Leverkusen, Germany
Leverkusen, Germany

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Patent
Heraeus Holding GmbH | Date: 2017-01-09

Method for producing a three-dimensional model of at least a partial jaw comprising: fully-automatic shaping of at least one recess for accommodating a laboratory analogue into the alveolar ridge of the model using three-dimensional scanning data and shaping the depth, position, and orientation of the at least one recess such that the crestal end of the laboratory analogue inserted into said recess coincides with the crestal end of the dental implant in the jaw; or fully-automatic shaping of at least one vestibular, lingual or palatinal feed-through through the model into the at least one recess using three-dimensional scanning data and arranging the feed-through such that the crestal end of a laboratory analogue coincides with the crestal end of the dental implant in the jaw when the laboratory analogue is fixed in place with a pin inserted through the feed-through in the model into an opening in the laboratory analogue.


Patent
Heraeus Holding GmbH | Date: 2017-01-09

One aspect relates to a method of producing an electrode structure, including producing a longitudinal body having a core and at least one layer made of an electrode material surrounding the core. A part of the layer made of electrode material is removed while forming a plurality of electrodes that are arranged such as to be distributed in the longitudinal direction and which are separated from each other, and contact paths that extend in the longitudinal direction and adjoin the electrodes, each, as the same part. A layer made of a polymeric material is applied while embedding, at least in part, the electrodes and/or contact paths.


Patent
Heraeus Holding GmbH | Date: 2017-05-17

A process for the manufacture of a bonding wire comprising a core with a surface, wherein the core comprises 98.0% copper and has a cross sectional area in the range of 7500 to 600000 m2 and an elastic limit RP0.2 (yield strength) in the range of 40 to 95 N/mm2, the process comprising the steps of: a) providing a copper core precursor; b) drawing the precursor until a final diameter of the wire core is reached; c) annealing the drawn wire at a minimum annealing temperature in the range of 650 to 1000 C through its entire cross section for a minimum annealing time in the range of 4 seconds to 2 hours.


Patent
Heraeus Holding GmbH | Date: 2017-05-24

A gasket (100a; 100b; 100c; 100d; 200a; 200b; 300a; 300b; 300c) for use in an ultraviolet light source (202; 302) is provided. The gasket includes a body portion formed of an elastomeric material. The body portion is electrically conductive.


The invention relates to a method for producing a substrate adapter (27), which is used in particular to contact semiconductor elements (32), comprising the following steps: - applying a contacting material (13) to one side (12) of a carrier (10), - structuring an electrically conductive metal element, - positioning the structured metal element (15) on the carrier (10) in such a way that a first side (17) of the metal element (15) and the side (12) of the carrier (10) provided with the contacting material (13) are arranged facing each other, - joining the structured metal element (15) to the carrier (10) provided with contacting material (13), - applying a transfer element (22) to a second side (20) of the structured metal element (15), and - separating the transfer element (22) and/or the structured metal element (15), which is joined by means of contacting material (13), for further processing.


The invention relates to a support and/or clip for at least one semiconductor element with at least one functional surface (10) for connecting to the semiconductor element. The invention is further characterized by at least one solder resist cavity (12) with at least one flank wall (13), in particular a straight flank wall (13), and a delimiting edge (14) which adjoins the flank wall (13) and delimits the functional surface (10) at least on one side. The delimiting edge (14) forms a protrusion (15) which protrudes past the functional surface (10) in order to retain solder, and/or the flank wall (13) forms an undercut (16) for retaining solder at the delimiting edge (14).


Patent
Heraeus Holding GmbH | Date: 2017-02-15

The invention relates to a method for processing prosthetic teeth for the production of a total prosthesis or a partial prosthesis, with the following steps: At least two prefabricated prosthetic teeth are inserted with the coronal ends into recesses (4) of an elastic mould (2), a clamping device (6) is fitted on the elastic mould (2) and, after the prosthetic teeth have been inserted, the clamping device (6) is used to apply a mechanical pressure to the elastic mould (2), wherein the pressure on the elastic mould (2) exerts a force on the prosthetic teeth and thereby fixes the prosthetic teeth in the elastic mould (2), the prosthetic teeth are positioned and oriented relative to each other in the elastic mould (2) in such a way that the prosthetic teeth have the desired position and the desired orientation relative to each other, the elastic mould (2), with the clamping device (6) and the prosthetic teeth, is secured in a defined position in a retainer of a CAM device for removing material from the prosthetic teeth by a CAM technique, and at least one of the fixed prosthetic teeth has material removed from the base by a CAM technique. The invention also relates to a device (1) for retaining prosthetic teeth in order to carry out such a method, and to a kit for carrying out such a method using such a device.


The invention relates to a sensor element (10) with a thin-film structure (11) consisting of platinum or a platinum alloy, said structure being applied to a ceramic substrate (12), in particular an Al2O3 substrate and being covered by a glass-ceramic coating (13). The invention is characterised in that at least the glass-ceramic coating (13) has an outer surface (14) with surface profiling (15). The invention further relates to a sensor module (20), a measuring assembly and an exhaust-gas re-circulation system comprising a sensor element (10) of this type, in addition to a production method for the sensor element (10).


Patent
Heraeus Holding GmbH | Date: 2017-02-01

The invention relates to a pump housing and to a method for producing said pump housing, the pump housing (20) comprising at least one first partial region (26), at least two further partial regions (28, 28), and at least one third partial region (30), the at least one first partial region (26) comprising at least 60 wt%, with respect to the total weight of the first partial region (26), of at least one non-magnetic material; the at least two further partial regions (28, 28) comprising each at least 25 wt%, with respect to the total weight of the respective further partial region (28, 28), of at least one ferromagnetic material; the at least one third partial region (30) comprising a metal content in a range of 40 to 90 wt%, with respect to the total weight of the third partial region (30), and the at least one first partial region (26) and at least one of the at least two further partial regions (28, 28) being connected to each other in a bonded manner.


Grant
Agency: European Commission | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-02-2014 | Award Amount: 181.08M | Year: 2015

The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative device architecture and comprising demonstration of a lithographic platform for EUV and immersion technology, advanced process and holistic metrology platforms, new materials and mask infrastructure. A lithography scanner will be developed based on EUV technology to achieve the 7nm module patterning specification. Metrology platforms need to be qualified for N7s 1D, 2D and 3D geometries with the appropriate precision and accuracy. For the 7nm technology modules a large number of new materials will need to be introduced. The introduction of these new materials brings challenges for all involved processes and the related equipment set. Next to new deposition processes also the interaction of the involved materials with subsequent etch, clean and planarization steps will be studied. Major European stakeholders in EUV mask development will collaboratively work together on a number of key remaining EUV mask issues. The first two years of the project will be dedicated to find the best options for patterning, device performance, and integration. In the last year a full N7 integration with electrical measurements will be performed to enable the validation of the 7nm process options for a High Volume Manufacturing. The SeNaTe project relates to the ECSEL work program topic Process technologies More Moore. It addresses and targets as set out in the MASP at the discovery of new Semiconductor Process, Equipment and Materials solutions for advanced CMOS processes that enable the nano-structuring of electronic devices with 7nm resolution in high-volume manufacturing and fast prototyping.

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