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Santa Barbara, CA, United States

Innovative Micro Technology | Date: 2013-07-29

A MEMS-based system and a method are described for separating a target particle from the remainder of a fluid stream. The system makes use of a unique, microfabricated movable structure formed on a substrate, which moves in a rotary fashion about one or more fixed points, which are all located on one side of the axis of motion. The movable structure is actuated by a separate force-generating apparatus, which is entirely separate from the movable structure formed on its substrate. This allows the movable structure to be entirely submerged in the sample fluid.

Owl Biomedical and Innovative Micro Technology | Date: 2012-05-23

A disposable cartridge is described which is equipped with a plurality of microfabricated particle sorting structures. The disposable cartridge may include passageways which connect fluid reservoirs in the cartridge with corresponding microfluidic passageways on the particle sorting structure. A flexible gasket may prevent leakages and allow the fluid to cross the gasket barrier through a plurality of holes in the gasket, allowing fluid to be transferred from the reservoirs to the microfabricated particle sorting structures. The plurality of particle sorting structures may be arranged in the disposable cartridge in order to perform multiple separation operations, such as a sequential or parallel sorting operation.

Innovative Micro Technology | Date: 2012-02-08

A wafer bonding chamber is disclosed, which maintains two wafers to be bonded together at two substantially different temperatures. A lid wafer may be held at a higher temperature than a device wafer, as the device wafer may have delicate structures formed thereon, which cannot withstand higher temperatures. The lid wafer may have an adhesive bonding material formed thereon, which is melted or cured at the higher temperature. The temperature differential may be maintained by applying at least one of a heating mechanism and a cooling mechanism preferentially to one of the wafers to be bonded in the wafer bonding chamber.

Innovative Micro Technology | Date: 2014-03-02

Systems and methods for forming an encapsulated device include a substantially hermetic seal which seals a device in an environment between two substrates. The substantially hermetic seal is formed by an alloy of two metal layers, one having a lower melting temperature than the other. The metal layers may be deposited two substrates, along with a raised feature formed under at least one of the metal layers. The two metals may form an alloy of a predefined stoichiometry in at least two locations on either side of the midpoint of the raised feature. The formation of the alloy may be improved by the use of an organic wetting layer adjacent to the lower melting temperature metal. Design guidelines are set forth for reducing or eliminating the leakage of molten metal into the areas adjacent to the bondlines.

Innovative Micro Technology | Date: 2014-01-19

A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.

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