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Stompe M.,Institute for Micro Production Technology | Witzendorff P.V.,Laser Zentrum Hannover e.V. | Cvetkovic S.,Institute for Micro Production Technology | Moalem A.,Laser Zentrum Hannover e.V. | And 2 more authors.
Microelectronic Engineering | Year: 2012

Adapted ultra-precision dicing processes are required for implementing hard and brittle materials such as sintered silicon carbide (SSiC) into MEMS applications. Wear and accuracy loss of resin-bonded dicing blades are significant when processing SSiC. Metal-bonded dicing blades can better resist the harsh environment during dicing of SSiC but require frequent dressing to renew the worn-out diamond grains. This paper presents laser dressing of metal-bonded dicing blades to show its capability as an online dressing tool. The laser dressed blades achieve equal sharpness as conventional dressed blades with the advantage of a smaller and more consistent reduction of the blade diameter. Laser pulse lengths of 655 and 12 ps with a wavelength of 532 nm are studied for laser dressing. The dicing blades dressed with 655 ps achieved higher cutting performances in terms of increased substrate roughness and better cutting depth consistency. © 2012 Elsevier B.V. All rights reserved.


Belski A.,Institute for Micro Production Technology | Wurz M.C.,Institute for Micro Production Technology | Rittinger J.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Microelectronic Engineering | Year: 2013

A ''gentelligent component'' inherently stores all information necessary for its distinct identification, reproduction as well as for its manufacturing process and thus has both genetic and intelligent character. For the data storage directly on the components' rough surface a magnetic recording system is required. The goal is to develop a flexible magnetic write head which can adapt its own geometry to the components surface topography and guaranties perfect contact with the surface during the data storage process. This paper presents a new micro fabrication method using the fabrication without a rigid substrate base, double-sided fabrication, adhesive tape application, and high precision drilling. This method simplifies the fabrication process and offers modularity. The write head showed error-free performance after thermal shock test. © 2013 Elsevier B.V. All rights reserved.


Asadi E.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015 | Year: 2015

With the chemical mechanical polishing (CMP) technology the material removal is made with conventional abrasives and chemical dissolution instead of using expensive diamond abrasives. In this investigation, we report on successful CMP polishing of Sintered Silicon Carbide (SSiC) wafer surfaces using concentrated colloidal silica slurries with different pH values. The selection of polishing process parameters (speed of the rotating disk, applied force) are analysed in JMP® (SAS institute) while a design of experiments (DOE) is employed. The optimal wafer surfaces were achieved with colloidal silica CMP under conditions that combine proper parameters (determined by the DOE evaluation) and a high slurry alkalinity (pH > 8.5). Confocal scanning microscopy indicates a significant reduction of roughness and the material removal rate is measured by a touch probe. This process can be combined with dicing and DRIE (Deep Reactive Ion Etching) technology in the tool machining industry for SSiC wafer processing.


Stompe M.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015 | Year: 2015

Manufacturing of ceramic based parts is the main challenge for future application in MEMS for automotive, medicine and mobile technology. To benefit from their superior properties like mechanical strength, high temperature and chemical resistance, high precision and low-cost processes are required.


Stompe M.,Institute for Micro Production Technology | Cvetkovic S.,Institute for Micro Production Technology | Taptimthong P.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 12th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2012 | Year: 2012

By using inline dressing, the tool can be in-situ controlled and dressed on demand. This way, constant machining conditions can be obtained during the entire processing time. Especially for dicing of hard and brittle materials, which causes high blade wear, is a very important issue regarding process control and efficiency. The first step to integrate the laser dressing process into a dicing machine is to determine the inline dressing criteria, which is the topic of this work.


Stompe M.,Institute for Micro Production Technology | Cvetkovic S.,Institute for Micro Production Technology | Taptimthong P.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 12th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2012 | Year: 2012

Dicing of hard and brittle materials is still a major challenge for ultra-precision machining. The main goals, in order to rationalize the process as well as to enhance the surface finish and form accuracy, are reducing the tool wear and supporting the removal mechanisms. For this purpose, a profound understanding of the forces generated in the tool-workpiece interface (contact) during the dicing process is required. This can be done by distinguishing the effects of circumferential and sidewall grinding. This paper presents a detailed analysis of these two effects.


Stompe M.,Institute for Micro Production Technology | Cvetkovic S.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 | Year: 2013

Dicing still represents a main technology for separating or structuring hard and brittle materials. However, the high and frequent wear of machining tools (dicing blades) does not allow efficient machining. A new ceramic material and machining process are introduced to overcome this restriction. For this purpose, a porcelain-based ceramic is used. In its "green-state" (pre-sintered), it is well suitable for machining. Conducting the sintering process post-machining achieves extremely hard and tough surface properties, and introduces a low shrinkage. This paper presents a dicing study for highly productive micro production processes of porcelain ceramics for MEMS. Structures with an aspect ratio (<22:1) are achieved in green state with subsequent sintering with nearly no wear on the cutting tool.


Stompe M.,Institute for Micro Production Technology | Cvetkovic S.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 | Year: 2013

Increasing efficiency for dicing of hard and brittle materials still represents a major challenge for ultra-precision machining. At the same time is dicing the most effective technology for structuring of material composites or stacks consisting of different materials. This paper describes a new approach to structure multi material stacks by using specially adapted dual dicing blade concept with special remark on increasing form accuracy and facilitating miniaturisation. The dual dicing concept is further expanded for structuring of ductile materials and multi-material specimens.


Holz S.,Institute for Micro Production Technology | Rissing L.,Institute for Micro Production Technology
Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 | Year: 2013

Nanowires are of great interest for technical devices, because of their special electric and magnetic behaviour. The main challenge in micro production technology is to realize a reproducible process for handling these nanowires. Otherwise it leads to a high rejection rate depending on failures in critical process steps. To avoid this, new production methods for nanowires-containing devices have to be found. The chosen way deals with the idea of using an anodized Al mask. The aim is to integrate the nanostructures into a MEMS technology to enhance its application field.

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