Geshi K.,Hybrid Products Division |
Teraoka K.,Hybrid Products Division |
Tsuji Y.,Hybrid Products Division |
Fujii A.,Hybrid Products Division |
And 5 more authors.
SEI Technical Review | Year: 2012
This paper proposes use of polycrystalline spinel for the temperature compensation of radio frequency (RF) surface acoustic wave (SAW) devices. Spinel can be bonded with LiTaO3 (LT) and LiNbO3 (LN) wafers by using adhesive and direct bonding techniques. A series of RF SAW resonators were fabricated on the LT(LN)/spinel structure, and their performance, including the temperature coefficient of frequency (TCF), was measured. For comparison, SAW resonators employing Si and sapphire in place of spinel were also fabricated. The result indicated that the polycrystalline spinel offers TCF improvement better than other materials.