Institute Of Recherche Technologique Saint Exupery

Toulouse, France

Institute Of Recherche Technologique Saint Exupery

Toulouse, France
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Pin S.,Institute Of Recherche Technologique Saint Exupery | Pin S.,University of Bordeaux 1 | Fremont H.,University of Bordeaux 1 | Gracia A.,University of Bordeaux 1
2016 6th Electronic System-Integration Technology Conference, ESTC 2016 | Year: 2016

The study aims at investigating the influence of IMC growth on the thermomechanical fatigue behaviour of lead free solder joints. As a potential driving parameter of the failure of such assemblies, a numerical study is carried out to conclude on the implementation in future predictive FE models. A first FE model of a Single Lap Shear test is used to highlight in which conditions neglecting the IMC thickness can be an issue for material identification. It has been shown that common IMC layers present after fusion do not represent an important source of error except for the thinnest and stiffest soldered joints. The most important impact of IMC on this kind of test is the error of estimation on the Young's modulus and the stress increasing at the ends of the joint. The creep properties determination is not impacted by IMC. A second FE model is used to simulate the consequences of IMC growth in a BGA. The simulation of a classic BGA under a thermal load shows that warpage is not really impacted by a stiffer joint contrary to the stress levels in the corner ball. Differential displacement due to CTE mismatch produces higher stress levels in the solder balls near the bi-material interfaces when IMC layers are considered. Submodelling techniques are used to analyse with more details the interfacial gradients of stress and determine if IMC implementation is necessary to reproduce all the potential conditions of failure. © 2016 IEEE.


Durier A.,Institute Of Recherche Technologique Saint Exupery | Durier A.,Continental AG | Bensoussan A.,Institute Of Recherche Technologique Saint Exupery | Bensoussan A.,Thales Alenia | And 4 more authors.
Microelectronics Reliability | Year: 2015

The industries of transportation as the space industry are faced with a strong global economic competition which sets economic constraints on the cost of the functions. The use of COTS (Commercial Off-The-Shelf) components in embedded systems is more and more necessary to shorten the development cycles and reduce manufacturing costs. The application of electronic components comes overwhelmingly from public sectors whose requirement is to provide, in short development cycles, technological innovations including risk and cost mitigation. These development cycles must incorporate the specific constraints of embedded systems in terms of reliability, dependability, and availability, held in harsh environment and life.Due to the low volume of components supplying the market of embedded systems, component manufacturers are unlikely to provide information necessary to supporting folders for certification or qualification. It is therefore necessary for the Space, Aeronautics and Automotive industries to characterize the performance and robustness of these COTS components in the operational and environmental conditions of their applications.This paper presents the objectives and main challenges of a sponsored project dedicated to characterize and model COTS reliability. © 2015.


Bensoussan A.,Institute Of Recherche Technologique Saint Exupery | Bensoussan A.,Thales Alenia | Suhir E.,Vienna University of Technology | Suhir E.,ERS Co. | And 2 more authors.
Microelectronics Reliability | Year: 2015

The establishment of European suppliers for DFB Laser Modules at 1.55. μm is considered to be essential in the context of future European space programs, where availability, cost and schedule are of primary concerns. Also, in order to minimize the risk, associated with such a development, the supplier will be requested to use components which have already been evaluated and/or validated and/or qualified for space applications. The Arrhenius model is an empirical equation able to model temperature acceleration failure modes and failure mechanisms. The Eyring model is a general representation of Arrhenius equation which takes into account additional stresses than temperature. The present paper suggests to take advantage of these existing theories and derives a unified multiple stress reliability model for electronic devices in order to quantify and predict their reliability figures when operating under multiple stress in harsh environment as for Aerospace, Space, Nuclear, Submarine, Transport or Ground. Application to DFB laser diode module technologies is analyzed and discussed based on evaluation test program under implementation. © 2015 Elsevier Ltd.


Bensoussan A.,Institute Of Recherche Technologique Saint Exupery | Bensoussan A.,Thales Alenia | Suhir E.,Portland State University | Suhir E.,Vienna University of Technology | And 3 more authors.
Microelectronics Reliability | Year: 2015

The establishment of European suppliers for DFB Laser Modules at 1.55 μm is considered to be essential in the context of future European space programs, where availability, cost and schedule are of primary concerns. Also, in order to minimize the risk, associated with such a development, the supplier will be requested to use components which have already been evaluated and/or validated and/or qualified for space applications. The Arrhenius model is an empirical equation able to model temperature acceleration failure modes and failure mechanisms. The Eyring model is a general representation of Arrhenius equation which takes into account additional stresses than temperature. The present paper suggests to take advantage of these existing theories and derives a unified multiple stress reliability model for electronic devices in order to quantify and predict their reliability figures when operating under multiple stress in harsh environment as for Aerospace, Space, Nuclear, Submarine, Transport or Ground. Application to DFB laser diode module technologies is analyzed and discussed based on evaluation test program under implementation. © 2015 Elsevier Ltd.


Bonnet J.,Institute Of Recherche Technologique Saint Exupery | Bonnet J.,CNRS Toulouse Institute in Information Technology | Gleizes M.-P.,CNRS Toulouse Institute in Information Technology | Kaddoum E.,CNRS Toulouse Institute in Information Technology | And 2 more authors.
International Conference on Self-Adaptive and Self-Organizing Systems, SASO | Year: 2015

Mission planning for a constellation of Earth observation satellites is a complex problem raising significant technological challenges for tomorrow's space systems. The large numbers of customers requests and their dynamic introduction in the planning system result in a huge combinatorial search space with a potentially highly dynamical evolution requirements. The techniques used nowadays have several limitations, in particular, it is impossible to dynamically adapt the plan during its construction even for small modifications. Satellites of a constellation are planned in a chronological way instead of a more collective planning which can provide additional load balancing. In this paper, we propose to solve this difficult and highly dynamic problem using adaptive multi-agent systems, taking advantage from their self-adaptation and self-organization mechanisms. In the proposed system, the agents, through their local interactions, allow to dynamically reach a good solution, while ensuring a controlled distribution of tasks within the constellation of satellites. Finally, a comparison with a classical chronological greedy algorithm, commonly used in the spatial domain, highlights the advantages of the presented system. © 2015 IEEE.


Cougo B.,Institute Of Recherche Technologique Saint Exupery
2015 17th European Conference on Power Electronics and Applications, EPE-ECCE Europe 2015 | Year: 2015

Tape wound cores are used in different applications where high power density is desired due to their high performance at high frequencies. In high power applications, inductor and transformer cores have large cross sections and consequently wide core legs which may result in different flux densities and temperatures in each layer as experimentally shown. This paper verifies the influence of the core cross section shape in the losses and temperature distribution inside the core. Optimal cross section shapes are developed in order to minimize different criteria such as core losses, heat extraction capabilities and total core weight. © 2015 EPE Association and IEEE.


Bensoussan A.,Institute Of Recherche Technologique Saint Exupery
Microelectronics Reliability | Year: 2015

The present paper is implementing a numerical application of the Boltzmann-Arrhenius-Zhurkov (BAZ) model and relates to the statistic reliability model derived from the Transition State Theory paradigm. It shows how the quantified tool can be applied to determine the associated effective activation energy. The unified multiple stress reliability model for electronic devices is applied to Normally-Off Power GaN transistor technologies to quantify and predict the reliability figures of this electronic type of product when operating under multiple stresses in an embedded system operating under such harsh environment conditions as set for Aerospace, Space, Nuclear, Submarine, Transport or Ground application. © 2015 Elsevier Ltd.

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