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Asadi E.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015 | Year: 2015

With the chemical mechanical polishing (CMP) technology the material removal is made with conventional abrasives and chemical dissolution instead of using expensive diamond abrasives. In this investigation, we report on successful CMP polishing of Sintered Silicon Carbide (SSiC) wafer surfaces using concentrated colloidal silica slurries with different pH values. The selection of polishing process parameters (speed of the rotating disk, applied force) are analysed in JMP® (SAS institute) while a design of experiments (DOE) is employed. The optimal wafer surfaces were achieved with colloidal silica CMP under conditions that combine proper parameters (determined by the DOE evaluation) and a high slurry alkalinity (pH > 8.5). Confocal scanning microscopy indicates a significant reduction of roughness and the material removal rate is measured by a touch probe. This process can be combined with dicing and DRIE (Deep Reactive Ion Etching) technology in the tool machining industry for SSiC wafer processing. Source


Stompe M.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015 | Year: 2015

Manufacturing of ceramic based parts is the main challenge for future application in MEMS for automotive, medicine and mobile technology. To benefit from their superior properties like mechanical strength, high temperature and chemical resistance, high precision and low-cost processes are required. Source


Holz S.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 | Year: 2013

Nanowires are of great interest for technical devices, because of their special electric and magnetic behaviour. The main challenge in micro production technology is to realize a reproducible process for handling these nanowires. Otherwise it leads to a high rejection rate depending on failures in critical process steps. To avoid this, new production methods for nanowires-containing devices have to be found. The chosen way deals with the idea of using an anodized Al mask. The aim is to integrate the nanostructures into a MEMS technology to enhance its application field. Source


Stompe M.,Institute for Micro Production Technology | Cvetkovic S.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 | Year: 2013

Increasing efficiency for dicing of hard and brittle materials still represents a major challenge for ultra-precision machining. At the same time is dicing the most effective technology for structuring of material composites or stacks consisting of different materials. This paper describes a new approach to structure multi material stacks by using specially adapted dual dicing blade concept with special remark on increasing form accuracy and facilitating miniaturisation. The dual dicing concept is further expanded for structuring of ductile materials and multi-material specimens. Source


Stompe M.,Institute for Micro Production Technology | Cvetkovic S.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 | Year: 2013

Dicing still represents a main technology for separating or structuring hard and brittle materials. However, the high and frequent wear of machining tools (dicing blades) does not allow efficient machining. A new ceramic material and machining process are introduced to overcome this restriction. For this purpose, a porcelain-based ceramic is used. In its "green-state" (pre-sintered), it is well suitable for machining. Conducting the sintering process post-machining achieves extremely hard and tough surface properties, and introduces a low shrinkage. This paper presents a dicing study for highly productive micro production processes of porcelain ceramics for MEMS. Structures with an aspect ratio (<22:1) are achieved in green state with subsequent sintering with nearly no wear on the cutting tool. Source

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