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Methods of forming solder bumps or joints using a radiation curable, thermal curable solder flux, or dual curable solder flux are disclosed. The method includes applying a liquid solder flux 130 that is radiation curable or thermal curable to a substrate 110 such that the solder flux covers contact padsl20 on the substrate; placing solder balls 140 on the contacts pads covered with the radiation curable or thermal curable solder flux; heating the substrate to join the solder balls to the contact pads, thereby forming solder bumps or solder joints 150; and curing the liquid solder flux by applying radiation or heat to the substrate, thereby forming a solid film 160. The solder flux includes radiation curable, thermally curable, or dual curable materials that aid formation of solder bumps or joints before the solder flux is cured; and are curable to form a solid material by the application of radiation or heat.


News Article | July 14, 2017
Site: www.prnewswire.com

Visiongain's new 161 page report assesses that the global electronic adhesives market will reach $4.77 billion in 2017. Are you involved in the Electronic Adhesives Market or need to understand its market dynamics? If so, then you must read this report Download the full report: https://www.reportbuyer.com/product/4671986/ It's vital that you keep your knowledge up to date. You need this report. Market scope: This brand new report from visiongain is a completely independent and fresh market assessment of the electronic adhesives market based upon the latest information. Our new market study contains forecasts, original analysis, company profiles and, most crucially, fresh conclusions. The report not only gives detailed forecasts and analysis of electronic adhesives markets by region but also by end-use sectors. The Electronic Adhesives Market Report 2017-2027 report responds to your need for definitive market data: - Where are the Electronic Adhesives market opportunities? - 139 tables, charts, and graphs reveal market data allowing you to target your strategy more effectively - When will the Electronic Adhesives market grow? - Global, national and electronic adhesives submarket forecasts and analysis from 2017-2027 illustrate the market progression - Which Electronic Adhesives submarkets will flourish from 2017-2027? By form (Volume (KT & market value ($m)) - Liquid Form Submarket Forecast 2017-2027 - Paste Form Submarket Forecast 2017-2027 - Solid Form Submarket Forecast 2017-2027 By type (Volume (KT & market value ($m)) - Electrically Conductive Adhesives Submarket Forecast 2017-2027 - Thermal Conductive Adhesives Submarket Forecast 2017-2027 - UV Curing Adhesives Submarket Forecast 2017-2027 - Other Electronic Adhesives Submarket Forecast 2017-2027 By Application (Volume (KT & market value ($m)) - Printed Circuit Boards Submarket Forecast 2017-2027 - Semiconductor and IC Submarket Forecast 2017-2027 Where are the regional Electronic Adhesives market opportunities from 2017-2027? Asia Pacific forecast 2017-2027 - China forecast 2017-2027 - Taiwan forecast 2017-2027 - Japan forecast 2017-2027 - South Korea forecast 2017-2027 - India forecast 2017-2027 - Rest of APAC forecast 2017-2027 North America forecast 2017-2027 - U.S. forecast 2017-2027 - Canada forecast 2017-2027 - Mexico forecast 2017-2027 Europe forecast 2017-2027 - Germany forecast 2017-2027 - France forecast 2017-2027 - The U.K. forecast 2017-2027 - Rest of the Europe forecast 2017-2027 Rest of the world forecast 2017-2027 - Brazil forecast 2017-2027 - Other Countries forecast 2017-2027 What are the factors influencing Electronic Adhesives market dynamics? - SWOT analysis explores the factors. - Research and development (R&D) strategy - Supply and demand dynamics - Advances in product quality Who are the leading 10 Electronic Adhesives companies? - We profile the leading players, their competitive positioning, capabilities, product portfolios, R&D activity, services, focus, strategies, M&A activity, and future outlook. - Alent PLC - BASF SE - Henkel AG & Co. KGaA - Indium Corporation - Kyocera Chemical Corporation - LG Chemicals Ltd. - Mitsui Chemicals - The Dow Chemical Company - The 3M Company Who should read this report? - Anyone within the Electronic Adhesives value chain, including - Consumer electronics companies - Electronic component suppliers - Telecommunication companies - Computer manufacturers - Defence companies - Automotive companies - Chemical companies - R&D specialists - CEO's - COO's - CIO's - Business development managers - Marketing managers - Technologists - Investors - Banks - Government agencies - Contractors Download the full report: https://www.reportbuyer.com/product/4671986/ About Reportbuyer Reportbuyer is a leading industry intelligence solution that provides all market research reports from top publishers http://www.reportbuyer.com For more information: Sarah Smith Research Advisor at Reportbuyer.com Email: query@reportbuyer.com Tel: +44 208 816 85 48 Website: www.reportbuyer.com


News Article | December 2, 2016
Site: www.newsmaker.com.au

Wiseguyreports.Com Adds “Thermal Interface Portion of Heat Sink -Market Demand, Growth, Opportunities and analysis of Top Key Player Forecast to 2021” To Its Research Database This report studies Thermal Interface Portion of Heat Sink in Global market, especially in North America, Europe, China, Japan, Southeast Asia and India, with production, revenue, consumption, import and export in these regions, from 2011 to 2015, and forecast to 2021. This report focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering By types, the market can be split into Polymer-based TIM PC(phase change) TIM Metal-based TIM By Application, the market can be split into Heat sink Others Application 3 By Regions, this report covers (we can add the regions/countries as you want) North America China Europe Southeast Asia Japan India Global Thermal Interface Portion of Heat Sink Market Professional Survey Report 2016 1 Industry Overview of Thermal Interface Portion of Heat Sink 1.1 Definition and Specifications of Thermal Interface Portion of Heat Sink 1.1.1 Definition of Thermal Interface Portion of Heat Sink 1.1.2 Specifications of Thermal Interface Portion of Heat Sink 1.2 Classification of Thermal Interface Portion of Heat Sink 1.2.1 Polymer-based TIM 1.2.2 PC(phase change) TIM 1.2.3 Metal-based TIM 1.3 Applications of Thermal Interface Portion of Heat Sink 1.3.1 Heat sink 1.3.2 Others 1.3.3 Application 3 1.4 Market Segment by Regions 1.4.1 North America 1.4.2 China 1.4.3 Europe 1.4.4 Southeast Asia 1.4.5 Japan 1.4.6 India 8 Major Manufacturers Analysis of Thermal Interface Portion of Heat Sink 8.1 Dow Corning 8.1.1 Company Profile 8.1.2 Product Picture and Specifications 8.1.2.1 Type I 8.1.2.2 Type II 8.1.2.3 Type III 8.1.3 Dow Corning 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.1.4 Dow Corning 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.2 Henkel 8.2.1 Company Profile 8.2.2 Product Picture and Specifications 8.2.2.1 Type I 8.2.2.2 Type II 8.2.2.3 Type III 8.2.3 Henkel 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.2.4 Henkel 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.3 Honeywell International 8.3.1 Company Profile 8.3.2 Product Picture and Specifications 8.3.2.1 Type I 8.3.2.2 Type II 8.3.2.3 Type III 8.3.3 Honeywell International 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.3.4 Honeywell International 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.4 LairdTech 8.4.1 Company Profile 8.4.2 Product Picture and Specifications 8.4.2.1 Type I 8.4.2.2 Type II 8.4.2.3 Type III 8.4.3 LairdTech 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.4.4 LairdTech 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.5 Aavid Thermalloy 8.5.1 Company Profile 8.5.2 Product Picture and Specifications 8.5.2.1 Type I 8.5.2.2 Type II 8.5.2.3 Type III 8.5.3 Aavid Thermalloy 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.5.4 Aavid Thermalloy 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.6 Indium Corporation 8.6.1 Company Profile 8.6.2 Product Picture and Specifications 8.6.2.1 Type I 8.6.2.2 Type II 8.6.2.3 Type III 8.6.3 Indium Corporation 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.6.4 Indium Corporation 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.7 Parker Chomerics 8.7.1 Company Profile 8.7.2 Product Picture and Specifications 8.7.2.1 Type I 8.7.2.2 Type II 8.7.2.3 Type III 8.7.3 Parker Chomerics 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.7.4 Parker Chomerics 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.8 Zalman Tech 8.8.1 Company Profile 8.8.2 Product Picture and Specifications 8.8.2.1 Type I 8.8.2.2 Type II 8.8.2.3 Type III 8.8.3 Zalman Tech 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.8.4 Zalman Tech 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.9 Momentive 8.9.1 Company Profile 8.9.2 Product Picture and Specifications 8.9.2.1 Type I 8.9.2.2 Type II 8.9.2.3 Type III 8.9.3 Momentive 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.9.4 Momentive 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.10 3M 8.10.1 Company Profile 8.10.2 Product Picture and Specifications 8.10.2.1 Type I 8.10.2.2 Type II 8.10.2.3 Type III 8.10.3 3M 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.10.4 3M 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.11 Arctic Silver 8.11.1 Company Profile 8.11.2 Product Picture and Specifications 8.11.2.1 Type I 8.11.2.2 Type II 8.11.2.3 Type III 8.11.3 Arctic Silver 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.11.4 Arctic Silver 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.12 Wakefield-Vette 8.12.1 Company Profile 8.12.2 Product Picture and Specifications 8.12.2.1 Type I 8.12.2.2 Type II 8.12.2.3 Type III 8.12.3 Wakefield-Vette 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.12.4 Wakefield-Vette 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.13 Lord Corporation 8.13.1 Company Profile 8.13.2 Product Picture and Specifications 8.13.2.1 Type I 8.13.2.2 Type II 8.13.2.3 Type III 8.13.3 Lord Corporation 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.13.4 Lord Corporation 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.14 Stockwell Elastomerics 8.14.1 Company Profile 8.14.2 Product Picture and Specifications 8.14.2.1 Type I 8.14.2.2 Type II 8.14.2.3 Type III 8.14.3 Stockwell Elastomerics 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.14.4 Stockwell Elastomerics 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.15 Shin-Etsu Cmemical 8.15.1 Company Profile 8.15.2 Product Picture and Specifications 8.15.2.1 Type I 8.15.2.2 Type II 8.15.2.3 Type III 8.15.3 Shin-Etsu Cmemical 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.15.4 Shin-Etsu Cmemical 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.16 Ai Technology 8.16.1 Company Profile 8.16.2 Product Picture and Specifications 8.16.2.1 Type I 8.16.2.2 Type II 8.16.2.3 Type III 8.16.3 Ai Technology 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.16.4 Ai Technology 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.17 Akasa Thermal Solution 8.17.1 Company Profile 8.17.2 Product Picture and Specifications 8.17.2.1 Type I 8.17.2.2 Type II 8.17.2.3 Type III 8.17.3 Akasa Thermal Solution 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.17.4 Akasa Thermal Solution 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.18 AOS Thermal Compounds 8.18.1 Company Profile 8.18.2 Product Picture and Specifications 8.18.2.1 Type I 8.18.2.2 Type II 8.18.2.3 Type III 8.18.3 AOS Thermal Compounds 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.18.4 AOS Thermal Compounds 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.19 Ametek Specialty Metal Products 8.19.1 Company Profile 8.19.2 Product Picture and Specifications 8.19.2.1 Type I 8.19.2.2 Type II 8.19.2.3 Type III 8.19.3 Ametek Specialty Metal Products 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.19.4 Ametek Specialty Metal Products 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.20 Enerdyne Solutions 8.20.1 Company Profile 8.20.2 Product Picture and Specifications 8.20.2.1 Type I 8.20.2.2 Type II 8.20.2.3 Type III 8.20.3 Enerdyne Solutions 2015 Thermal Interface Portion of Heat Sink Sales, Ex-factory Price, Revenue, Gross Margin Analysis 8.20.4 Enerdyne Solutions 2015 Thermal Interface Portion of Heat Sink Business Region Distribution Analysis 8.21 Master Bond


News Article | December 1, 2016
Site: www.newsmaker.com.au

The report "Thermal Interface Materials Market by Type (Greases & adhesives, Tapes & Films, Gap Fillers, Metal-Based TIMs, and Phase Change Materials), Application (Computers, Telecom, Medical Devices, Automotive Electronics), and Region - Global Forecast to 2021", The global thermal interface materials (TIMs) market is projected to reach USD 2.33 Billion at a CAGR of 11.2%. This growth is fueled by the growing electronics & telecom industry, rising development strategies, and growing application sectors, globally. Browse 68 market data Tables and 58 Figures spread through 138 Pages and in-depth TOC on "Thermal Interface Materials Market - Global Forecast to 2021" http://www.marketsandmarkets.com/Market-Reports/thermal-interface-material-market-13483121.html Greases & Adhesives: The largest type of TIMs Greases & adhesives is the largest segment of TIMs market by type. OEMs prefer to use greases & adhesives because of their flowability and ability to reduce a wide range of surface roughness of any housing, heat spreader, or heat sink surface. Thermal greases & adhesives have other competitive advantages such as low cost, reworkability, low thermal resistance, and the ability to form ultra-thin bond lines. The manufacturing costs of greases & adhesives are comparatively lower, as these materials do not need to be coated and cured into a sheet and to cut into a shape. TIMs are commonly used for transferring thermal conductivity from CPUs or GPUs to the heat sink coolers. Computer components, such as CPUs, chipsets, graphics cards, and hard disk drives are susceptible to failure in case of overheating. TIMs are used in computers for removing the excess heat produced by computer components to maintain the components’ operating temperature limits. TIMs are used for improving the heat flow in computers by filling any voids or irregularities between the heat sink and SSE base plate mounting surfaces. The use of TIMs in computers is growing at a high rate because of the increased demand for cloud and supercomputing. The increased demand for supercomputing is driving the market for TIMs. Asia-Pacific dominates the TIMs market, in terms of value and volume, and the trend is expected to continue until 2021. Countries in this region such as China, India, Japan, South Korea, and Indonesia are witnessing significant increase in the use of TIMs in electronics & telecom applications. This growth is mainly backed by the increasing demand from the consumer electronics and telecom industries in Asia-Pacific. In addition, rapid industrial development in the region increasing the demand for TIMs in electronics and telecom applications. Indonesia and India are the fastest-growing markets in the region and are expected to follow a similar trend until 2021. The TIMs market has a few numbers of global players competing significantly for their market share. These market players are actively investing in various strategies such as new product developments and expansions to increase their market share. In addition, companies are investing heavily in R&D activities. Major players such as Henkel Corporation (U.S.), Bergquist Company (U.S.), Indium Corporation (U.S.), Parker Chomerics (U.S.), Dow Corning (U.S.), Laird Technologies (U.S.), Momentive Performance Materials Inc. (U.S.), and Zalman Tech Co., Ltd. (South Korea) have adopted various organic developmental strategies.


A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics. An additive selected from 0.1-2.5 wt. % of Bi and/or 0.1-4.5 wt. % of In may be included in the solder alloy.


Patent
Indium Corporation | Date: 2015-03-10

A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260 C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250 C. In another implementation, the solder paste consists of an amount of a first solder alloy powder between 44 wt % and 87 wt %; an amount of a second solder alloy powder between 13 wt % and 48 wt %; and flux.


Patent
Indium Corporation | Date: 2015-02-23

A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260 C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250 C.


Methods of forming solder bumps or joints using a radiation curable, thermal curable solder flux, or dual curable solder flux are disclosed. The method includes applying a liquid solder flux that is radiation curable or thermal curable to a substrate such that the solder flux covers contact pads on the substrate; placing solder balls on the contacts pads covered with the radiation curable or thermal curable solder flux; heating the substrate to join the solder balls to the contact pads, thereby forming solder bumps or solder joints; and curing the liquid solder flux by applying radiation or heat to the substrate, thereby forming a solid film. The solder flux includes radiation curable, thermally curable, or dual curable materials that aid formation of solder bumps or joints before the solder flux is cured; and are curable to form a solid material by the application of radiation or heat.


Patent
Indium Corporation | Date: 2014-01-16

Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.


Patent
Indium Corporation | Date: 2015-08-24

Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the component placement. The solder preform can be configured with a geometry such that it creates a standoff, or gap, between the components to be mounted in the solder paste. The method includes receiving a printed circuit board comprising a plurality of contact pads; depositing a volume of solder paste onto each of the plurality of contact pads; depositing a solder preform into each volume of solder paste; placing electronic components onto the printed circuit board such that contacts of the electronic components are aligned with corresponding contact pads of the printed circuit board; and reflow soldering the electronic components to the printed circuit board.

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