Liu Y.,Guilin University of Technology |
Wang J.-B.,Guilin Research Institute of Geology Mineral Resources |
Chen C.,Guilin Research Institute of Geology Mineral Resources |
Lv Z.,Guilin University of Technology |
And 3 more authors.
Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering | Year: 2012
Endless electroplated diamond wire is a kind of cutting tool with the diamond grits fixed on the steel wire substrate. The material selection of steel wire substrate, welding method, and the production process of endless electroplated diamond wire saw were expounded. The slicing experiment on polysilicon was carried out by using self-made endless electroplated diamond wire saw, the cutting processing parameters were wire saw speed 20~40 m/s, workpiece feed speed 2~10 mm/min and wire saw tension 60~100 N. The experiment results showed that the endless electroplated diamond wire saw had good performance. The sliced silicon wafer had excellent surface quality and low surface roughness R a of 0.328~0.562 μm.