Robinson, NY, United States
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Sandy-Smith B.,Indium Corporation
2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017 | Year: 2017

There are several methods accepted by the industry for determining the electrochemical reliability for electronic assemblies. These methods are typically designed to either simulate humid environments in accelerated lifetime testing, or assess the species of ionic residues present on surfaces. Some can be used to test prototypes or test boards; others are more applicable for quality and consistency testing in a production environment. The increasing complexity of high density assemblies, along with low standoff components, imposes greater associated challenges related to assessing electrochemical reliability. This has led to development and adoption of new methods for testing ionic residues that can lead to electrochemical migration. This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies, including surface insulation resistance, electrochemical migration, ROSE extraction, and other emerging test methods. Data will be shared showing how different methods can detect process variations in different ways, results will be compared. © 2017 SMTA.


This report studies Thermal Interface Materials (TIM) in Global Market, especially in North America, Europe, China, Japan, Southeast Asia and India, focuses on top manufacturers in global market, with capacity, production, price, revenue and market share for each manufacturer, covering  Dow Corning  Henkel  Honeywell International  LairdTech  Aavid Thermalloy  Indium Corporation  Parker Chomerics  Zalman Tech  Momentive  3M  Arctic Silver  Wakefield-Vette  Lord Corporation  Stockwell Elastomerics  Shin-Etsu Cmemical  Ai Technology  Akasa Thermal Solution  AOS Thermal Compounds  Ametek Specialty Metal Products  Enerdyne Solutions  Master Bond  Market Segment by Regions, this report splits Global into several key Regions, with production, consumption, revenue, market share and growth rate of Thermal Interface Materials (TIM) in these regions, from 2011 to 2021 (forecast), like  North America  Europe  China  Japan  Southeast Asia  India  Split by product type, with production, revenue, price, market share and growth rate of each type, can be divided into  Polymer-based TIM  PC(phase change) TIM  Metal-based TIM  Split by application, this report focuses on consumption, market share and growth rate of Thermal Interface Materials (TIM) in each application, can be divided into  Consumer Electronics  Telecom  Medical Devices  Industrial Machinery  Consumer Durables  Automotive Electronics  Others Global Thermal Interface Materials (TIM) Market Research Report 2016  1 Thermal Interface Materials (TIM) Market Overview  1.1 Product Overview and Scope of Thermal Interface Materials (TIM)  1.2 Thermal Interface Materials (TIM) Segment by Type  1.2.1 Global Production Market Share of Thermal Interface Materials (TIM) by Type in 2015 1.2.2 Polymer-based TIM  1.2.3 PC(phase change) TIM  1.2.4 Metal-based TIM  1.3 Thermal Interface Materials (TIM) Segment by Application  1.3.1 Thermal Interface Materials (TIM) Consumption Market Share by Application in 2015  1.3.2 Consumer Electronics  1.3.3 Telecom  1.3.4 Medical Devices  1.3.5 Industrial Machinery  1.3.6 Consumer Durables  1.3.7 Automotive Electronics  1.3.8 Others  1.4 Thermal Interface Materials (TIM) Market by Region  1.4.1 North America Status and Prospect (2011-2021)  1.4.2 Europe Status and Prospect (2011-2021)  1.4.3 China Status and Prospect (2011-2021)  1.4.4 Japan Status and Prospect (2011-2021)  1.4.5 Southeast Asia Status and Prospect (2011-2021)  1.4.6 India Status and Prospect (2011-2021)  1.5 Global Market Size (Value) of Thermal Interface Materials (TIM) (2011-2021) 2 Global Thermal Interface Materials (TIM) Market Competition by Manufacturers  2.1 Global Thermal Interface Materials (TIM) Capacity, Production and Share by Manufacturers (2015 and 2016)  2.2 Global Thermal Interface Materials (TIM) Revenue and Share by Manufacturers (2015 and 2016)  2.3 Global Thermal Interface Materials (TIM) Average Price by Manufacturers (2015 and 2016)  2.4 Manufacturers Thermal Interface Materials (TIM) Manufacturing Base Distribution, Sales Area and Product Type  2.5 Thermal Interface Materials (TIM) Market Competitive Situation and Trends  2.5.1 Thermal Interface Materials (TIM) Market Concentration Rate  2.5.2 Thermal Interface Materials (TIM) Market Share of Top 3 and Top 5 Manufacturers  2.5.3 Mergers & Acquisitions, Expansion 3 Global Thermal Interface Materials (TIM) Capacity, Production, Revenue (Value) by Region (2011-2016)  3.1 Global Thermal Interface Materials (TIM) Capacity and Market Share by Region (2011-2016)  3.2 Global Thermal Interface Materials (TIM) Production and Market Share by Region (2011-2016)  3.3 Global Thermal Interface Materials (TIM) Revenue (Value) and Market Share by Region (2011-2016)  3.4 Global Thermal Interface Materials (TIM) Capacity, Production, Revenue, Price and Gross Margin (2011-2016)  3.5 North America Thermal Interface Materials (TIM) Capacity, Production, Revenue, Price and Gross Margin (2011-2016)  3.6 Europe Thermal Interface Materials (TIM) Capacity, Production, Revenue, Price and Gross Margin (2011-2016)  3.7 China Thermal Interface Materials (TIM) Capacity, Production, Revenue, Price and Gross Margin (2011-2016)  3.8 Japan Thermal Interface Materials (TIM) Capacity, Production, Revenue, Price and Gross Margin (2011-2016)  3.9 Southeast Asia Thermal Interface Materials (TIM) Capacity, Production, Revenue, Price and Gross Margin (2011-2016)  3.10 India Thermal Interface Materials (TIM) Capacity, Production, Revenue, Price and Gross Margin (2011-2016) 4 Global Thermal Interface Materials (TIM) Supply (Production), Consumption, Export, Import by Regions (2011-2016)  4.1 Global Thermal Interface Materials (TIM) Consumption by Regions (2011-2016)  4.2 North America Thermal Interface Materials (TIM) Production, Consumption, Export, Import by Regions (2011-2016)  4.3 Europe Thermal Interface Materials (TIM) Production, Consumption, Export, Import by Regions (2011-2016)  4.4 China Thermal Interface Materials (TIM) Production, Consumption, Export, Import by Regions (2011-2016)  4.5 Japan Thermal Interface Materials (TIM) Production, Consumption, Export, Import by Regions (2011-2016)  4.6 Southeast Asia Thermal Interface Materials (TIM) Production, Consumption, Export, Import by Regions (2011-2016)  4.7 India Thermal Interface Materials (TIM) Production, Consumption, Export, Import by Regions (2011-2016) For more information or any query mail at [email protected]


News Article | December 1, 2016
Site: www.newsmaker.com.au

The report "Thermal Interface Materials Market by Type (Greases & adhesives, Tapes & Films, Gap Fillers, Metal-Based TIMs, and Phase Change Materials), Application (Computers, Telecom, Medical Devices, Automotive Electronics), and Region - Global Forecast to 2021", The global thermal interface materials (TIMs) market is projected to reach USD 2.33 Billion at a CAGR of 11.2%. This growth is fueled by the growing electronics & telecom industry, rising development strategies, and growing application sectors, globally. Browse 68 market data Tables and 58 Figures spread through 138 Pages and in-depth TOC on "Thermal Interface Materials Market - Global Forecast to 2021" http://www.marketsandmarkets.com/Market-Reports/thermal-interface-material-market-13483121.html Greases & Adhesives: The largest type of TIMs Greases & adhesives is the largest segment of TIMs market by type. OEMs prefer to use greases & adhesives because of their flowability and ability to reduce a wide range of surface roughness of any housing, heat spreader, or heat sink surface. Thermal greases & adhesives have other competitive advantages such as low cost, reworkability, low thermal resistance, and the ability to form ultra-thin bond lines. The manufacturing costs of greases & adhesives are comparatively lower, as these materials do not need to be coated and cured into a sheet and to cut into a shape. TIMs are commonly used for transferring thermal conductivity from CPUs or GPUs to the heat sink coolers. Computer components, such as CPUs, chipsets, graphics cards, and hard disk drives are susceptible to failure in case of overheating. TIMs are used in computers for removing the excess heat produced by computer components to maintain the components’ operating temperature limits. TIMs are used for improving the heat flow in computers by filling any voids or irregularities between the heat sink and SSE base plate mounting surfaces. The use of TIMs in computers is growing at a high rate because of the increased demand for cloud and supercomputing. The increased demand for supercomputing is driving the market for TIMs. Asia-Pacific dominates the TIMs market, in terms of value and volume, and the trend is expected to continue until 2021. Countries in this region such as China, India, Japan, South Korea, and Indonesia are witnessing significant increase in the use of TIMs in electronics & telecom applications. This growth is mainly backed by the increasing demand from the consumer electronics and telecom industries in Asia-Pacific. In addition, rapid industrial development in the region increasing the demand for TIMs in electronics and telecom applications. Indonesia and India are the fastest-growing markets in the region and are expected to follow a similar trend until 2021. The TIMs market has a few numbers of global players competing significantly for their market share. These market players are actively investing in various strategies such as new product developments and expansions to increase their market share. In addition, companies are investing heavily in R&D activities. Major players such as Henkel Corporation (U.S.), Bergquist Company (U.S.), Indium Corporation (U.S.), Parker Chomerics (U.S.), Dow Corning (U.S.), Laird Technologies (U.S.), Momentive Performance Materials Inc. (U.S.), and Zalman Tech Co., Ltd. (South Korea) have adopted various organic developmental strategies.


News Article | December 2, 2016
Site: www.newsmaker.com.au

Wiseguyreports.Com Adds “Thermal Interface Portion of Heat Sink -Market Demand, Growth, Opportunities and analysis of Top Key Player Forecast to 2021” To Its Research Database This report studies Thermal Interface Portion of Heat Sink in Global market, especially in North America, Europe, China, Japan, Southeast Asia and India, with production, revenue, consumption, import and export in these regions, from 2011 to 2015, and forecast to 2021. This report focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering By types, the market can be split into Polymer-based TIM PC(phase change) TIM Metal-based TIM By Application, the market can be split into Heat sink Others Application 3 By Regions, this report covers (we can add the regions/countries as you want) North America China Europe Southeast Asia Japan India Global Thermal Interface Portion of Heat Sink Market Professional Survey Report 2016 1 Industry Overview of Thermal Interface Portion of Heat Sink 1.1 Definition and Specifications of Thermal Interface Portion of Heat Sink 1.1.1 Definition of Thermal Interface Portion of Heat Sink 1.1.2 Specifications of Thermal Interface Portion of Heat Sink 1.2 Classification of Thermal Interface Portion of Heat Sink 1.2.1 Polymer-based TIM 1.2.2 PC(phase change) TIM 1.2.3 Metal-based TIM 1.3 Applications of Thermal Interface Portion of Heat Sink 1.3.1 Heat sink 1.3.2 Others 1.3.3 Application 3 1.4 Market Segment by Regions 1.4.1 North America 1.4.2 China 1.4.3 Europe 1.4.4 Southeast Asia 1.4.5 Japan 1.4.6 India 8 Major Manufacturers Analysis of Thermal Interface Portion of Heat Sink 8.1 Dow Corning 8.1.1 Company Profile 8.1.2 Product Picture and Specifications 8.1.2.1 Type I 8.1.2.2 Type II 8.1.2.3 Type III 8.1.3 Dow Corning 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.1.4 Dow Corning 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.2 Henkel 8.2.1 Company Profile 8.2.2 Product Picture and Specifications 8.2.2.1 Type I 8.2.2.2 Type II 8.2.2.3 Type III 8.2.3 Henkel 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.2.4 Henkel 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.3 Honeywell International 8.3.1 Company Profile 8.3.2 Product Picture and Specifications 8.3.2.1 Type I 8.3.2.2 Type II 8.3.2.3 Type III 8.3.3 Honeywell International 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.3.4 Honeywell International 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.4 LairdTech 8.4.1 Company Profile 8.4.2 Product Picture and Specifications 8.4.2.1 Type I 8.4.2.2 Type II 8.4.2.3 Type III 8.4.3 LairdTech 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.4.4 LairdTech 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.5 Aavid Thermalloy 8.5.1 Company Profile 8.5.2 Product Picture and Specifications 8.5.2.1 Type I 8.5.2.2 Type II 8.5.2.3 Type III 8.5.3 Aavid Thermalloy 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.5.4 Aavid Thermalloy 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.6 Indium Corporation 8.6.1 Company Profile 8.6.2 Product Picture and Specifications 8.6.2.1 Type I 8.6.2.2 Type II 8.6.2.3 Type III 8.6.3 Indium Corporation 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.6.4 Indium Corporation 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.7 Parker Chomerics 8.7.1 Company Profile 8.7.2 Product Picture and Specifications 8.7.2.1 Type I 8.7.2.2 Type II 8.7.2.3 Type III 8.7.3 Parker Chomerics 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.7.4 Parker Chomerics 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.8 Zalman Tech 8.8.1 Company Profile 8.8.2 Product Picture and Specifications 8.8.2.1 Type I 8.8.2.2 Type II 8.8.2.3 Type III 8.8.3 Zalman Tech 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.8.4 Zalman Tech 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.9 Momentive 8.9.1 Company Profile 8.9.2 Product Picture and Specifications 8.9.2.1 Type I 8.9.2.2 Type II 8.9.2.3 Type III 8.9.3 Momentive 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.9.4 Momentive 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.10 3M 8.10.1 Company Profile 8.10.2 Product Picture and Specifications 8.10.2.1 Type I 8.10.2.2 Type II 8.10.2.3 Type III 8.10.3 3M 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.10.4 3M 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.11 Arctic Silver 8.11.1 Company Profile 8.11.2 Product Picture and Specifications 8.11.2.1 Type I 8.11.2.2 Type II 8.11.2.3 Type III 8.11.3 Arctic Silver 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.11.4 Arctic Silver 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.12 Wakefield-Vette 8.12.1 Company Profile 8.12.2 Product Picture and Specifications 8.12.2.1 Type I 8.12.2.2 Type II 8.12.2.3 Type III 8.12.3 Wakefield-Vette 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.12.4 Wakefield-Vette 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.13 Lord Corporation 8.13.1 Company Profile 8.13.2 Product Picture and Specifications 8.13.2.1 Type I 8.13.2.2 Type II 8.13.2.3 Type III 8.13.3 Lord Corporation 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.13.4 Lord Corporation 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.14 Stockwell Elastomerics 8.14.1 Company Profile 8.14.2 Product Picture and Specifications 8.14.2.1 Type I 8.14.2.2 Type II 8.14.2.3 Type III 8.14.3 Stockwell Elastomerics 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.14.4 Stockwell Elastomerics 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.15 Shin-Etsu Cmemical 8.15.1 Company Profile 8.15.2 Product Picture and Specifications 8.15.2.1 Type I 8.15.2.2 Type II 8.15.2.3 Type III 8.15.3 Shin-Etsu Cmemical 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.15.4 Shin-Etsu Cmemical 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.16 Ai Technology 8.16.1 Company Profile 8.16.2 Product Picture and Specifications 8.16.2.1 Type I 8.16.2.2 Type II 8.16.2.3 Type III 8.16.3 Ai Technology 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.16.4 Ai Technology 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.17 Akasa Thermal Solution 8.17.1 Company Profile 8.17.2 Product Picture and Specifications 8.17.2.1 Type I 8.17.2.2 Type II 8.17.2.3 Type III 8.17.3 Akasa Thermal Solution 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.17.4 Akasa Thermal Solution 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.18 AOS Thermal Compounds 8.18.1 Company Profile 8.18.2 Product Picture and Specifications 8.18.2.1 Type I 8.18.2.2 Type II 8.18.2.3 Type III 8.18.3 AOS Thermal Compounds 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.18.4 AOS Thermal Compounds 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.19 Ametek Specialty Metal Products 8.19.1 Company Profile 8.19.2 Product Picture and Specifications 8.19.2.1 Type I 8.19.2.2 Type II 8.19.2.3 Type III 8.19.3 Ametek Specialty Metal Products 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.19.4 Ametek Specialty Metal Products 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.20 Enerdyne Solutions 8.20.1 Company Profile 8.20.2 Product Picture and Specifications 8.20.2.1 Type I 8.20.2.2 Type II 8.20.2.3 Type III 8.20.3 Enerdyne Solutions 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.20.4 Enerdyne Solutions 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.21 Master Bond


A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics. An additive selected from 0.1-2.5 wt. % of Bi and/or 0.1-4.5 wt. % of In may be included in the solder alloy.


Patent
Indium Corporation | Date: 2015-03-10

A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260 C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250 C. In another implementation, the solder paste consists of an amount of a first solder alloy powder between 44 wt % and 87 wt %; an amount of a second solder alloy powder between 13 wt % and 48 wt %; and flux.


Patent
Indium Corporation | Date: 2015-02-23

A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260 C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250 C.


Methods of forming solder bumps or joints using a radiation curable, thermal curable solder flux, or dual curable solder flux are disclosed. The method includes applying a liquid solder flux that is radiation curable or thermal curable to a substrate such that the solder flux covers contact pads on the substrate; placing solder balls on the contacts pads covered with the radiation curable or thermal curable solder flux; heating the substrate to join the solder balls to the contact pads, thereby forming solder bumps or solder joints; and curing the liquid solder flux by applying radiation or heat to the substrate, thereby forming a solid film. The solder flux includes radiation curable, thermally curable, or dual curable materials that aid formation of solder bumps or joints before the solder flux is cured; and are curable to form a solid material by the application of radiation or heat.


Patent
Indium Corporation | Date: 2014-01-16

Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.


Patent
Indium Corporation | Date: 2015-08-24

Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the component placement. The solder preform can be configured with a geometry such that it creates a standoff, or gap, between the components to be mounted in the solder paste. The method includes receiving a printed circuit board comprising a plurality of contact pads; depositing a volume of solder paste onto each of the plurality of contact pads; depositing a solder preform into each volume of solder paste; placing electronic components onto the printed circuit board such that contacts of the electronic components are aligned with corresponding contact pads of the printed circuit board; and reflow soldering the electronic components to the printed circuit board.

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