Heimann Sensor GmbH

Dresden, Germany

Heimann Sensor GmbH

Dresden, Germany
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Grant
Agency: European Commission | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-02-2014 | Award Amount: 38.98M | Year: 2015

The Advanced Distributed Pilot Line for More-than-Moore Technologies project (ADMONT) is focused on a powerful and versatile More-than-Moore (MtM) pilot line for Europe increasing the diversification of CMOS process technologies. The combination of existing expertise, technological capabilities and the manufacturing capacity of industrial and research partners creates a whole new ecosystem within Europes biggest silicon technology cluster Silicon Saxony. The distributed pilot line utilizes various MtM platform technologies for sensor and OLED processing in combination with baseline CMOS processes in a unique way and incorporates 2.5D as well as 3D integration of silicon systems into one single production flow. The technology modules, equipment and processes are not located in one single clean room, but are distributed between partners located in Dresden. This local concentration of micro- and nanotechnology facilities has various advantages for potential customer since it enables a short production cycle time and fast delivery. Such distributed MtM pilot line is unique in Europe as well as worldwide and will be implemented as one-stop-shop for partners and customer. It is supported by advanced design technologies to address the challenges of modelling and simulation of MtM relevant aspects like reliability, degradation effects, process variability, and IT solution aspects for MtM smart fabrication, fab automation and data processing to generate a smart infrastructure. The distributed pilot line is working as an open platform and is able to integrate future technologies for autonomous and smart system solutions. ADMONT is focused on four main key applications: smart energy, smart mobility, smart health, and smart production and essential capabilities like semiconductor process equipment and materials, design technology and smart system integration. The project consortium is organized and working along the value chain for ECS technologies in Europe.


The BioMEMS and microsystem market in the healthcare market are expected to witness a significant growth through the forecast period, growing at a CAGR of around 25%. The primary driver for the growth of the market is the development of patient monitoring equipment, which also helps in detecting early symptoms of diseases, thus reducing the mortality rate. BioMEMS and microsystems play a vital role in the clinical and biomedical applications by monitoring some of the most critical health-related challenges such as the cost of health care and disease prevention techniques. Moreover, with the introduction of BioMEMS devices there is a massive possibility of improving the delivery systems of the transdermal drug, which, at present, are limited to passive diffusion devices. Segmentation of the BioMEMS and microsystem market in healthcare by application The BioMEMS and microsystems market will witness a rapid growth in the forecast period due to the increased use of microfluidics in healthcare applications. The microfluidic segment constitutes the largest share in the BioMEMS and microsystems market, growing at a CAGR of almost 27%. Geographical segmentation of the BioMEMS and microsystem market in healthcare The Americas is the largest contributor to the BioMEMS and microsystem market in healthcare, accounted for about 50% of the market share, which is mainly due to the increasing demand of lifestyle products for health monitoring. Primary vendors of the BioMEMS and microsystem market in healthcare The top vendors of the BioMEMS and microsystem market in healthcare are: One advantage of the BioMEMS device is that it can be implanted into a specific region of the body for localized drug therapy, which is a major trend captivating the vendors and simultaneously boosting the market growth in the forecast period. Some other prominent vendors in the market include Becton, Dickinson and Company, Boston Scientific, CapitalBio, e2v, Heimann Sensor, Lepu Medical, Mec, Micron Technology, Nanopass, OMRON, Teledyne DALSA, and United Gene High-Tech Group. Other section of the report includes an analysis of the following Key drivers, challenges, trends, and their impact on the BioMEMS and microsystem market in healthcare Five forces analysis of the BioMEMS and microsystem market in healthcare Detail overview of the market size and forecast For more information or any query mail at [email protected] Wise Guy Reports is part of the Wise Guy Consultants Pvt. Ltd. and offers premium progressive statistical surveying, market research reports, analysis & forecast data for industries and governments around the globe. Wise Guy Reports understand how essential statistical surveying information is for your organization or association. Therefore, we have associated with the top publishers and research firms all specialized in specific domains, ensuring you will receive the most reliable and up to date research data available.


Herrmann F.,Heimann Sensor GmbH | Forg B.,Heimann Sensor GmbH | Schieferdecker J.,Heimann Sensor GmbH | Leneke W.,Heimann Sensor GmbH | Simon M.,Heimann Sensor GmbH
Technisches Messen | Year: 2014

Thermopile sensor arrays are a low-cost option for taking thermal images with lower requirements for spatial resolution. A modified monolithic CMOS technology with smaller pattern size and surface micromachining with better structural precision makes thermopile arrays possible with a resolution of up to 3968 pixels so far. New packaging technologies using gases with low heat conduction lead to high values of sensitivity of 400 V/W. Measurements of sensors packaged in vacuumhousings show even higher values of 800 V/W.


Patent
Heimann Sensor GmbH | Date: 2013-01-18

Thermopile infrared sensor structure with a high filling level in a housing filled with a medium (15), consisting of a carrier substrate (11) which has electrical connections (28, 28) to the outside and is closed with an optical assembly (13), wherein a sensor chip (14) is applied to the carrier substrate (11) in the housing, which chip has a plurality of thermoelectric sensor element structures (16), the so-called hot contacts (10) of which are located on individual diaphragms (3) which are stretched across a respective cavity (9) in a silicon carrying body (24) with good thermal conductivity, wherein the cold contacts (25) are located on or in the vicinity of the silicon carrying body (24). The problem addressed by the invention is that of specifying a thermopile infrared array sensor (sensor cell) which, with a small chip size, has a high thermal resolution and a particularly high filling level. This sensor is preferably intended to be operated in gas with a normal pressure or a reduced pressure and is intended to be able to be mass-produced in a cost-effective manner under ultra-high vacuum without complicated technologies for closing the housing. This is achieved by virtue of the fact that a radiation collector structure (17) is located above each individual diaphragm (3) of the sensor element structures (16) which spans a cavity (9).


Patent
Heimann Sensor Gmbh | Date: 2011-01-13

A thermal infrared sensor is provided in a housing with optics and a chip with thermoelements on a membrane. The membrane spans a frame-shaped support body that is a good heat conductor, and the support body has vertical or approximately vertical walls. The object is to provide a thermopile infrared sensor in monolithic silicon micromachining technology, wherein the infrared sensor has a high thermal resolution capacity with a small chip size, a high degree of filling and a high response rate. The thermopile sensor structure consists of a few long thermoelements per sensor cell. The thermoelements being arranged on connecting webs that connect together hot contacts on an absorber layer to cold contacts of the thermoelements. The membrane is suspended by one or more connecting webs and has, on both sides of the long thermoelements, narrow slits that separate the connecting webs from both the central region and also the support body. At least the central region is covered by the absorber layer.

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