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Wiener Neustadt, Austria

After the great success of the previous European Pulse Plating Seminars the 7th such conference was held in Vienna, once again, on 3rd and 4th March 2016, marking the 10 year anniversary since the first Pulse Plating Seminar was held in Vienna in 2006. For the second time, the Pulse Plating conference was combined with the annual scientific meeting EAST Forum of the European Academy for Surface Technology (EAST). Owing to this combination, the event could be enlarged to a 2-day conference, providing 26 presentations to the interested audience. The conference and the parallel exhibition focussed on both the scientific and the industrial approach of modern electrochemical surface technology, with a special focus on the pulse plating technique on the second day. Seventy-five participants coming from 16 different countries helped maintain an intensive and very productive discussion on the topic that will be continued in 2018 at the 8th European Pulse Plating Seminar in Vienna. The next EAST Forum will be held in 2017. © 2016 Institute of Materials Finishing. Source


Hansal W.E.G.,Happy Plating GmbH
Galvanotechnik | Year: 2013

Pulse plating has for many years been a prominent topic for discussion and indeed could be said to have assumed almost mystical properties. There have been countless publications based on laboratory work, mostly reporting superb results. By contrast, very little has been reported on large-scale production plating operations using this technology. Almost all Metal Finishing businesses and production plants to have adopted this technology (which has in most cases proved successful) have chosen not to announce the fact. As a result, the question is asked again and again whether pulse plating is in fact suited for use on a large industrial scale and whether there might not be insuperable scale-up problems associated with this. Source


Steinhausser F.,Vienna University of Technology | Talai A.,Friedrich - Alexander - University, Erlangen - Nuremberg | Sandulache G.,Happy Plating GmbH | Weigel R.,Friedrich - Alexander - University, Erlangen - Nuremberg | And 4 more authors.
Microelectronics Reliability | Year: 2016

Advanced high frequency systems such as needed in modern radar applications, require high conductive metallizations as well as substrates with areas of variable permittivity. This paper presents the combination of the selective porosification technology of low temperature co-fired ceramics (LTCC) and electro pulse plated silver microstrip lines. By means of selective plating methods, line widths of 20. μm can be manufactured featuring low resistivity values down to 2.33. μΩ. cm, without detectable pore penetration. The substrate permittivity is measured facilitating a combined method of ring resonator detuning and 3D field simulations resulting in a reduction of 6.5% with a shift from approx. 7.52 to 7.03 at 66. GHz due to the porosification. As often outlined in literature, the major challenge in using silver as a conductor lies in its high tendency of agglomeration and microstructural transformation especially in oxygen containing atmosphere even at low temperatures. Therefore, the effect of different temperature loads up to 500. °C on the dc film resistivity is measured using the van der Pauw technique and is compared to scanning electron microscope analyses. © 2016 Elsevier Ltd. Source


Hansal W.E.G.,Happy Plating GmbH | Steiner H.,Vienna University of Technology | Steiner H.,Danube University Krems | Mann R.,Happy Plating GmbH | And 4 more authors.
Microsystem Technologies | Year: 2014

Nickel is a common material in micro fabrication because of its fatigue resistance and its mechanical properties. It is used for instance for thermal actuators, micro-grippers, or RF-switches. The defined electro deposition of the nickel matrix is crucial for the properties and functionality of e.g., thermal actuators. Micro galvanic processes are the basis of this electro deposition, and require knowledge of the electrochemical fundamentals as well as numerical electrochemical process simulation for adjustment. Especially, realization of high aspect ratios requires the application of sophisticated plating techniques such as pulse reverse deposition. The pulse plating process is adjusted using the results of electrochemical numerical simulation routines, visualizing the (local) potential field and the current field line distribution as a function of the applied electrochemical parameters. Compact, completely void free structures can be obtained by applying the developed pulse plating process to Si wafers that are structured with photo resist. Nickel is chosen for electro deposition due to its chemical stability and its hardness. MEMS structures are designed to convert the thermal expansion of the material into an in-plane deflection. A custom made measurement setup, consisting of a sealable chamber, a Peltier element with a temperature control unit, and an optical microscope is used to measure these deflections at different temperatures. A set of cantilever structures with different lengths is used to evaluate the Young's modulus and the vertical stress gradient of the plated materials. Additional, finite element simulations are carried out to determine the thermal expansion coefficient of the plated Nickel, by fitting the simulation and the measurement results. © 2013 Springer-Verlag Berlin Heidelberg. References:. Source


Hansal W.E.G.,Happy Plating GmbH | Sandulache G.,Happy Plating GmbH | Mann R.,Happy Plating GmbH | Leisner P.,Jonkoping University College
Electrochimica Acta | Year: 2013

This paper describes the effect of modulated bipolar current (pulse reverse plating) on the incorporation of micron and submicron sized SiC particles within an electrodeposited Ni-P alloy matrix (dispersion coating). Based on electrochemical measurements, a pulse plating process has been defined and the effects of pulse parameters (type of current, frequency of current pulses and current density), the electrolyte composition and the size of the silicon carbide on the particles incorporation rate, phosphorus co-deposition rate, surface morphology, structure, micro hardness and wear resistance of the deposits has been investigated. The experimental results show that the phosphorus co-deposition and the particles incorporation rate decrease applying higher current density. The reduction of particle size decreases the co-deposition content of the particles within the coating. Application of pulsed current leads to a more compact composite coating, significantly improving the hardness and the tribological behaviour of the Ni/SiC deposits, mainly at higher frequency of the applied current pulses. DC and bipolar pulses generate unfavourable higher co-deposition rate of phosphorus, hence a loss in hardness has been observed. Tailored shift of the properties and alloy composition during the deposition process can be achieved by change of matrix properties via alternation of the pulse sequences. © 2013 Published by Elsevier Ltd. Source

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