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Liu T.-C.,National Chiao Tung University | Chen C.,National Chiao Tung University | Liu S.-T.,Integrated Service Technology Inc. | Chang M.-L.,Integrated Service Technology Inc. | Lin J.,Integrated Service Technology Inc.
Journal of Materials Science: Materials in Electronics | Year: 2011

As packaging technology advances to wafer level chip scale packaging (WLCSP) to enable reduced chip size and manufacturing cost, circuit edit has become a critical issue for the fully packaged integrated circuits (ICs). These advanced package types cannot be rebuilt on a single chip; therefore, function testing after circuit edit of WLCSP faces challenges. Furthermore, there are routings at the redistribution layer of WLCSP ICs. Circuit edit was applied on both the chip and the package level. In this paper the focused ion beam was applied to mill the organic material of the package structure to expose underlying ICs, instead of chemically destroying the packaging. Metal line cutting and conductive path deposition were also developed by a beam-based technique. These new approaches make the direct edit of electrical circuitry possible not only in ICs but also at package level. Therefore, for the debug process and for failure analysis, the WLCSP ICs have negligible damage and negligible signal integrity loss by retaining the original packaging structure. © 2011 Springer Science+Business Media, LLC.


Jean R.-D.,Industrial Technology Research Institute of Taiwan | Larsson M.,University of South Australia | Cheng W.-D.,National Chiao Tung University | Hsu Y.-Y.,National Chiao Tung University | And 2 more authors.
Applied Surface Science | Year: 2016

Metallic nanoparticles have been utilized as analytical tools to detect a wide range of organic analytes. In most reports, gold (Au)-based nanosensors have been modified with ligands to introduce selectivity towards a specific target molecule. However, in a recent study a new concept was presented where bare Au-nanorods on self-assembled carboxymethyl-hexanoyl chitosan (CHC) nanocarriers achieved sensitive and selective detection of human serum albumin (HSA) after manipulation of the solution pH. Here this concept was further advanced through optimization of the ratio between Au-nanorods and CHC nanocarriers to create a nanotechnology-based sensor (termed CHC-AuNR nanoprobe) with an outstanding lower detection limit (LDL) for HSA. The CHC-AuNR nanoprobe was evaluated in simulated urine solution and a LDL as low as 1.5 pM was achieved at an estimated AuNR/CHC ratio of 2. Elemental mapping and protein adsorption kinetics over three orders of magnitude in HSA concentration confirmed accumulation of HSA on the nanorods and revealed the adsorption to be completed within 15 min for all investigated concentrations. The results suggest that the CHC-AuNR nanoprobe has potential to be utilized for cost-effective detection of analytes in complex liquids. © 2016 Elsevier B.V.


Liu T.-C.,National Chiao Tung University | Chen C.,National Chiao Tung University | Chiu K.-J.,Integrated Service Technology Inc. | Lin H.-W.,National Chiao Tung University | Kuo J.-C.,National Cheng Kung University
Materials Characterization | Year: 2012

We proposed a novel technique developed from focused ion beam (FIB) polishing for sample preparation of electron backscatter diffraction (EBSD) measurement. A low-angle incident gallium ion beam with a high acceleration voltage of 30 kV was used to eliminate the surface roughness of cross-sectioned microbumps resulting from mechanical polishing. This work demonstrates the application of the FIB polishing technique to solders for a high-quality sample preparation for EBSD measurement after mechanical polishing. © 2012 Elsevier Inc. All rights reserved.


Huang L.-T.,National Taiwan University | Chang M.-L.,Integrated Service Technology Inc. | Huang J.-J.,National Taiwan University | Kuo C.-L.,National Taiwan University | And 5 more authors.
Journal of Physics D: Applied Physics | Year: 2013

The structural and electrical characteristics of hafnium oxide (HfO2) gate dielectrics treated by a variety of post-deposition nitridation processes, including remote N2, N2/H2 and NH3 plasma, are presented by the x-ray photoelectron spectroscopy (XPS), high-resolution transmission electron microscopy and electrical measurements. The XPS measurement reveals that the nitrogen content in the HfO2 thin film treated by remote nitrogen and hydrogen plasma is higher than that treated only by remote nitrogen plasma, suggesting that the hydrogen has the capability to facilitate nitrogen dissociation. An ultra-thin interfacial layer (IL) thickness (∼0.3 nm), a high dielectric constant (20), an acceptable gate leakage current density (∼9 × 10-6 A cm-2), and a low capacitance equivalent thickness (1.9 nm) of the HfO2 gate dielectric were achieved by the post-deposition remote NH3 plasma nitridation treatment. However, an IL layer as thick as 1.5 nm was observed in the sample treated only by remote N2 plasma. The results indicate that the participation of hydrogen in the nitridation process is a promising way to improve the electrical properties of HfO2 gate dielectrics. © 2013 IOP Publishing Ltd.


Huang C.-A.,Integrated Service Technology Inc | Chuang L.,Integrated Service Technology Inc | Hsu K.,Integrated Service Technology Inc | Chung S.,Richtek Technology Corporation | Chan T.,Richtek Technology Corporation
Proceedings - International Symposium on Quality Electronic Design, ISQED | Year: 2015

This paper demonstrates a novel physical failure analysis (PFA) solution of MEMS motion sensor to inspect the fusion bonding interface between MEMS motion sensor proof-mass and oxide layer to locate defect points. This analytical study shows successful etching solution removal of MEMS motion sensor proof-mass and inspection of defect points. © 2015 IEEE.


Long H.-Y.,Integrated Service Technology Inc. | Chiang K.-T.,Integrated Service Technology Inc. | Huang C.-A.,Integrated Service Technology Inc. | Chuang L.,Integrated Service Technology Inc. | And 2 more authors.
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | Year: 2012

With the demands of higher multifunctional performance, 3D chips in stacking technology are widely developed recently. But the methods of 3D micro-bumps observation are normally confined to narrow widths. The polished width of either way of FIB or CP method is just able to reach the range of several to hundreds of micrometers. In this study, expanding to 3000 um of polished width is achievable by special sample preparation technique in iST. And the milling result of this system reveals the same quality of cross-section image compared to both FIB and CP methods. © 2012 IEEE.


Chen C.,Integrated Service Technology Inc.
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | Year: 2012

Creep Corrosion is the common factor to cause electronic products failed. Cloud Computing is getting more and more popular in recent years so people's daily life correlate closely to Cloud Computing. Many global companies built the huge data center in different countries. The challenges Cloud Computing facing are Transmission Technology, Cooling System, Energy Consumption and Air Pollution. Also, Creep Corrosion is a big concern to Cloud Computing. In this study, creep corrosion occurrence on IC Package is investigated. © 2012 IEEE.


Huang C.-A.,Integrated Service Technology Inc. | Long H.-Y.,Integrated Service Technology Inc. | Chiang K.-T.,Integrated Service Technology Inc. | Chuang L.,Integrated Service Technology Inc. | Tsui K.,Integrated Service Technology Inc.
Conference Proceedings from the International Symposium for Testing and Failure Analysis | Year: 2013

This paper demonstrates a new de-process flow for MEMS motion sensor failure analysis, using layer by layer de-processing to locate defect points. Analysis tools used in this new process flow include IR optical microscopy, thermal system, SEM and a cutting system to de-process of MEMS motion sensor and successful observation defect points. Copyright © 2013 ASM International® All rights reserved.


Huang C.-A.,Integrated Service Technology Inc. | Long H.-Y.,Integrated Service Technology Inc. | Chiang K.-T.,Integrated Service Technology Inc. | Chuang L.,Integrated Service Technology Inc. | Tsui K.,Integrated Service Technology Inc.
Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA | Year: 2013

Two new preparation methods of silicon substrates in the observation of micro-joint and micro-bumps failure mode were proposed in this study. One method is to use tilted grinding on 3DIC substrate to navigate the failed micro-joints. The other method can provide wider cross-section range by using ion polishing system studied in iST. © 2013 IEEE.


Liu S.-T.,Integrated Service Technology Inc. | Liu T.-C.,Integrated Service Technology Inc. | Chang M.-L.,Integrated Service Technology Inc. | Lin J.,Integrated Service Technology Inc.
Conference Proceedings from the International Symposium for Testing and Failure Analysis | Year: 2010

Contrary to traditional packages, packaging and testing of wafer-level chip scale package (WLCSP) are done before wafer dicing. The package can't be rebuilt on a single chip; therefore, the failure analysis and debug performed by Circuit Edit (CE) on ICs with WLCSP face challenges. In addition, there are route designs on the package level of WLCSP devices, which are unique compared with traditional packages. CE is required on both chip and package level of WLCSP devices. This package technology offers the smallest possible package size; consequently, it has seen wider use lately. Developing the approaches of FIB edits on a fully-packaged WLCSP device is indeed essential. Thus, methodologies for CE and debug on WLCSP devices will be explored in this study. Copyright © 2010 ASM International® All rights reserved.

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