Harima Chemicals Inc.

Tsukuba, Japan

Harima Chemicals Inc.

Tsukuba, Japan

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Patent
UACJ Corporation and Harima Chemicals Inc. | Date: 2017-04-05

A heat-exchanger tube comprises a tube main body that is composed of an aluminum alloy and a coating applied onto a surface of the tube main body. The coating contains a powder mixture-which includes: 1 g/m^(2) or more and 7 g/m^(2) or less of an Si powder, 0.2 g/m^(2) or more and 4.0 g/m^(2) or less of a Zn powder, 0.5 g/m^(2) or more and 5.0 g/m^(2) or less of a first flux powder composed of a compound that contains Zn, and 5 g/m^(2) or more and 20 g/m^(2) or less of a second flux powder composed of a compound that does not contain Zn -and a binder. The total amount of the powder mixture in the coating is 30 g/m^(2) or less. The proportion of the binder in the coating is 5-40 mass%.


Patent
Harima Chemicals Inc. | Date: 2017-01-25

The acrylamide-based polymer is produced by polymerizing a polymer component including (meth)acrylamide, a quaternary ammonium-based monomer, and (meth)allylsulfonic acid salt, but not including either a crosslinkable monomer containing nitrogen or a tertiary amino-based monomer.


Patent
Harima Chemicals Inc. | Date: 2017-05-24

In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass% or more and below 0.2 mass%; the content ratio of the copper is 0.1 mass% or more and 1 mass% or less; the content ratio of the bismuth is above 4.0 mass% and 10 mass% or less; the content ratio of the antimony is 0.005 mass% or more and 8 mass% or less; the content ratio of the indium is 0.005 mass% or more and 2 mass% or less; the content ratio of the nickel is 0.003 mass% or more and 0.4 mass% or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.


Patent
Harima Chemicals Inc. | Date: 2016-02-03

A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass% or more and 5 mass% or less; the content ratio of the copper is 0.1 mass% or more and 1 mass% or less; the content ratio of the bismuth is 0.5 mass% or more and 4.8 mass% or less; the content ratio of the nickel is 0.01 mass% or more and 0.15 mass% or less; the content ratio of the cobalt is 0.001 mass% or more and 0.008 mass% or less; the content ratio of the indium is above 6.2 mass% and 10 mass% or less; and the content ratio of the tin is the remaining ratio.


Agglomerated silica is obtained by mixing silica with a rosin resin to be agglomerated.


Patent
Harima Chemicals Inc. | Date: 2016-11-16

A solder alloy substantially consists of tin, silver, indium, bismuth, and antimony. With respect to the total amount of the solder alloy, the content ratio of the silver is 2.8 mass% or more and 4 mass% or less; the content ratio of the indium is 6.2 mass% or more and 9.0 mass% or less; the content ratio of the bismuth is 0.7 mass% or more and 5.0 mass% or less; the content ratio of the antimony is 0.3 mass% or more and 5.0 mass% or less; and the content ratio of the tin is the remaining ratio and the value of A in the discriminant (1) is 4.36 or less.


A metal fine particle dispersant is obtained by reaction of a polymer (a) containing a first reactive functional group, an ionic group to be absorbed to metal fine particles, and a polyoxyalkylene side chain with a compound (b) containing a second reactive functional group to be bonded to the first reactive functional group and an active energy ray curable group to be cured by an active energy ray. A metal fine particle dispersion liquid containing the metal fine particle dispersant, metal fine particles, and a dispersion medium is prepared. The metal fine particle dispersion liquid is cured, thereby obtaining a cured film.


Patent
Harima Chemicals Inc. | Date: 2016-02-17

An aqueous aluminum brazing composition contains, as a binder resin, a water-soluble/dispersible polyurethane resin that exhibits a residual ratio in a 400C heating environment of 60% by mass or less and exhibits a residual ratio in a 520C heating environment of 1.0% by mass or less.


Patent
Harima Chemicals Inc. | Date: 2015-09-02

A brazing composition contains 1 part by mass or more and 10 parts by mass or less of Zn powder, 1 part by mass or more and 5 parts by mass or less of Si powder, 3 parts by mass or more and 10 parts by mass or less of K-Al-F flux, 1 part by mass or more and 3 parts by mass or less of (meth)acrylic resin, wherein the mass ratio (Zn/Si) of Zn powder relative to Si powder is 1 or more and 5 or less.


Patent
Harima Chemicals Inc. | Date: 2015-11-04

A soldering flux of the present invention contains, as a base resin, an acrylic resin (A) having an acid value of 0 to 70, and an acrylic resin (B) having an acid value of 30 to 230. The acrylic resin (A) is obtained by polymerization of a monomer mixture containing alkyl (meth)acrylate having an alkyl group having carbon atoms of 12 to 23. The acrylic resin (B) is obtained by polymerization of a monomer mixture containing alkyl (meth)acrylate having an alkyl group having carbon atoms of 6 to 10. The acid value of the acrylic resin (B) is higher than the acid value of the acrylic resin (A), and a difference between these two resins is 15 or more.

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