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Andhiwal A.,Indigenization and Components Group | Manohar T.S.,Indigenization and Components Group | Kumar P.N.,Indigenization and Components Group | Venkatesh V.,Indigenization and Components Group | And 2 more authors.
Journal of Spacecraft Technology | Year: 2011

Micro miniaturization of space electronic systems by eliminating individual chip packages is attractive not only because of the advantage of reduction in volume and weight but also because of the potential improvement in reliability associated with elimination of one level of interconnection. Latest trend in Microelectronic packaging technology is Multichip Module (MCM) in which multiple bare chips are mounted and interconnected on a substrate. The MCM technology has significant advantages with respect to electrical and thermal performance, size, weight, cost and reliability over conventional discrete device approach. These features make this approach a good choice for space applications. The MCMs are traditionally classified as MCM-L, MCM-D and MCM-C based on substrate fabrication method. All these technologies have their own advantages and applications. This paper presents the development of Fineline and Microvia high density thick film MCM technology classified under MCM-C using Photoimageable Thick film compositions and its comparison with other advanced MCM technologies available. Challenges associated with this technology for space application and materials and processes required to achieve reliable performance are discussed. Qualification tests performed to qualify this technology for space application are also presented. An MCM namely 64 Bit Monitor is developed using this technology and its comparison with existing HMC is also presented in this paper.

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