Infineon Technologies AG is a German semiconductor manufacturer founded on 1 April 1999, when the semiconductor operations of the parent company Siemens AG were spun off to form a separate legal entity. As of 30 September 2013, Infineon has 26,725 employees worldwide. In fiscal year 2013, the company achieved sales of €3.843 billion.On 1 May 2006, Infineon's Memory Products division was carved out as a distinct company called Qimonda AG, which at its height employed about 13,500 people worldwide. Qimonda was listed on the New York Stock Exchange until 2009. Wikipedia.
Infineon Technologies | Date: 2017-03-01
A sensor device (10) comprises an implantable sensor unit (100), a transponder unit (200), and a wired connection (300) flexibly and electrically connecting the implantable sensor unit (100) and the transponder unit (200). The implantable sensor unit (100) is adapted to be implanted into a body. The implantable sensor unit (100) comprises a comparator (120) and a sensor adapted to sense a characteristic of the body in vivo. The sensor is adapted to supply an analogue signal to a first input (120a) of the comparator (120). The transponder unit (200) is adapted to supply a control signal to the implantable sensor unit (100) and to receive an output signal of the comparator (120). The implantable sensor unit (100) is adapted to supply an analogue approximation signal to a second input (120b) of the comparator (120) in response to the control signal. The wired connection (300) is adapted to transmit the control signal and the output signal of the comparator (120).
Infineon Technologies | Date: 2017-04-19
A localization system (1) includes an animal transceiver (10) and a floor transceiver circuit (40). The animal transceiver (10) is configured to be fixed to an animal (20) to transceive a radio frequency signal. The floor transceiver circuit (40) is arranged on a floor surface (30) and configured to determine a position of the animal transceiver within the floor surface on the basis of the radio frequency signal received from the animal transceiver (10). An animal cage (50) includes a cage configured to accommodate an animal (20), and the localization system (1).
Agency: European Commission | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-02-2014 | Award Amount: 87.61M | Year: 2015
The key objective of PowerBase Enhanced substrates and GaN pilot lines enabling compact power applications is to ensure the availability of Electronic Components and Systems (ECS) for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of the technology development, bridging the gap between research and exploitation, creating economic and employment growth in the European Union. The project PowerBase aims to contribute to the industrial ambition of value creation in Europe and fully supports this vision by addressing key topics of ECSEL multi annual strategic plan 2014. By positioning PowerBase as innovation action a clear focus on exploitation of the expected result is primary goal. To expand the limits in current power semiconductor technologies the project focuses on setting up a qualified wide band gap GaN technology Pilot line, on expanding the limits of todays silicon based substrate materials for power semiconductors, improving manufacturing efficiency by innovative automation, setting up of a GaN compatible chip embedding pilot line and demonstrating innovation potential in leading compact power application domains. PowerBase is a project proposal with a vertical supply chain involved with contributions from partners in 7 European countries. This spans expertise from raw material research, process innovation, pilot line, assembly innovation and pilot line up to various application domains representing enhanced smart systems. The supporting partners consist of market leaders in their domain, having excellent technological background, which are fully committed to achieve the very challenging project goals. The project PowerBase aims to have significant impact on mart regions. High tech jobs in the area of semiconductor technologies and micro/nano electronics in general are expressed core competences of the regions Austria: Carinthia, Styria, Germany: Sachsen, Bavaria and many other countries/ regions involved.
Agency: European Commission | Branch: H2020 | Program: SGA-RIA | Phase: FETFLAGSHIP | Award Amount: 89.00M | Year: 2016
This project is the second in the series of EC-financed parts of the Graphene Flagship. The Graphene Flagship is a 10 year research and innovation endeavour with a total project cost of 1,000,000,000 euros, funded jointly by the European Commission and member states and associated countries. The first part of the Flagship was a 30-month Collaborative Project, Coordination and Support Action (CP-CSA) under the 7th framework program (2013-2016), while this and the following parts are implemented as Core Projects under the Horizon 2020 framework. The mission of the Graphene Flagship is to take graphene and related layered materials from a state of raw potential to a point where they can revolutionise multiple industries. This will bring a new dimension to future technology a faster, thinner, stronger, flexible, and broadband revolution. Our program will put Europe firmly at the heart of the process, with a manifold return on the EU investment, both in terms of technological innovation and economic growth. To realise this vision, we have brought together a larger European consortium with about 150 partners in 23 countries. The partners represent academia, research institutes and industries, which work closely together in 15 technical work packages and five supporting work packages covering the entire value chain from materials to components and systems. As time progresses, the centre of gravity of the Flagship moves towards applications, which is reflected in the increasing importance of the higher - system - levels of the value chain. In this first core project the main focus is on components and initial system level tasks. The first core project is divided into 4 divisions, which in turn comprise 3 to 5 work packages on related topics. A fifth, external division acts as a link to the parts of the Flagship that are funded by the member states and associated countries, or by other funding sources. This creates a collaborative framework for the entire Flagship.
Agency: European Commission | Branch: H2020 | Program: ECSEL-RIA | Phase: ECSEL-07-2015 | Award Amount: 20.53M | Year: 2016
Embedded systems have significantly increased in technical complexity towards open, interconnected systems. This has exacerbated the problem of ensuring dependability in the presence of human, environmental and technological risks. The rise of complex Cyber-Physical Systems (CPS) has led to many initiatives to promote reuse and automation of labor-intensive activities. Two large-scale projects are OPENCOSS and SafeCer, which dealt with assurance and certification of software-intensive critical systems using incremental and model-based approaches. OPENCOSS defined a Common Certification Language (CCL), unifying concepts from different industries to build a harmonized approach to reduce time and cost overheads, via facilitating the reuse of certification assets. SafeCer developed safety-oriented process lines, a component model, contract-based verification techniques, and process/product-based model-driven safety certification for compositional development and certification of CPSs. AMASS will create and consolidate a de-facto European-wide assurance and certification open tool platform, ecosystem and self-sustainable community spanning the largest CPS vertical markets. We will start by combining and evolving the OPENCOSS and SafeCer technological solutions towards end-user validated tools, and will enhance and perform further research into new areas not covered by those projects. The ultimate aim is to lower certification costs in face of rapidly changing product features and market needs. This will be achieved by establishing a novel holistic and reuse-oriented approach for architecture-driven assurance (fully compatible with standards e.g. AUTOSAR and IMA), multi-concern assurance (compliance demonstration, impact analyses, and compositional assurance of security and safety aspects), and for seamless interoperability between assurance/certification and engineering activities along with third-party activities (external assessments, supplier assurance).
Agency: European Commission | Branch: H2020 | Program: ECSEL-RIA | Phase: ECSEL-01-2014 | Award Amount: 52.90M | Year: 2015
The 3Ccar project will provide highly integrated ECS Components for Complexity Control in thereby affordable electrified cars. The new semiconductors for Complexity management (Control, reduction) will offer the next level of energy efficiency in transportation systems. 3Ccars impact is maximizing pragmatic strategy: Use semiconductor technology innovations to manage functionality & complexity increase. This leads also to cheaper, efficient, robust, comfortable, reliable and usable automotive systems. This strengthens Europe as a whole (OEM, Tier1, Semiconductor) generating economic growth and new jobs in Europe. The impact of 3Ccar is driven vertically by innovations and horizontally enabling growth and deployment in the industry based on what we see as European Values. We recognized that European engineers develop for highest efficiency, convergence and manageable complexity. Our society appreciates long life products to avoid waste. 50 partners and 55 Mio budget give the mass for innovative products such as functional integrated powertrains, smart battery cells with unique selling features allowing Europe to advance to global leadership. An important feature of the project has been the recognition and exploitation of synergies with other EV projects, enabling fast innovation cycles between such aligned projects. With 55 Mio budget and 10 b impact the R&D expenditure ratio is 200 which is 10x higher than the semiconductor average and corresponds to very strong innovation potential which will be translated into automotive and semiconductor industry. The technologies developed in 3Ccar will be commercialized all over the world while giving advantages to Europes OEMs willing to manufacture in Europe. 3Ccar will be involved in standardization needed to ensure that large vertical supply chains can be established. The 3Ccar project shows that collaboration between industry, research institutes, governments and customers is pivotal for excellence in Europe.
Agency: European Commission | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-14-2015 | Award Amount: 61.99M | Year: 2016
Addressing European Policies for 2020 and beyond the Power Semiconductor and Electronics Manufacturing 4.0 (SemI40) project responds to the urgent need of increasing the competitiveness of the Semiconductor manufacturing industry in Europe through establishing smart, sustainable, and integrated ECS manufacturing. SemI40 will further pave the way for serving highly innovative electronic markets with products powered by microelectronics Made in Europe. Positioned as an Innovation Action it is the high ambition of SemI40 to implement technical solutions on TRL level 4-8 into the pilot lines of the industry partners. Challenging use cases will be implemented in real manufacturing environment considering also their technical, social and economic impact to the society, future working conditions and skills needed. Applying Industry 4.0, Big Data, and Industrial Internet technologies in the electronics field requires holistic and complex actions. The selected main objectives of SemI40 covered by the MASP2015 are: balancing system security and production flexibility, increase information transparency between fields and enterprise resource planning (ERP), manage critical knowledge for improved decision making and maintenance, improve fab digitalization and virtualization, and enable automation systems for agile distributed production. SemI40s value chain oriented consortium consists of 37 project partners from 5 European countries. SemI40 involves a vertical and horizontal supply chain and spans expertise and partners from raw material research, process and assembly innovation and pilot line, up to various application domains representing enhanced smart systems. Through advancing manufacturing of electronic components and systems, SemI40 contributes to safeguard more than 20.000 jobs of people directly employed in the participating facilities, and in total more than 300.000 jobs of people employed at all industry partners facilities worldwide.
Agency: European Commission | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-15-2015 | Award Amount: 65.27M | Year: 2016
The EU has set the stage to empower semiconductor manufacturing in Europe being one of the key drivers for innovation and employment and creator for answers to the challenges of the modern society. Aim of IoSense is to boost the European competitiveness of ECS industries by increasing the pilot production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establishing three fully connected semiconductor pilot lines in Europe: two 200mm frontend (Dresden and Regensburg) and one backend (Regensburg) lines networking with existing highly specialized manufacturing lines. Focus is the availability of top innovative, competitive sensors and sensor systems Made in Europe for applications in Smart Mobility, Society, Energy, Health and Production. Today competitors are already involved in the development of sensor systems for applications in the emerging Internet of Things. But there is a significant gap between those forces and the capabilities to bring ideas into the high volume market fast enough. IoSense will close this gap by providing three modular flexible pilot lines being seamless integrated in the IoT value crating networks and ready to manufacture each kind of sensor system prototypes. IoSense will increase the manufacturing capacity of sensor/MEMS components in the involved pilot lines by factor of 10 while reducing manufacturing cost and time by 30%. IoSense is designed to enable focused development work on technological and application oriented tasks combining with market orientation. Design to Market Needs will be accomplished by customer involvement, embedding all required functionality besides sensors. Finally, the time for idea-to-market for new sensor systems is intended to be brought down to less than one year. As a result, semiconductor manufacturing will get a new boost in Europe enabling the industry with competitive solutions, securing employment and providing answers to the upcoming challenges in the IoT era.
Agency: European Commission | Branch: H2020 | Program: MSCA-ITN-ETN | Phase: MSCA-ITN-2015-ETN | Award Amount: 3.83M | Year: 2016
The main target of the ITEAM project is to establish and sustainably maintain the European training network with high grade of interdisciplinarity, which will train strong specialists skilled in research and development of novel technologies in the field of multi-actuated ground vehicles (MAGV). The global goals are: (i) Advance of European postgraduate education in the area of environment- and user-friendly vehicle technologies that highly demanded by the European industry and society; (ii) Reinforcement of cooperation between academia and industry to improve career perspectives of talented graduates in both public and private sectors; (iii) Creation of strong European research and innovation group making determinant contributions to next generations of multi-actuated ground vehicles. To achieve the project objectives, the consortium unites 11 beneficiaries and 5 partner organizations from 9 European countries including 7 universities, 2 research centres, and 7 non-academic organizations. Distinctive feature of the ITEAM network is the concept of interaction of three research clusters: MAGV integration, Green MAGV, MAGV Driving Environment. Within these clusters, the training concept will be based on intersectoral cooperation and will cover domains of (i) basic research, (ii) applied research, and (iii) experimentations. The ITEAM project will provide the first-of-its kind European training network in Ground Vehicles at doctorate level to fill up the niche in private sector and industry with researcher-practitioners. The proposed network will be developed as innovative, multidisciplinary, engineering product-oriented and project-based program to train the scientists by integrating cutting-edge research methods of ground vehicles, electric/mechatronic systems, environmental engineering and applied intelligent control. The ITEAM network measures will guarantee excellent career prospects for participating researchers both in industrial and academic sectors.
Agency: European Commission | Branch: H2020 | Program: CSA | Phase: ICT-03-2016 | Award Amount: 1.50M | Year: 2017
The objective of the proposed CSA is to support and complement R&I activities in Smart Systems Integration (SSI) by structuring industrial cooperation and facilitating end-user adoption for the next generations of miniaturised smart objects and systems. Previous CSAs have revealed the immense breadth of SSI in its technology demands, its application sectors, its business ramifications, its provider and user communities, and have commenced the task of joining all these aspects for concerted action. They have also developed support tools, whose proven value can continue to be instrumental in the new CSA. Building on the above and supporting the strategic activities of EPoSS, the role for inSSIght is to deepen and implant this understanding through a cadre of influential partners from SSI-related clusters, research institutes and industries who will define and encourage actions to unlock and exploit innovation opportunities, provide practice-oriented support to the SSI ecosystem, underline the vital position of SSI as a Key Enabling Technology for competitive advantage and future innovation, and give credit to their enabling role as building blocks in sectors with high potential for growth and high return on investment, such as IoT, Industry 4.0, electric mobility, automated driving, smart medical devices etc. Very practically, inSSIght organises 4 thematic conferences, two of which on MNBS, 7 demonstration sessions, 2 brokerage events, 11 expert and information workshops and 11 webinars publishes 5 White Papers on Customised Innovation Priorities leads a marketing campaign for SSI based on a trademark inSSIght addresses all 5 activities required in the scope description of ICT-03-2016b, considering them as inseparable and most efficiently tackled in a single concerted action.