conversion requires SDN signaling to reconfigure the base station to the target RAT, followed by an intra-RAT mobility procedure for the UE. In this paper, we investigate the performance requirement of this combined SDN signaling and intra-RAT mobility procedures, in order to do better than the inter-RAT counterparts. Results using our analytical model show, a minimum of 20% reduction in time for combined SDN signaling and intra-RAT mobility can outperform existing inter-RAT mobility procedures. Simulation results validate the observations obtained from the analytical model. Comparison of results with OpenFlow scenario shows that achieving the required signaling performance is feasible. © 2017 Springer Science+Business Media, LLC

Jagannathan S.,International Institute of Information Technology Bangalore
International Conference on Signal Processing, Communication, Power and Embedded System, SCOPES 2016 - Proceedings | Year: 2017

The assets of remote senses digital world daily generate massive volume of real-time data (mainly referred to the term 'Big Data'), where insight information has a potential significance if collected and aggregated effectively. In today's era, there is a great deal added to real-time remote sensing Big Data than it seems at first, and extracting the useful information in an efficient manner leads a system toward a major computational challenges, such as to analyse, aggregate, and store, where data are remotely collected. Keeping in view the above mentioned factors, The proposed architecture comprises three main units, such as 1) remote sensing Big Data acquisition unit (RSDU); 2) data processing unit (DPU); and 3) data analysis decision unit (DADU). The proposed architecture has the capability of dividing, load balancing, and parallel processing of only useful data. Thus, it results in efficiently analyzing real-time remote sensing Big Data using earth observatory system. Furthermore, the proposed architecture has the capability of storing incoming raw data to perform offline analysis on largely stored dumps, when required. Finally, a detailed analysis of remotely sensed earth observatory Big Data for land and sea area are provided using Hadoop. © 2016 IEEE.

Rao M.,International Institute of Information Technology Bangalore
Proceedings - 2017 30th International Conference on VLSI Design and 2017 16th International Conference on Embedded Systems, VLSID 2017 | Year: 2017

The emergence of three dimensional (3D) interconnects has reduced wire floor planning problems, increased device density, reduced RC wire delay, and minimized the energy dissipated by the long planar wires. Vertical 3D interconnect refers to a conductive filled through silicon vias (TSVs), which electrically connects front and back side of a silicon layer. Few electrical models and characterizations of TSVs are developed in the past for cylindrical TSV profile. The TSVs developed from Deep Reactive Ion etching, Bosch process, results in tapered profile instead of vertical sidewall vias, hence a new model is required to analyze the electrical performance of the 3D interconnects. Conventionally Cu is used as a wire metal and it remains to be the most favored material in 3D interconnect technology. Recently Carbon Nanotubes (CNTs) in the form of single walled and multiwalled in nature were attempted as TSV conductive fillers to improve the overall electrical and thermal performance of 3D integrated circuits (ICs). This paper discusses about high frequency electrical model and characterization of Cu/CNTs as composite 3D interconnects. The developed model of Cu/CNT filled tapered via was confirmed by comparing the electrical results with Cu/CNT filled cylindrical vias and Cu filled tapered vias. The electrical characterization of tapered vias in the form of RLGC circuit was developed to understand the effect of low and high Cu filling ratio in the composite 3D interconnects. Various copper filling ratios were used to analyze the effect of current density along the surface of the vias and scattering parameters for high frequency interconnect applications. © 2016 IEEE.

Rao M.,International Institute of Information Technology Bangalore
Proceedings - Electronic Components and Technology Conference | Year: 2017

A model of copper and carbon nanotube (CNT) composite filled through silicon via (TSV) is developed to estimate signal delay of a novel interconnect, employed in 3D integrated circuit (IC) design. The main objective of 3D interconnect is to electrically connect two stacks of circuits and offer robust chip functionalities. The 3D integration scheme allows independent design of operational blocks in separate layers, that areelectrically integrated through conductive TSVs. The Cu/CNT composites filled TSV is seen as next generation interconnect and a delay model incorporating composite nature is beneficial in realizing novel 3D IC. The paper proposes a model derived from elmore delay method to estimate bidirectional vertical signal delay for Cu/CNT composites in a tapered TSV profile. The proposed model was applied for various proportions of Copper in Cu/CNT composites filled tapered TSV to study the impact of Cufilling ratio on the signal delay. The proposed delay model was verified for a Cu filled tapered TSV mentioned in the literature. In addition, the impact of tapered profile of TSV on vertical signal delay was investigated using the developed model. The model suggested that tapered sidewalls of vertical interconnect offers less signal delay as compared to cylindrical shape of TSV, however the disparity in bidirectional vertical signal delay increases with tapered profile. The developed delay model is recommended as auseful tool for 3D IC design. © 2017 IEEE.

Agency: European Commission | Branch: FP7 | Program: CP-IP | Phase: SSH-2007-1.2-01 | Award Amount: 3.33M | Year: 2009

INGINEUS addresses the evolution of global production networks (GPNs) into global innovation networks (GINs), and the impact this new process of global capitalism has on knowledge intensive activities in the EU. Global sourcing and assembly arrangements have been around for some three decades. They were principally based on efficiency considerations. Thus, multinational firms (MNCs) outsourced parts of production processes to manufacturers in Asia and other low-cost locations around the globe, while retaining the most knowledge intensive assets in the home country. This is no longer the case. MNCs increasingly scout the globe for locations where the right mix of local competences allows them to tap into sophisticated parts of value chains. This is not limited to advanced economies but more and more involves firms and regions in selected developing countries that position themselves as attractive knowledge-intensive locations in their own right. INGINEUS studies the determinants of this process and analyses its implications both for the EU and its emerging partner countries in the developing world. First, it looks at the changing strategies of MNCs and the conditions under which it is favourable for them to offshore R&D and other knowledge-intensive parts of their production process. Second, it focuses on the evolving local capabilities in selected developing countries that allow them to claim increasingly complex parts of global value chains at much higher levels of technological sophistication than hitherto. Third, it analyses the consequences of the formation of GINs in the global economy and differentiates among their static and dynamic effects on growth, employment, and competitiveness in the EU. Finally, based on these insights, it derives policy recommendations that would allow the EU to benefit from the positive features of this process while mitigating its adverse consequences.

Prasad A.S.,Alcatel - Lucent | Rao S.,International Institute of Information Technology Bangalore
IEEE Transactions on Computers | Year: 2014

We present a cloud resource procurement approach which not only automates the selection of an appropriate cloud vendor but also implements dynamic pricing. Three possible mechanisms are suggested for cloud resource procurement: cloud-dominant strategy incentive compatible (C-DSIC), cloud-Bayesian incentive compatible (C-BIC), and cloud optimal (C-OPT). C-DSIC is dominant strategy incentive compatible, based on the VCG mechanism, and is a low-bid Vickrey auction. C-BIC is Bayesian incentive compatible, which achieves budget balance. C-BIC does not satisfy individual rationality. In C-DSIC and C-BIC, the cloud vendor who charges the lowest cost per unit QoS is declared the winner. In C-OPT, the cloud vendor with the least virtual cost is declared the winner. C-OPT overcomes the limitations of both C-DSIC and C-BIC. C-OPT is not only Bayesian incentive compatible, but also individually rational. Our experiments indicate that the resource procurement cost decreases with increase in number of cloud vendors irrespective of the mechanisms. We also propose a procurement module for a cloud broker which can implement C-DSIC, C-BIC, or C - OPT to perform resource procurement in a cloud computing context. A cloud broker with such a procurement module enables users to automate the choice of a cloud vendor among many with diverse offerings, and is also an essential first step toward implementing dynamic pricing in the cloud. © 2013 IEEE.

Das A.K.,International Institute of Information Technology Bangalore
Security and Communication Networks | Year: 2011

Key establishment in sensor networks is a challenging problem because of resource constraints of the sensors. Due to resource limitations and vulnerable to physical capture of the sensor nodes, the classical public-key routines are impractical in most sensor network architectures. In this paper, we propose a new random key pre-distribution scheme. Our scheme always defines a relationship between the ids of neighbor nodes and the keys possessed by those nodes while maintaining the required randomness in choice of keys. Our proposed scheme provides better security against node capture attack than the existing random key pre-distribution schemes. Moreover, it has better trade-off between communication overhead, network connectivity and security against node capture compared to the existing random key pre-distribution schemes. In addition, it supports dynamic node addition efficiently after initial deployment of the nodes in the network. © 2009 John Wiley & Sons, Ltd.

Ray P.K.,International Institute of Information Technology Bangalore | Kishor N.,Motilal Nehru National Institute of Technology | Mohanty S.R.,Motilal Nehru National Institute of Technology
IEEE Transactions on Smart Grid | Year: 2012

In this paper, comparative study between wavelet transform (WT) and S-transform (ST) based on extracted features for detection of islanding and power quality (PQ) disturbances in hybrid distributed generation (DG) system is presented. The hybrid system consists of DG resources like photovoltaic, fuel cell, and wind energy systems connected to grid. The negative sequence component of the voltage signal is used in islanding detection of these resources from the grid. Voltage signal extracted directly at the point of common coupling is considered for detection of PQ disturbances. Further, the effect of variation of grid impedances on islanding and PQ disturbances and effect of islanding on the coherency between the energy resources is also presented in this paper. The study for different scenarios of DG system is presented in the form of time-frequency analysis. The energy content and standard deviation of ST contour and WT signal is also reported in order to validate the graphical results. The results demonstrate the advantages of S-transform over WT in detection of islanding and different disturbances under noise-free as well as noisy scenarios. © 2010-2012 IEEE.

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