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Stuttgart Mühlhausen, Germany

Strobel M.,Institute For Mikroelektronik Stuttgart Ims Chips | Dottling D.,Pilz GmbH and Co. KG
Advanced Optical Technologies | Year: 2013

The first part of this paper describes the high dynamic range CMOS (HDRC®) imager - a special type of CMOS image sensor with logarithmic response. The powerful property of a high dynamic range (HDR) image acquisition is detailed by mathematical definition and measurement of the optoelectronic conversion function (OECF) of two different HDRC imagers. Specific sensor parameters will be discussed including the pixel design for the global shutter readout. The second part will give an outline on the applications and requirements of cameras for industrial safety. Equipped with HDRC global shutter sensors SafetyEYE® is a high-performance stereo camera system for safe three-dimensional zone monitoring enabling new and more flexible solutions compared to existing safety guards. © 2013 Thoss Media & De Gruyter. Source


Strobel M.,Institute For Mikroelektronik Stuttgart Ims Chips
Proceedings of SPIE - The International Society for Optical Engineering | Year: 2012

Logarithmic High Dynamic Range CMOS (HDRC) image sensors exhibit the highest Dynamic Range and a straight forward image acquisition compared to other High Dynamic Range imagers or techniques. The nearly constant pixel random noise over the illumination range, in contrast to sensors with linear or piece-wise linear Opto Electronic Conversion Function (OECF), gives rise to a balanced contrast resolution. The Noise Equivalent Contrast (NEC) will be introduced as a figure of merit to compare both imager types with nonlinear and linear OECF, which leads to the incremental Signal-to-Noise Ratio (iSNR) and SNR, respectively. This will be shown by measurements of OECF and NEC performed with a logarithmic HDRC imager. The resulting iSNR, related to ISO15739, will be quantitatively compared to SNR data of a linear imager according to EMVA1288 standard. The benefits of the logarithmic imager come with the necessity to correct CMOS technology dependent pixel to pixel variations, namely the MOS transistor threshold and gain variations and the photodiode dark current distribution contributing to an overlaid Fixed Pattern in the raw image data. Depending on the required quality and the allowed computational complexity a Fixed Pattern Correction (FPC) algorithm should correct from the most dominant up to all three non-uniformity parameters per pixel in the digital signal chain of a camera. © 2012 SPIE. Source


Utermohlen F.,Robert Bosch GmbH | Herrmann I.,Robert Bosch GmbH | Burghartz J.N.,Institute For Mikroelektronik Stuttgart Ims Chips
Smart Systems Integration 2015 - 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2015 | Year: 2015

Due to their room temperature operation, the CMOS compatible manufacturing process and the ambitious scaling effort in MEMS technology within the last years, MEMS microbolometers are excellent candidates for low-cost thermal imaging systems which can be used for automotive as well as for consumer applications. Since the application specific sensor requirements with regard to performance, robustness, resolution and cost are very diverse, a lean and fast development without a time-consuming manufacturing of several prototypes becomes indispensable. Therefore, a physics-based scalable compact model covering the full signal path from the IR emission by an object to the evaluation circuit has been developed and experimentally validated. Source


Harendt C.,Institute For Mikroelektronik Stuttgart Ims Chips | Yu Z.,Institute For Mikroelektronik Stuttgart Ims Chips | Burghartz J.N.,Institute For Mikroelektronik Stuttgart Ims Chips | Kostelnik J.,Wurth Elektronik GmbH and Co. KG | And 2 more authors.
European Solid-State Device Research Conference | Year: 2014

Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solution for industrial applications of flexible electronics. This paper provides a comprehensive overview of HySiF technology, including aspects of thin-chip fabrication, reliability and assembly. Also presented is an industrial demonstrator utilizing such a HySiF component. © 2014 IEEE. Source


Kohler H.,BIAS Bremen Institute of Applied Beam Technology | Jayaraman V.,BIAS Bremen Institute of Applied Beam Technology | Brosch D.,Institute For Mikroelektronik Stuttgart Ims Chips | Hutter F.X.,Institute For Mikroelektronik Stuttgart Ims Chips | Seefeld T.,BIAS Bremen Institute of Applied Beam Technology
Physics Procedia | Year: 2013

In materials processing heat input into parts is a major issue. To reduce heat impact, temperatures can be evaluated to optimize processes i.e. for low distortion, low dilution or small heat affected zones. For the first time a new sensor which combines ratio pyrometry with 2D-resolved measurement is applied for laser processing. The advantages of independence of emissivity and attenuation of the thermal radiation together with 2D-temperature information are demonstrated on laser cladding. The temperature distribution at the parts' surfaces becomes available with quantitatively high precision. This information was successfully applied to validate FEM-based temperature field simulations. © 2013 The Authors. Source

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