Entity

Time filter

Source Type

San Jose, CA, United States

Grant
Agency: Cordis | Branch: FP7 | Program: CP | Phase: ICT-2009.3.7 | Award Amount: 3.92M | Year: 2010

Optical connectivity in data centers relies on 10Gb/s parallel optics that raise scalability and energy consumption issues. Efforts towards advanced modulation formats pose severe system complexity. The upgrade to 100 Gb/s to resolve the bandwidth bottleneck and increase the throughput of optical interconnect backplanes requires a disruptive yet straightforward solution. POLYSYS aims to provide this solution and realize 100Gb/s serial connectivity for rack-to-rack and chip-to-chip interconnects. POLYSYS will use electro-optic polymer as an integration platform where 100Gb/s modulators will be integrated monolithically, whereas InP lasers, detectors and electronics will be integrated hybridly. The InP-to-polymer integration technique will enable 95% coupling efficiency without using lenses and bulk optics. POLYSYS will fabricate the first serial 100Gb/s and 4x100Gb/s transmitters integrated with <1W-consuming electronic driver ICs, achieving 10 times higher line rates than mainstream 10 Gb/s VCSEL or silicon-based commercial products. POLYSYS will furthermore integrate 4x100Gb/s optoelectronic receivers monolithically in InP. The receivers will exhibit a high conversion gain to enable direct connectivity without optical amplifiers. The electronics will be integrated in arrays and the DEMUX circuit will demonstrate record low sensitivity. POLYSYS will demonstrate 4x100Gb/s direct data interconnection, increasing by 4 times the total throughput and reducing at least by a factor of 2 the required Energy/bit with respect to commercially available products. By demonstrating optical demultiplexing based on polymer, POLYSYS will show that the energy/bit can be further decreased by a factor of 5. Finally, POLYSYS will demonstrate serial 100Gb/s chip-to-chip interconnection by integrating transmitter and receiver at both ends of a polymer waveguide chip. As such POLYSYS will show compatibility with polymer backplanes and provide the technology for a tenfold capacity upgrade.


Patent
Gigoptix | Date: 2010-12-08

An integrated circuit is configured for optical communication via an optical polymer stack located on top of the integrated circuit. The optical polymer stack may include one or more electro-optic polymer devices including an electro-optic polymer. The electro-optic polymer may include a host polymer and a second order nonlinear chromomophore, the host polymer and the chromophore both including aryl groups configured to interact with one another to provide enhanced thermal and/or temporal stability.


According to an embodiment, an electro-optic polymer comprises a host polymer and a guest nonlinear optical chromophore having the structure D--A, wherein: D is a donor, is a -bridge, and A is an acceptor; a bulky substituent group is covalently attached to at least one of D, , or A; and the bulky substituent group has at least one non-covalent interaction with part of the host polymer that impedes chromophore depoling.


According to an embodiment, an electro-optic polymer comprises a host polymer and a guest nonlinear optical chromophore having the structure D--A, wherein: D is a donor, is a -bridge, and A is an acceptor; a bulky substituent group is covalently attached to at least one of D, , or A; and the bulky substituent group has at least one non-covalent interaction with part of the host polymer that impedes chromophore depoling.


An optical sub assembly can include a distributed feedback (DFB) tunable laser and an optical modulator. Wavelength selection and phase adjustment portions of the DFB laser, as well as an electro-optic (EO) modulator can be formed from polymer waveguides including hyperpolarizable chromophores disposed on a single substrate.

Discover hidden collaborations