Gifu, Japan
Gifu, Japan

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Patent
Ibiden Co. | Date: 2016-08-18

A printed wiring board includes a build-up layer including insulating and conductor layers, pads formed on surface of the build-up layer and including first pads to connect an electronic component and second pads to connect an external wiring board onto the surface of the build-up layer, a mold resin layer formed on the surface of the build-up layer such that the mold layer is covering the surface of the build-up layer and has a cavity exposing the first pads and openings exposing the second pads, and conductor posts formed in the openings and including plating material such that the posts are connected to the second pads. The plating material of the posts includes electroless plating layer and electrolytic plating layer, and the posts are formed such that each post has an end surface exposed from surface of the mold layer on the opposite side with respect to the second pads.


A printed wiring board includes a buildup wiring layer including resin insulation layers and conductive layers such that the conductive layers are laminated on the resin insulation layers, respectively, first pads formed in a center portion of a first surface of the buildup wiring layer and positioned to connect an electronic component, second pads formed on a periphery portion of the first surface of the buildup wiring layer and positioned to connect an external wiring board, a solder layer including a plating material and formed on the first pads such that the solder layer is formed on each of the first pads, conductive posts including a plating material and formed on the second pads, respectively, and a seed layer including first seed layer portions formed between the first pads and the solder layer and second seed layer portions formed between the second pads and the conductive posts.


A printed wiring board includes a first circuit substrate having first and second surfaces, and a second circuit substrate having third and fourth surfaces such that the first substrate is laminated on the third surface and that the first and third surfaces are opposing each other. The second substrate includes a conductor layer, a first insulating layer including reinforcing material and formed on the conductor layer, and mounting via conductors formed in the first insulating layer and connected to the conductor layer such that the second substrate has a mounting area on the third surface and that the mounting via conductors have via bottoms forming pads positioned to mount an electronic component in the mounting area, and the first substrate includes an insulating layer which does not contain reinforcing material and has an opening through the insulating layer and exposing the via bottoms forming the pads in the mounting area.


A printed wiring board includes a first circuit substrate having a first surface and a second surface on the opposite side, and a second circuit substrate having a third surface and a fourth surface on the opposite side such that the first circuit substrate is laminated on the third surface and that the first surface and the third surface are opposing each other. The second circuit substrate has a mounting area on the third surface and includes pads positioned to mount an electronic component in the mounting area and a connection wire structure connected to the pads, and the first circuit substrate includes through-hole conductors extending from the first surface to the second surface and connected to the pads through the connection wire structure and has an opening portion formed through the first circuit substrate such that the opening portion is exposing the pads formed in the mounting area.


Patent
Ibiden Co. | Date: 2016-06-22

A printed wiring board includes conductive layers, resin insulation layers, a through-hole conductor penetrating through one or more insulation layers and having a first-surface-side and second-surface-side lands, a first-surface-side signal line formed on one of the insulation layers and connecting the first-surface-side land and a conductive layer on the insulation layer, and a second-surface-side signal line formed on one of the insulation layers and connecting the second-surface-side land and a conductive layer on the insulation layer. The conductive layers include a first-surface-side conductive layer formed over the first-surface-side land such that the first-surface-side conductive layer has a solid pattern having an opening corresponding to the first-surface-side land and formed concentric with the first-surface-side land, and a second-surface-side conductive layer formed over the second-surface-side land such that the second-surface-side conductive layer has a solid pattern having an opening corresponding to the second-surface-side land and formed concentric with the second-surface-side land.


Patent
Ibiden Co. | Date: 2016-03-28

A printed wiring board includes a first insulating layer, a first conductor circuit including fingerprint authentication circuitry and embedded in the first insulating layer such that the first circuit has exposed surface exposed from surface of the first insulating layer, a second insulating layer on which the first insulating layer is formed, a second conductor circuit including fingerprint authentication circuitry and embedded in the second insulating layer such that the second circuit has exposed surface exposed from surface of the second insulating layer and is interposed between the first and second insulating layers, and a solder resist layer formed on the surface of the first insulating layer and covering the first circuit. The first and second circuits are positioned such that the first and second circuits are opposing each other across the first insulating layer and that a finger for fingerprint authentication is placed on the solder resist layer.


Patent
Ibiden Co. | Date: 2016-03-29

A printed wiring board includes a core substrate, and a first build-up wiring layer formed on the core substrate and including a wiring layer such that the wiring layer includes a resin insulating layer and a conductor layer laminated on the resin insulating layer. The first build-up wiring layer is formed on a first surface of the core substrate such that the first build-up wiring layer forms a high-rise region and a low-rise region with respect to a lamination direction, the first build-up wiring layer includes electrodes positioned to connect an electronic component to the first build-up wiring layer, and the first build-up wiring layer is formed such that the low-rise region is extending in two or more directions from the high-rise region to edges of the core substrate.


Patent
Ibiden Co. and Toyota Jidosha Kabushiki Kaisha | Date: 2016-05-04

The present invention provides a highly durable, electrically heated catalytic converter including an inner tube on which an insulation layer is formed, wherein the insulation layer is less susceptible to damage such as cracking and peeling even when thermal stress occurs in a curvature section of the inner tube where the insulation layer is formed. The present invention provides an electrically heated catalytic converter for purifying exhaust gas, the electrically heated catalytic converter including a catalyst carrier supporting a catalyst and configured to generate heat by energization; a case for accommodating the catalyst carrier; and an electrical insulation mat interposed between the catalyst carrier and the case, wherein the case includes an outer tube disposed at the outermost side and an inner tube disposed inside the outer tube; in a cross section upstream of the catalyst carrier taken along a plane including the central axis of the case, the inner tube includes one or more curvature sections curved so as to outwardly project and extended sections connected to the one or more curvature sections, an insulation layer including an amorphous inorganic material is formed at least on an inner surface of the one or more curvature sections and the extended sections of the inner tube, the one or more curvature sections include a first curvature section located closest to the catalyst carrier, the first curvature section has a first curvature section insulation layer formed thereon, the first curvature section insulation layer having a thickness of 100 to 400 m, the extended sections include a first extended section connected to the first curvature section and adjacent to the catalyst carrier, the first extended section has a first extended section insulation layer formed thereon, and the thickness of the first curvature section insulation layer is greater than 1 time to less than 1.4 times the thickness of the first extended section insulation layer.


A method for manufacturing a printed wiring board includes forming, on a surface of an insulating layer, a patterned catalyst film including a catalyst for electroless plating such that the patterned catalyst film has a pattern corresponding to a conductor circuit, and applying electroless plating on the patterned catalyst film such that a conductor metal is deposited on the patterned catalyst film and that the conductor circuit is formed on the surface of the insulating layer.


Patent
Ibiden Co. | Date: 2016-03-16

The present invention provides: a placenta extract having a free amino acid content of less than or equal to 10 wt% with respect to the total solid content and a peptide content of 70 wt% to 99.5 wt% with respect to the total solid content; a placenta extract having a free amino acid content of less than or equal to 10 wt% with respect to the total solid content and a content of low-molecular peptides of 40 wt% to 99.5 wt% with respect to the total solid content, where the low-molecular peptides have a molecular weight of less than or equal to 3000; and a method of preparing such a placenta extract through subcritical treatment of a raw placenta material and an extraction agent. The placenta extract of the present invention, which is preferably extracted from a raw placenta material through subcritical treatment, has a high content of low-molecular peptides and a low content of free amino acids. Therefore, the placenta extract has remarkably improved antioxidative activity due to SOD-like activity, collagen production accelerating activity, collagenase inhibitory activity, elastase inhibitory activity, and ACE inhibitory activity as compared to that in the related art.

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