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Lausanne, Switzerland

Costa-Patry E.,Heat and Mass Transfer Laboratory | Nebuloni S.,Heat and Mass Transfer Laboratory | Olivier J.,Heat and Mass Transfer Laboratory | Thome J.R.,Heat and Mass Transfer Laboratory
IEEE Transactions on Components, Packaging and Manufacturing Technology

Hot-spots are present in micro-electronics and are challenging to cool effectively. This paper presents highly nonuniform heat flux measurements obtained for a pseudo-CPU with 35 local heaters and temperature sensors cooled by a silicon multi-microchannel evaporator with 85 μ-wide wide and 560 μ-wide high channels separated by 46 μ-wide wide fins. A low pressure dielectric refrigerant, R245fa, was used as evaporating test fluid. The base heat flux was varied from 6 to 160 cm 2 and the junction temperature always remained below 65°, while the fluid inlet saturation temperature was 30.5°C. On-chip two-phase cooling was found to very effectively cool the hot-spots without inducing flow instabilities. Building on analogous uniform heat flux tests made on the same test section, the effects of position, orientation size, and strength of the hot-spots were analyzed. © 2011 IEEE. Source

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