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Li G.,Institute of Jiangxi Academy of Science | Li G.,University of Science and Technology Beijing | Ren S.,Institute of Jiangxi Academy of Science | Ren S.,University of Science and Technology Beijing | Qu X.,University of Science and Technology Beijing
Fenmo Yejin Jishu/Powder Metallurgy Technology | Year: 2013

Diamond/Cu composites receive extensive attention as a new generation of electronic packaging material. The diamond/Cu composites were fabricated by vacuum pressure infiltration in this paper. The effects of diamond volume fraction, particle size and surface coating on the coefficient of thermal expansion (CTE) of diamond/Cu composites were investigated. The results show that CTE decrease with the increase of volume fraction of diamond. Decrease of diamond particle size is beneficial to the reduction of CTE of the composites. Cr-coated diamond show lower CTE than Ti-coated diamond. When volume fraction of diamond is 70% and the particle size of diamond is 40 microns, CTE of composites can be as low as 6.5 × 10-6 K-1. Source


Hong Q.,Institute of Jiangxi Academy of Science | Hong Q.,University of Science and Technology Beijing | Ren S.,Institute of Jiangxi Academy of Science | Ren S.,University of Science and Technology Beijing | And 2 more authors.
Fenmo Yejin Jishu/Powder Metallurgy Technology | Year: 2015

Diamond/Cu composites were prepared by infiltration. The effects of adding Co to the matrix of the combination of 15 μm and 50 μm diamond particles with the volume fraction of 60% on the density, thermal conductivity, the coefficient of thermal expansion(CTE) and bending strength of diamond/Cu composites were investigated. The results show that the temperature of reaching high density of the composites gradually increased with the increase of the Co content in Cu. Excessive infiltration temperature will cause the decrease of the composites density when using the same alloy composition. When the Co content in Cu is 2%, the thermal conductivity of composites increased by 57%, to 347 W/(m·K), but the thermal conductivity of composites begin to decrease when the content of Co is more than 2%. And the increase of Co content is beneficial to reduce the thermal expansion coefficient of the composites and improve the bending strength; this is mainly attributed to the improvement of the interface between diamond and Cu after adding the Co to the copper. ©, 2015, Beijing Research Institute of Powder Metallurgy. All right reserved. Source

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