II VI Incorporated | Date: 2016-07-21
A micro splice protector for a fusion connection between a pair of optical fibers takes the form of a cylindrical sleeve of dimensions similar to that of the fusion splice itself, with an epoxy material used to encase the fusion splice within the sleeve. The sleeve is formed to exhibit an inner diameter only slightly greater than the outer diameter of the optical fibers, with the length of the sleeve typically formed to be only slightly longer than the stripped end terminations of the pair of fibers being spliced together. The cylindrical sleeve is formed of a rigid, but lightweight, material (e.g., stainless steel, fused silica) and an epoxy material is injected into the configuration to fill any gaps between the fusion connection and the inner surface of the sleeve. The result is relatively stiff fusion splice protector that is extremely small in size and well-suited for use in optical component packages where space is at a minimum.
II VI Incorporated | Date: 2016-04-07
In a method of forming a diamond film, substrate, or window, a silicon substrate is provided and the diamond film, substrate, or window is CVD grown on a surface of the silicon substrate. The grown diamond film, substrate, or window has an aspect ratio 100, wherein the aspect ratio is a ratio of a largest dimension of the diamond film, substrate or window divided by a thickness of the diamond film. The silicon substrate can optionally be removed or separated from the grown diamond film, substrate, or window.
Ii Vi Incorporated | Date: 2016-02-01
A composite substrate includes a submount substrate of an alternating pattern of electrically insulative portions, pieces, layers or segments and electrically conductive portions, pieces, layers or segments, and a shaft, back or plate for supporting the alternating pattern of electrically insulative portions and electrically conductive portions. An active device having a PN junction can be mounted on the submount substrate. The electrically insulative portions, pieces, layers or segments can be formed from diamond while the electrically conductive portions, pieces, layers or segments can be formed from a metal or metal alloy.
II VI Incorporated | Date: 2016-02-03
An OTDR system utilizes a laser source that is turned on and kept powered until its light reaches the end of the fiber span being measured (i.e., until the fiber span is fully illuminated). At any point in time after the fiber is fully illuminated, the laser source can be turned off. The return (reflected and backscattered) signal is directed into a photodetector of the OTDR, and is measured from the point in time when the fiber span starts to be illuminated. The measurements are made by sampling the return signal at predetermined time intervals - defined as the sampling rate. The created power samples are then subjected to post-processing in the form of a differentiation operation to create a conventional OTDR trace from the collected data.
II VI Incorporated | Date: 2016-06-07
A housing used for electronic devices includes a structural frame element formed of a metal matrix composite (MMC) for providing improved stiffness over other materials currently in use. The MMC is a metal matrix (formed of a material such as aluminum), with a reinforcing material (such as a glass fiber or ceramic) dispersed within the metal matrix. The composition of the reinforcing material, as well as the ratio of reinforcing material to metal, define the stiffness (resistance to bending) and/or strength (resistance to breaking) achieved, and various compositions may be used for different housings, depending on the use of the electronic device. The element may be configured as a structural frame member, or may be embedded within another material forming the structural frame element. In another embodiment, the MMC may be used to form various components of the complete housing, including the enclosure itself.
II VI Incorporated | Date: 2016-02-11
A densely-spaced single-emitter laser diode configuration is created, by using a laser bar (or similar array configuration) attached to a submount component of a size sufficient to adequately support the enter laser structure. The surface of the submount component upon which the laser structure is attached is metallized and used to form the individual electrical contacts to the laser diodes within the integrated laser structure. Once attached to each other, the laser structure is singulated by creating vertical separations between adjacent light emission areas. The submount metallization is similarly segmented, creating separate electrodes that are used to individually energize their associated laser diodes.
II VI Incorporated | Date: 2016-02-23
An electro-optic modulator for high voltage applications exhibits reduced corona and arcing by utilizing dielectric-coated electrodes in conjunction with a non-centrosymmetric crystal. The inclusion of an insulative coating (i.e., a dielectric material) on at least a portion of the electrodes reduces the possibility of arcing or corona, without requiring the application of any type of coating material directly on the crystal itself. Thus, the birefringent response of the crystal is not impacted by this coated electrode configuration of the present invention. In one configuration, the exposed surfaces of the electrodes are coated with an insulative material, while maintaining a direct contact between the electrodes and the surface of the crystal.
II VI Incorporated | Date: 2016-03-16
A fiber-based optical amplifier is assembled in a compact configuration by utilizing a flexible substrate to support the amplifying fiber as flat coils that are spun onto the substrate. The supporting structure for the amplifying fiber is configured to define the minimal acceptable bend radius for the fiber, as well as the maximum diameter that fits within the overall dimensions of the amplifier package. A pressure-sensitive adhesive coating is applied to the flexible substrate to hold the fiber in place. By using a flexible material with an acceptable insulative quality (such as a polyimide), further compactness in the final assembly is achieved by locating the electronics in a space underneath the fiber enclosure.
II VI Incorporated | Date: 2016-03-17
An optical amplifier module is configured as a multi-stage free-space optics arrangement, including at least an input stage and an output stage. The actual amplification is provided by a separate fiber-based component coupled to the module. A propagating optical input signal and pump light are provided to the input stage, with the amplified optical signal exiting the output stage. The necessary operations performed on the signal within each stage are provided by directing free-space beams through discrete optical components. The utilization of discrete optical components and free-space beams significantly reduces the number of fiber splices and other types of coupling connections required in prior art amplifier modules, allowing for an automated process to create a pluggable optical amplifier module of small form factor proportions.
II VI Incorporated | Date: 2016-03-19
Optical modules as used in various types of communication systems are formed to include a flexible substrate to support various optical, electronic, and opto-electronic module components in a manner that can accommodate various packaging constraints. The flexible substrate is formed of a polyimide film is known to exhibit excellent electrical isolation properties, even though the films are generally relatively thin (on the order of 10-100 ms, in most cases). The flexible polyimide film is sized to accommodate the constraints of a given package footprint; more particularly, sized to fit an open floor area within package, allowing for a populated film to be placed around various other fixed-in-place elements . The polyimide film is easily cut and trimmed to exhibit whatever topology is convenient, while providing enough surface area to support the affixed components and associated optical fiber traces.