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Cougo B.,Institute Of Recherche Technologique Saint Exupery
2015 17th European Conference on Power Electronics and Applications, EPE-ECCE Europe 2015 | Year: 2015

Tape wound cores are used in different applications where high power density is desired due to their high performance at high frequencies. In high power applications, inductor and transformer cores have large cross sections and consequently wide core legs which may result in different flux densities and temperatures in each layer as experimentally shown. This paper verifies the influence of the core cross section shape in the losses and temperature distribution inside the core. Optimal cross section shapes are developed in order to minimize different criteria such as core losses, heat extraction capabilities and total core weight. © 2015 EPE Association and IEEE. Source


Bensoussan A.,Institute Of Recherche Technologique Saint Exupery
Microelectronics Reliability | Year: 2015

The present paper is implementing a numerical application of the Boltzmann-Arrhenius-Zhurkov (BAZ) model and relates to the statistic reliability model derived from the Transition State Theory paradigm. It shows how the quantified tool can be applied to determine the associated effective activation energy. The unified multiple stress reliability model for electronic devices is applied to Normally-Off Power GaN transistor technologies to quantify and predict the reliability figures of this electronic type of product when operating under multiple stresses in an embedded system operating under such harsh environment conditions as set for Aerospace, Space, Nuclear, Submarine, Transport or Ground application. © 2015 Elsevier Ltd. Source


Durier A.,Institute Of Recherche Technologique Saint Exupery | Durier A.,Continental AG | Bensoussan A.,Institute Of Recherche Technologique Saint Exupery | Bensoussan A.,Thales Alenia | And 4 more authors.
Microelectronics Reliability | Year: 2015

The industries of transportation as the space industry are faced with a strong global economic competition which sets economic constraints on the cost of the functions. The use of COTS (Commercial Off-The-Shelf) components in embedded systems is more and more necessary to shorten the development cycles and reduce manufacturing costs. The application of electronic components comes overwhelmingly from public sectors whose requirement is to provide, in short development cycles, technological innovations including risk and cost mitigation. These development cycles must incorporate the specific constraints of embedded systems in terms of reliability, dependability, and availability, held in harsh environment and life.Due to the low volume of components supplying the market of embedded systems, component manufacturers are unlikely to provide information necessary to supporting folders for certification or qualification. It is therefore necessary for the Space, Aeronautics and Automotive industries to characterize the performance and robustness of these COTS components in the operational and environmental conditions of their applications.This paper presents the objectives and main challenges of a sponsored project dedicated to characterize and model COTS reliability. © 2015. Source


Bensoussan A.,Institute Of Recherche Technologique Saint Exupery | Bensoussan A.,Thales Alenia | Suhir E.,Vienna University of Technology | Suhir E.,ERS Co. | And 2 more authors.
Microelectronics Reliability | Year: 2015

The establishment of European suppliers for DFB Laser Modules at 1.55. μm is considered to be essential in the context of future European space programs, where availability, cost and schedule are of primary concerns. Also, in order to minimize the risk, associated with such a development, the supplier will be requested to use components which have already been evaluated and/or validated and/or qualified for space applications. The Arrhenius model is an empirical equation able to model temperature acceleration failure modes and failure mechanisms. The Eyring model is a general representation of Arrhenius equation which takes into account additional stresses than temperature. The present paper suggests to take advantage of these existing theories and derives a unified multiple stress reliability model for electronic devices in order to quantify and predict their reliability figures when operating under multiple stress in harsh environment as for Aerospace, Space, Nuclear, Submarine, Transport or Ground. Application to DFB laser diode module technologies is analyzed and discussed based on evaluation test program under implementation. © 2015 Elsevier Ltd. Source


Bensoussan A.,Institute Of Recherche Technologique Saint Exupery | Bensoussan A.,Thales Alenia | Suhir E.,Portland State University | Suhir E.,Vienna University of Technology | And 3 more authors.
Microelectronics Reliability | Year: 2015

The establishment of European suppliers for DFB Laser Modules at 1.55 μm is considered to be essential in the context of future European space programs, where availability, cost and schedule are of primary concerns. Also, in order to minimize the risk, associated with such a development, the supplier will be requested to use components which have already been evaluated and/or validated and/or qualified for space applications. The Arrhenius model is an empirical equation able to model temperature acceleration failure modes and failure mechanisms. The Eyring model is a general representation of Arrhenius equation which takes into account additional stresses than temperature. The present paper suggests to take advantage of these existing theories and derives a unified multiple stress reliability model for electronic devices in order to quantify and predict their reliability figures when operating under multiple stress in harsh environment as for Aerospace, Space, Nuclear, Submarine, Transport or Ground. Application to DFB laser diode module technologies is analyzed and discussed based on evaluation test program under implementation. © 2015 Elsevier Ltd. Source

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