Hitachi, Ltd. is a Japanese multinational conglomerate company headquartered in Chiyoda, Tokyo, Japan. It is the parent of the Hitachi Group and forms part of the DKB Group of companies. Hitachi is a highly diversified company that operates eleven business segments: Information & Telecommunication Systems, Social Infrastructure, High Functional Materials & Components, Financial Services, Power Systems, Electronic Systems & Equipment, Automotive Systems, Railway & Urban Systems, Digital Media & Consumer Products, Construction Machinery and Other Components & Systems.Hitachi is listed on the Tokyo Stock Exchange and is a constituent of the Nikkei 225 and TOPIX indices. It is ranked 38th in the 2012 Fortune Global 500 and 129th in the 2012 Forbes Global 2000. On January 21, 2014, numerous tech articles around the globe published findings from the cloud storage provider Backblaze that Hitachi hard disks are the most reliable among prominent hard disk manufactures. Wikipedia.
Hitachi Ltd. | Date: 2016-10-17
It is an object of the invention to provide a brake device capable of detecting a failure in each of components, by which booster control is performed, at an early stage even during vehicle running. The brake device is configured to discharge brake fluid into a communicating fluid path that connects a fluid path of a primary system and a fluid path of a secondary system, and to control a first communicating valve for restricting a flow of brake fluid from the communicating fluid path to the fluid path of the primary system and a second communicating valve for restricting a flow of brake fluid from the communicating fluid path to the fluid path of the secondary system in respective valve-closing directions, so as to check at least a state of the pump.
Hitachi Ltd. | Date: 2016-10-18
A photocurable resin composition which hardly causes leakage and is easily formed into a desired shape and an image display device using this photocurable resin composition are provided. Namely, a photocurable resin composition comprises a compound (A) having a photopolymerizable functional group and an oil gelling agent (B), is provided. Also, an image display device having a laminate structure including an image display unit having an image display part, a transparent protective plate, and a resin layer existent between the image display unit and the transparent protective plate, wherein the resin layer is a cured material of the above-described photocurable resin composition, is provided.
Hitachi Ltd. | Date: 2016-09-28
A manufacturing method of a metal strip coil for blades includes performing, on a steel band after a finishing cold rolling, a slit process that divides the steel band into a plurality of metal strips via joint operation of circular upper and lower blade cutters, and winding the metal strip into a coil shape after the slit process. In the slit process, a clearance of the upper and lower cutters is set within 5-25% of a metal strip thickness; an overlap amount of the upper and lower cutters is set within 5-80% of the metal strip thickness; and a clearance variation during the slit process is 30% or lower of the clearance. After the slit process, the metal strip is wound into a coil shape so that sag formed on an edge of the metal strip is positioned toward an axis center of a reel winding up the metal strip.
Hitachi Ltd. | Date: 2016-06-28
A processing method includes processing a metal wire rod using an emulsion lubricant that includes an oil and a nonionic surfactant at an oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio). The method may include purifying the emulsion lubricant after being used for processing the metal wire rod while maintaining the oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio) and then reusing the purified emulsion lubricant to process the metal wire rod.
Hitachi Ltd. | Date: 2016-10-19
With the use of electric power supplied from a vehicle power source, an electric motor is controlled based on a movement amount of an input rod by a master-pressure control device. A primary piston is thrust through an intermediation of a ball-screw mechanism to generate brake fluid pressure in a master cylinder. The brake fluid pressure generated by the master cylinder is fed-back by an input piston through an intermediation of the input rod to a brake pedal. When system end conditions such as the OFF state of the ignition switch are satisfied, the master-pressure control device executes power-supply interruption control to interrupt the vehicle power source and supply necessary electric power from an auxiliary power source, to thereby continue brake control with electric power stored in the auxiliary power source.
Hitachi Ltd. | Date: 2016-11-04
The underneath image of a self-propelled industrial machine is displayed with as wide a range as possible on a monitor with cameras that take images around the self-propelled industrial machine in the form of birds eye view images. A view point conversion section creates the birds eye view image by converting images from plural cameras provided on a dump truck; and a superposing process section processes the images to make the underneath area in a symbol image a transparent region corresponding to the position in the birds eye view. An image composing section sets the symbol image at the center position and the respective birds eye view images around the symbol image. A monitor displays the composite image composed by the image composing section.
Hitachi Ltd. | Date: 2016-08-01
Provided is an impact type electric tool. A striking mechanism is used, which uses a hammer having striking claws that are equally arranged in the rotational direction and an anvil having struck claws. A relationship between a striking energy E, which the hammer has right before striking the anvil, and a disengaging torque T_(B), which is applied between the hammer and the anvil right before the hammer is disengaged from the anvil, is set as 5.3T_(B)
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: FETPROACT-01-2016 | Award Amount: 10.00M | Year: 2017
The hybrid optomechanical technologies (HOT) consortium will lay the foundation for a new generation of devices, which connect, or indeed contain, several platforms at the nanoscale in a single hybrid system. As hybrid interfaces they will allow to harness the unique advantages of each subsystem within a nano-scale footprint, while as integrated hybrid devices they will enable entirely novel functionalities. A particular focus will be on nano-optomechanical devices that comprise electrical, microwave or optical systems with micro- and nano-mechanical systems. Research in the past decade, in particular by European groups, has shown the significant technological potential that such nano-optomechanical systems can offer, in particular by establishing a new way in which optical, radio-frequency and microwave signals can be interfaced. The present consortium includes leading academic groups and industrial partners to explore the potential of these hybrid-nano-optomechanical systems. It will explore hybrid opto- and electro-mechanical devices operating at the physical limit for conversion, synthesis, processing, sensing and measurement of EM fields, comprising radio, microwave frequencies to the terahertz domain. These spectral domains open realistic applications in the existing application domains of medical (e.g. MRI imaging), security (e.g. Radar and THz monitoring), positioning, timing and navigations (Oscillators) and for future quantum technology. The research aims at specific technological application, with realistic operating conditions and seeks to develop actual system demonstrators. In addition, it will explore how these hybrid transducers can be fabricated within standard CMOS processing, and thereby be made compatible with current manufacturing methods. The HOT devices will thereby impact todays technology and likewise address potential future need for the manipulation of quantum signals.
Agency: GTR | Branch: EPSRC | Program: | Phase: Research Grant | Award Amount: 1.48M | Year: 2016
The theme of this platform grant is electronic-photonic convergence. It underpins expertise in integrated photonics platforms such as silicon photonics, mid-IR photonics, non-linear photonics and high speed electronics, all of which make use of a common fabrication platform. The convergence of electronics and photonics underpins a host of technologies ranging from future internet to consumer products, and from biological and chemical sensing to communications. The integration of electronics and photonics is recognised as the only way to manage the massive data demands of the future, and is consequently crucial to the continuation of the digital age. Silicon Photonics is an example of an emerging technology that will bring photonics to mass markets via integration with electronics. Integrated silicon systems are projected to serve a market in excess of $700M by 2024 (Yole Development, 2014), but is reliant on photonics converging with electronics. Furthermore, some aspects of silicon photonics will encompass non-linear photonics in second generation devices for all optical processing in a fully integrated platform. Similarly, related technologies such as SiGe-on-Insulator and Ge-on-Insulator are poised to revolutionise the next generation of communications and integrated sensor technologies, all on an integrated platform with electronics and non-linear photonics. Underpinning a team in these crucial areas of expertise supported by a flexible funding platform will enable us to pioneer work in these technology areas, and to add value to ideas that emerge. The convergence of electronics and photonics will result in complex integrated systems, linked via fabrication technologies. Electronic-photonic integration has yet to be addressed in a meaningful way in silicon based technologies, and this team collectively have the essential skills to do so, at an institution that possesses the key fabrication equipment to facilitate success. Due to the complex nature of fabrication for research, existing RAs are fully utilised, and have little or no additional scope for strategic research. The platform grant will give us the opportunity to dedicate fabrication resource and RA skills to strategic projects, and specific innovation. We will do this by utilising the RAs within the project to deliver work of significant strategic importance to the portfolio of grants held by the group, whilst also developing the research and managerial skills of the RAs by giving them specific management responsibilities whilst being mentored by one of the investigators.
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: ICT-25-2015 | Award Amount: 3.97M | Year: 2016
Quantum computing is now widely regarded by many in academia, governments and industry to represent a major new frontier in information technology with the potential for a disruptive impact. Many different materials and approaches have been explored, with a narrowing of focus in recent years on scalable implementations based on solid state platforms. In particular, there is now strong evidence that silicon, the primary platform technology for todays processor technology, inherently possesses many key properties that make it advantageous for quantum computing. Two types of qubit based on spins in silicon nano-devices made in academic research labs have already been reported with demonstrated high-fidelity operation. Our project builds on this success and aims to take this technology to the next readiness level by showing that silicon-based qubits can be realised within a full CMOS platform, using the 300mm-scale fabrication facilities in our consortium. In doing so we will demonstrate the true potential of silicon based qubits in terms of scalability and manufacturability. Our focus is on distilling the silicon device design down to the simplest core element necessary to demonstrate qubit behaviour, in order to lay the foundation for a scalable technology. We will design, model and fabricate these qubit devices, and then benchmark them using key operating parameters. Our attention is not limited at the lowest level technology layer where the qubits reside, and includes higher control layers necessary to operate such devices, including demonstrating strategies for achieving local control and readout in large-scale arrays without cross-talk and developing cryo-CMOS electronics to support the qubit operation. Both of these may be spun-out and yield their own technological impacts. Thus, our holistic approach offers a wider opportunity to harness the tremendous proven capabilities of integrated CMOS technology to become a key driver of quantum technology development.