INCDIE ICPE Advanced Research

Bucharest, Romania

INCDIE ICPE Advanced Research

Bucharest, Romania
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Anicai L.,Polytechnic University of Bucharest | Petica A.,INCDIE ICPE Advanced Research | Costovici S.,Felix IT SA | Prioteasa P.,INCDIE ICPE Advanced Research | Visan T.,Polytechnic University of Bucharest
Electrochimica Acta | Year: 2013

The present paper presents several experimental results regarding the electrodeposition and corrosion behavior of Sn and NiSn alloy coatings from some choline chloride based ionic liquids, applied onto various metallic substrates including Cu and steel. There are discussed electrolytes containing Sn and Ni salts in choline chloride-ethylene glycol and choline chloride-malonic acid eutectic mixtures. The obtained Sn and Ni-Sn alloy deposits are adherent and uniform onto metallic substrates The Ni-Sn alloys contained about 62-72 wt% Sn according to EDX analysis, with a very slight variation against the applied current density domain. According to XRD investigations both electrochemical coatings showed a nanocrystalline structure, with average sizes of the crystallites between 50 and 80 nm for Sn and around 11-14.5 nm for NiSn alloy. To evaluate corrosion resistance of Sn and Ni-Sn alloy coatings, potentiodynamic polarization curves and electrochemical impedance spectra (at open circuit potential) in 0.5 M NaCl solution have been recorded after different immersion times of coated specimens. Different corrosion performances are discussed taking into account the used electrodeposition procedures. © 2013 Elsevier Ltd. All rights reserved.

Anicai L.,Polytechnic University of Bucharest | Petica A.,Leather and Footwear Research Institute ICPI | Patroi D.,INCDIE ICPE Advanced Research | Marinescu V.,INCDIE ICPE Advanced Research | And 2 more authors.
Materials Science and Engineering B: Solid-State Materials for Advanced Technology | Year: 2015

The paper presents some experimental results regarding the electrochemical synthesis of TiO2 nanopowders through anodic dissolution of Ti metal in choline chloride based eutectic mixtures (DES). A detailed characterization of the obtained titania has been performed, using various techniques, including XRD, Raman spectroscopy, XPS, SEM associated with EDX analysis, BET and UV-vis diffuse reflectance spectra. The anodic behavior of Ti electrode in DES has been also investigated. The photoreactivity of the synthesized materials was evaluated for the degradation of Orange II dye under UV (λ = 365 nm) and visible light irradiation. An anodic synthesis efficiency of minimum 92% has been determined. The as-synthesized TiO2 showed amorphous structure and a calcination post-treatment at temperatures between 400 and 600°C yielded anatase. The anodically obtained nanocrystalline oxides have crystallite sizes of 8-18 nm, a high surface area and enhanced photocatalytic effect. © 2015 Elsevier B.V. All rights reserved.

Prioteasa P.,INCDIE ICPE Advanced Research | Golgovicp F.,Polytechnic University of Bucharest | Sbircea G.,INCDIE ICPE Advanced Research | Anicai L.,PSV Company SA | Visan T.,Polytechnic University of Bucharest
Revista de Chimie | Year: 2010

The paper presents experimental results regarding the electrodeposition and physico-chemical characterization of Ni-Mo alloys prepared from ammonium-citrate aqueous electrolyte containing NiSO 4 (0.35M), Na 2MoO 4 (0.03M), Na 3 Citrat (0.2M), H 3BO 3(0.48M) and additions of ammonia, saccharine, lauryl sulfate and/without brightening agent (RADO 570); pH=6-6.5. Other operating conditions were: 2-8Adm -2 current densities, 55-70°C and 30-120min electrolysis time. The structure, morphology, roughness and hardness of Ni-Mo deposits were discussed. Investigations dealing with their corrosion behavior, involving potentiodynamic polarization curves and electrochemical impedance spectroscopy in 0.5M NaCl solution, are also presented.

Catrangiu A.-S.,Polytechnic University of Bucharest | Sin I.,Polytechnic University of Bucharest | Prioteasa P.,INCDIE ICPE Advanced Research | Cotarta A.,Polytechnic University of Bucharest | And 3 more authors.
Thin Solid Films | Year: 2016

Cyclic voltammetry and electrochemical impedance spectroscopy were used to investigate the deposition of antimony telluride or copper telluride from ionic liquid consisting in mixture of choline chloride with oxalic acid. In addition, the cathodic process during copper telluride formation was studied in the mixture of choline chloride with ethylene glycol. The results indicate that the Pt electrode is first covered with a Te layer, and then the more negative polarisation leads to the deposition of SbxTey or CuxTey semiconductor compounds. Thin films were deposited on copper and carbon steel at 60-70 °C and were characterised by scanning electron microscopy, energy X-ray dispersive spectroscopy (EDS), and X-ray diffraction (XRD). Their stoichiometry depends on the bath composition and applied potential. EDS and XRD patterns indicate the possible synthesis of stoichiometric Sb2Te3 phase and Cu2Te, Cu5Te3, and Cu2.8Te2 phases, respectively, by controlling the ratio of ion concentrations in ionic liquid electrolytes and deposition potential. © 2016 Elsevier B.V. All rights reserved.

Szatmari I.,Polytechnic University of Bucharest | Tudosie L.-M.,Polytechnic University of Bucharest | Cojocaru A.,Polytechnic University of Bucharest | Lingvay M.,Babes - Bolyai University | And 2 more authors.
UPB Scientific Bulletin, Series B: Chemistry and Materials Science | Year: 2015

The paper reports studies about corrosion of AISI 304 stainless steel and of copper in two Czapek-Dox media inoculated with Aspergillus Niger fungus: without sucrose ("A" medium) and with 30 g L-1 sucrose ("B" medium). From the comparative polarization experiments it has resulted that in "A" solutions the corrosion rate for austenitic steel increases more than 3 times in the first 14 days after inoculation, while for copper is more than 100 times faster. In "B" solutions the formation of a thicker biofilm is expected for both electrodes owing to the presence of sucrose as a carbon source for the fungus. It is responsible for much faster biocorrosion, especially in the case of copper. Micrographs of the metallic surfaces confirm the formation of biofilm.

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