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Patent
Hitachi Kokusai Electrical Inc. | Date: 2017-02-01

IP-based monitor camera system has been used to accomplish savings in labor in operating railway vehicles, such as passenger-carrying vehicles, and to confirm safety at multiple doors thereof. Provided are a monitoring system and a monitoring method which allow a train driver or a train crew to use a monitor installed in a leading or rearmost vehicle or the like for visually confirming motions of passengers in association with opening or closing of doors of the passenger-carrying vehicles at a time so as to ensure more safe and efficient operation of the passenger-carrying vehicle. Additionally, in the case where a train set of passenger-carrying vehicles is formed, when the areas of the trimming frames of images captured by monitor cameras are set for displaying the images on a monitor screen, the areas of the trimming frames of the monitor cameras are automatically read and set so that the trimming frames can be set for the train set of vehicles quickly, readily and reliably.


A wireless communication system includes a first wireless communication device and a second wireless communication device that wirelessly communicates with the first wireless communication device. One of the first and second wireless communication devices is disposed in a mobile object, and the other is fixed. The first wireless communication device includes a wireless transmission/reception unit that transmits data to the second wireless communication device and performs wireless transmission and reception in order to detect whether the mobile object is stopped. When, in a first mode for transmitting data to the second wireless communication device and determining whether the reception strength of a received signal is equal to or greater than a first value, the first wireless communication device detects that the reception strength is equal to or greater than the first value, the first wireless communication device stops the transmission of data to the second wireless communication device, exits the first mode, and transitions to a second mode for determining whether the mobile object is stopped. Upon detecting in the second mode that the mobile object is stopped, the first wireless communication device exits the second mode and transmits data to the second wireless communication device.


Patent
Hitachi Kokusai Electrical Inc. | Date: 2017-04-05

In a monitoring system, each individual camera device divides image data acquired by an image sensor unit into a plurality of areas, and detects video-image abnormality from an average luminance signal value in each area or from a change thereof. The camera device that has detected video abnormality transmits video-image abnormality detection information to a server. In the plurality of areas, it is possible to use different detection algorithms such as a first algorithm in which it is determined that an abnormality has occurred when there is no change in the average luminance value, a second algorithm in which it is determined that an abnormality has occurred when there is a change in the average luminance value, and a third algorithm for observing a change in the video captured while a change is made to an aperture, exposure time, or the like.


Patent
Hitachi Kokusai Electrical Inc. | Date: 2016-06-20

A substrate processing apparatus includes a gas supply part configured to supply at least one of a film-forming gas, a first inert gas, and a second inert gas supplied at a temperature higher than that of the first inert gas into a process chamber in which a substrate is processed; and a control part configured to control the gas supply part to perform a film-forming process of supplying the film-forming gas and the first inert gas from the gas supply part into the process chamber to process the substrate, and to control a deposited film removing process of directly supplying the second inert gas having a temperature higher than that of the first inert gas from the gas supply part to the process chamber, in a state where there is no substrate in the process chamber, to remove a deposited film deposited within the process chamber.


Patent
Hitachi Kokusai Electrical Inc. | Date: 2016-09-09

A substrate processing apparatus includes a reaction tube processing a substrate, a heating part disposed on an outside of the reaction tube that heats the interior of the reaction tube, an insulating part disposed on an outside of the heating part, a plurality of flow channels installed in the insulating part and allows an air or a cooling medium to flow, and a ceiling part configured to cover an upper surface of the insulating part. The ceiling part includes a first member having a supply hole formed to communicate with the flow channels and to supply the air or cooling medium into the flow channels, and a second member having a space formed between the second member and the first member and allowing the air or the cooling medium to flow therein and having a partition part to partition the space into at least two spaces.


There is provided a method of manufacturing a semiconductor device, comprising forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including non- simultaneously performing forming a first layer by supplying a precursor containing hydrogen and an halogen element to the substrate in a process chamber, under a condition in which the precursor is pyrolyzed if the precursor exists alone and under a condition in which a flow rate of the precursor supplied into the process chamber is larger than a flow rate of the precursor exhausted from an interior of the process chamber and forming a second layer by supplying a reactant to the substrate in the process chamber thereby modifying the first layer.


A method of manufacturing a semiconductor device includes: providing a substrate having an oxide film; performing, a predetermined number of times, a cycle of non-simultaneously performing supplying a precursor gas to the substrate, supplying a carbon-containing gas to the substrate, and supplying a nitrogen-containing gas to the substrate, or performing, a predetermined number of times, a cycle of non-simultaneously performing supplying a precursor gas to the substrate and supplying a gas containing carbon and nitrogen to the substrate, or performing, a predetermined number of times, a cycle of non-simultaneously performing supplying a precursor gas containing carbon to the substrate and supplying a nitrogen-containing gas to the substrate, the oxide film being used as an oxygen source to form a nitride layer containing oxygen and carbon as a seed layer; and forming a nitride film containing no oxygen and carbon as a first film on the seed layer.


Patent
Hitachi Kokusai Electrical Inc. | Date: 2016-09-08

A substrate processing apparatus includes: a processing chamber for processing a substrate; a substrate holding part whereon the substrate is placed; an elevating mechanism to move the substrate holding part vertically; a first gas supply system to supply a halogen-containing process gas to the substrate; a second gas supply system to supply an inert gas to the substrate; an exhaust unit to exhaust the process and inert gases; and a controller to control the elevating mechanism and the gas supply systems to: supply the process gas with a state where heights of the substrate holding part and exhaust unit are adjusted; and supply the inert gas to a center portion of the substrate from thereabove such that the inert gas flows radially from the center portion to a circumference of the substrate along a surface of the substrate and is exhausted out of the processing chamber through the exhaust unit.


Patent
Hitachi Kokusai Electrical Inc. | Date: 2016-09-13

A space needed to transfer a substrate container is decreased. A substrate processing apparatus includes a locating part where a substrate container accommodating a substrate is located; a driving unit configured to drive the locating part vertically; a transfer robot configured to transfer the substrate container; and a controller configured to control the driving unit and the transfer robot to move the locating part downward after the transfer robot moves to under the locating part to transfer the substrate container from the locating part to the transfer robot.


A method of manufacturing a semiconductor device includes forming a film on a substrate by performing a cycle a predetermined number of times. The cycle includes non-simultaneously performing: supplying a precursor containing a predetermined element to the substrate in a process chamber, removing the precursor from the process chamber, supplying a first reactant containing nitrogen, carbon and hydrogen to the substrate, removing the first reactant from the process chamber, supplying a second reactant containing oxygen to the substrate, and removing the second reactant from the process chamber. A time period of the act of removing the precursor is set to be longer than a time period of the act of removing the first reactant, or a time period of the act of removing the second reactant is set to be longer than the time period of the act of removing the first reactant.

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