Institute of Technical Education

Singapore, Singapore

Institute of Technical Education

Singapore, Singapore
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Kheng L.T.,Institute of Technical Education | Leng S.B.,Institute of Technical Education | Qiang Y.G.,Institute of Technical Education | Beng Chuan T.,Institute of Technical Education
Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 | Year: 2016

Wafer bumping and flip chip bonding are gaining momentum in the semiconductor packaging arena with the increase in pin count, smaller pad pitch and electrical performance. The cost of wafer bumping and flip chip bonding always hinder the growth for adoption. This paper introduces a patented wafer bumping process known as Double Resist Imaging Process (DRIP) which enables electrolytic wafer bumping through the reduction of patterning for bumping. The DRIP makes use of the resist to define the bump and removes the undercut under the under-bump metallization (UBM), hence enables a finer bumping pitch for flip chip application. The DRIP enhances the productivity of the wafer bumping process by 20%. Thus, simplifies the wafer bumping process and reduces the cost of wafer bumping. The Resist Defined Bump (RDB) was then flux-less flip chip bonded onto rigid BT substrate with NCP for reliability assessment. The solid liquid inter-diffusion by compressive force (SLICF) provided an instantaneous interconnect removing the need of paste printing and reflow process. Thereby, reduced the infrastructures for flip chip bonding. Macroscopic and microscopic analyses were done to assess the solder joints integrity. The patented DRIP process enables fine pitch bumping with 20% productivity enhancement through process innovation. The fluxless SLICF bonding on RDB simplifies the flip chip bonding process and further enhances the assembly productivity with no compromise in joint reliability. This innovation catalysts the wider adoption of flip chip technology for applications. © 2016 IEEE.


Wang P.,National University of Singapore | Koh R.K.C.,Institute of Technical Education | Boucharenc C.G.,National University of Singapore | Yen C.-C.,National University of Singapore
Conference on Human Factors in Computing Systems - Proceedings | Year: 2016

We present a work-in-progress design of an interactive game to support the training of upper limb reaching for elderly post-stroke survivors so as to improve their motivation and adherence toward rehabilitation exercises. Consisting of 64 tactile buttons and 64 Red, Green, Blue (RGB) Light-Emitting Diodes (LEDs) that are equally distributed across a (8 x 8) grid structure of translucent acrylic cubes, the gameplay guides players to perform directional reaching motions for therapeutic effect through the selective or randomized controlled lighting of cubes across the physical board. This is immediately followed by pressing each of them to turn them off. Varied LED colors provide additional playful or cognitive challenges, e.g. using each hand for a specific color. The user interface of the game prototype was tested by four elderly stroke survivors with initial feedback indicating that it may be sufficiently intuitive to create engaging rehabilitation experiences for this user base. © 2016 Authors.


Krishnan R.,National University of Singapore | Krishnan R.,Institute of Chemical and Engineering Sciences, Singapore | Sundarrajan S.,National University of Singapore | Sundarrajan S.,Institute of Technical Education | Ramakrishna S.,National University of Singapore
Macromolecular Materials and Engineering | Year: 2013

Electrospinning of polymer scaffolds is mostly carried out using organic solvents, but the drawbacks are: solvent costs, environmental hazards, and presence of traces of solvent impurities. The use of water-soluble polymers (WSPs), water or aqueous solutions as an electrospinning medium (green processing) is a very attractive method to avoid such issues. However, a few WSP such as polyelectrolytes are not spinnable as such, but have been electrospun by addition of WSPs, additives, and salts. This paper covers solution properties, polyelectrolyte nanofibrous scaffolds (polysaccharides, biopolymers, etc.), fabrication through green processing, and their regenerative medical applications such as wound dressing, drug delivery, and tissue engineering. This is the first review to cover the above issues, the drawbacks of current methods, and future challenges. The fabrication of polyelectrolyte nanofiber scaffolds from aqueous polymer solution via a green electrospinning process is described. Generation of different architectures under various spinning conditions, application of polysaccharides and biopolymers scaffolds (for skin, cartilage, heart, and bone applications), drawbacks of the current methods, and future challenges are reviewed. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.


Chandra Rao B.S.S.,National University of Singapore | Weng J.,National University of Singapore | Shen L.,Institute of Materials Research and Engineering of Singapore | Lee T.K.,Institute of Technical Education | Zeng K.Y.,National University of Singapore
Microelectronic Engineering | Year: 2010

This paper presents the studies to determine hardness and elastic modulus of intermetallic compound (IMC) layers in lead-free solder joints using nanoindentation technique. Two types of surface finishes, i.e., organic solderability preservative (OSP) and electrolytic Ni/Au on Cu pad, with Sn3.5Ag0.5Cu solder balls of 330 μm in diameter are studied, and the intermetallic layers are identified to be Cu6Sn5, Cu3Sn and (Niy,Cu1-y)3Sn4. The thicknesses of these IMC layers are only few microns at reflowed conditions (less than 2.3 μm). Therefore, probing mechanical properties of thinner IMCs using nanoindentation techniques poses immense difficulties and challenges. In this study, taper-mounted samples are used rather than standard cross-sectional mounted for solder joints. This taper sample gives a larger area for nanoindentation measurements. The elastic modulus and hardness of IMC layers are determined based on the parameter P/S2 (load/stiffness2) as a function of the indentation depth to minimise the effects of underlying UBM or solder materials. The modulus of Cu6Sn5, Cu 3Sn, (Cux,Ni1-x)6Sn 5 and (Niy,Cu1-y)3Sn 4 layer are found to be 112.0 ± 5.1 GPa, 135.5 ± 4.3 GPa, 165.0 ± 11.3 GPa and 136.8 ± 5.8 GPa; whereas the hardness values are found to be 6.8 ± 0.4 GPa, 6.6 ± 0.5 GPa, 7.2 ± 0.9 GPa and 8.2 ± 1.0 GPa, respectively. Thus, the IMC layers in the order of increasing hardness and modulus are found to be Cu6Sn 5, Cu3Sn, (Cux,Ni1- x)6Sn5 and (Niy,Cu1- y)3Sn4. © 2010 Elsevier Ltd. All rights reserved.


Patent
Institute Of Technical Education, National University Hospital S Pte Ltd and National University of Singapore | Date: 2013-08-28

A system and an apparatus for guiding an instrument may be provided, the apparatus comprising a main body; a holding member for holding an instrument, the holding member coupled to the main body; and one or more actuating members configured to effect movement of the holding member such that said movement of the holding member is capable of providing rotational movement of an instrument about a pivot point external the apparatus. The holding member may preferably be configured to co-operate with a compliance device, said compliance device capable of holding the instrument.


PubMed | National University of Singapore and Institute of Technical Education
Type: | Journal: Nurse education in practice | Year: 2016

With evolving healthcare demands, nursing educators need to constantly review their teaching methodologies in order to enhance learners knowledge and competency of skills in the clinical settings. Learning is an active process in which meaning is accomplished on the basis of experience and that authentic assessment pedagogy will enable nursing students to play an active part in their learning. The study was conducted with an aim to examine nursing students learning domains through the introduction of the authentic assessment pedagogy during their clinical practice. A quasi-experimental study (n=54) was conducted over a period of 10weeksat a local tertiary hospital. The experimental group was exposed to the authentic assessment pedagogy and were taught to use the assessment rubrics as an instrument to help enhance their learning. Students were assessed and scored according to the assessment rubrics, which were categorized into four domains; cognitive, psychomotor, affective and critical thinking abilities. The findings indicated that an overall score for the four domains between the experimental and control groups were significant, with p value of <0.05. Critical thinking scores were indicative of consistent improvement within the experimental group. The findings confirmed that learning outcomes of the nursing students were enhanced through the early introduction of the authentic assessment pedagogy in the clinical setting.


Receive press releases from Qilin World Capital Ltd: By Email Qilin World Capital Ltd.’s Leadership donated RM 10,000.00 to the Handicapped and Mentally Disabled Children Association Johor Bahru last September. Hong Kong, China, October 31, 2016 --( Located in Malaysia, the Handicapped and Mentally Disabled Children’s Association Johor Bahru is an organization dedicated to providing personal care to handicapped and mentally disabled children. Their goal is help these children achieve productive, fulfilling and happy lives through their work to help them learn, adapt socially, and live effectively within society. Founded in 1990, the organization has long been funded largely by donations from charity-minded businesses and organizations like Qilin World Capital. Their association motto enforces their mission to “Help the Helpless.” In a letter to Mr. Lau, the charitable organization thanked him and highlighted that his “support is a great motivation for us and it gives us courage and energy to move towards our goal of providing better living and care facilities to the residents at the Home.” During his tenure as managing director of Qilin World Capital, Mr. Lau has established a deep-seated culture of charitable giving both on a personal level and throughout his organization. Other recent beneficiaries of Qilin’s charitable giving and participation include the Institute of Technical Education, National Gallery Singapore, World Wildlife Fund, School Pocket Money Fund of Singapore, Singapore Senior Golfers’ Society, London Air Ambulance, SingHealth and the Singapore Red Cross. Qilin World Capital is an Asian based lending group with executives and representatives all over the world. They specialize in the creation of customized lending solutions for private and public companies operating in the global marketplaces. Qilin specializes in providing liquidity to the global capital markets in the form of non-recourse stock loans, repo's and private block purchases. For more information, contact: Jay Dombroski or visit http://www.qilinfinance.com Hong Kong, China, October 31, 2016 --( PR.com )-- Qilin World Capital Ltd.’s Raymond Lau donated RM 10,000.00 to the Handicapped and Mentally Disabled Children Association Johor Bahru last September. This donation will be used to maintain and improve the association’s onsite facilities, further their mission of educating handicapped and mentally disabled youth, and provide expert physiotherapy for children who need it most.Located in Malaysia, the Handicapped and Mentally Disabled Children’s Association Johor Bahru is an organization dedicated to providing personal care to handicapped and mentally disabled children. Their goal is help these children achieve productive, fulfilling and happy lives through their work to help them learn, adapt socially, and live effectively within society. Founded in 1990, the organization has long been funded largely by donations from charity-minded businesses and organizations like Qilin World Capital. Their association motto enforces their mission to “Help the Helpless.”In a letter to Mr. Lau, the charitable organization thanked him and highlighted that his “support is a great motivation for us and it gives us courage and energy to move towards our goal of providing better living and care facilities to the residents at the Home.”During his tenure as managing director of Qilin World Capital, Mr. Lau has established a deep-seated culture of charitable giving both on a personal level and throughout his organization. Other recent beneficiaries of Qilin’s charitable giving and participation include the Institute of Technical Education, National Gallery Singapore, World Wildlife Fund, School Pocket Money Fund of Singapore, Singapore Senior Golfers’ Society, London Air Ambulance, SingHealth and the Singapore Red Cross.Qilin World Capital is an Asian based lending group with executives and representatives all over the world. They specialize in the creation of customized lending solutions for private and public companies operating in the global marketplaces. Qilin specializes in providing liquidity to the global capital markets in the form of non-recourse stock loans, repo's and private block purchases. For more information, contact: Jay Dombroski or visit http://www.qilinfinance.com Click here to view the list of recent Press Releases from Qilin World Capital Ltd


Menkhoff T.,Singapore Management University | Yian T.T.,Institute of Technical Education | Wah C.Y.,SIM University Singapore | Kee W.Y.,Singapore Management University
VINE | Year: 2011

Purpose: The purpose of this paper is to examine how to successfully blend an e-learning module into a knowledge management (KM) course aimed at getting KM students interested in the respective subject matter (= KM) in a web-based learning environment. Design/methodology/approach: Based on data obtained from 138 undergraduate business management students at a university in Singapore, practical aspects of effectively implementing an e-learning system with a focus on KM are analyzed and the importance determined of three conceptual variables in the context of successful blended learning approaches: online faculty to student interaction, social presence and personal e-learning experiences. Findings: The study shows some positive correlations between online faculty to student interaction, the degree of presence in a web-based learning environment, as well as personal e-learning experiences as potential drivers of students' desire to learn more about the subject matter KM. Research limitations/implications: There has been reliance on self-reported data in both the strengths, weaknesses, opportunities and threats study and the student survey. The causal effects of students' perceptions on actual learning need to be explored in a future study with a larger sample size. Practical implications: To increase students' acceptance of a web-based KM course, instructors must ensure quality interaction between them and their students, strong social presence via intrinsically rewarding group interactions and enriching, personal e-learning experiences on the basis of real-life KM problems. Games, systematic performance monitoring and graded knowledge tests are critical, too. Originality/value: This study highlights several good design features of an effective student interface vis-à-vis the development of an effective online learning environment from the perspective of KM student learners. Implications for e-learning designers and instructors, as well as issues for further research, are outlined. © Emerald Group Publishing Limited.


Goh C.S.,Institute of Technical Education | Chong W.L.E.,Institute of Technical Education | Lee T.K.,Institute of Technical Education | Breach C.,Promat Consultants
Crystals | Year: 2013

A comparison study on the reliability of gold (Au) and copper (Cu) wire bonding is conducted to determine their corrosion and oxidation behavior in different environmental conditions. The corrosion and oxidation behaviors of Au and Cu wire bonding are determined through soaking in sodium chloride (NaCl) solution and high temperature storage (HTS) at 175 °C, 200 °C and 225 °C. Galvanic corrosion is more intense in Cu wire bonding as compared to Au wire bonding in NaCl solution due to the minimal formation of intermetallics in the former. At all three HTS annealing temperatures, the rate of Cu-Al intermetallic formation is found to be three to five times slower than Au-Al intermetallics. The faster intermetallic growth rate and lower activation energy found in this work for both Au/Al and Cu/Al as compared to literature could be due to the thicker Al pad metallization which removed the rate-determining step in previous studies due to deficit in Al material. © 2013 by the authors; licensee MDPI, Basel, Switzerland.


A multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device. The multilayer structure comprises: a substrate having an electrically conductive portion thereon; a dielectric layer formed over the substrate; the dielectric layer comprising an opening over at least part of the electrically conductive portion; and a conductive pillar formed on the at least part of the electrically conductive portion; wherein the conductive pillar comprises walls defined by at least the opening of the dielectric layer and an opening of a patterned layer.

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