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Grant
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2009.3.8 | Award Amount: 3.52M | Year: 2010

In the SOFI project, new active optical waveguides and integrated optoelectronic circuits based on a novel silicon-organic hybrid technology are introduced. The technology is based on the low-cost CMOS process technology for fabrication of the optical waveguides - allowing for the convergence of electronics with optics. It is complemented by an organic layer that brings in new functionalities so far not available in silicon. Recent experiments have shown that such a technology can boost the signal processing in silicon far beyond 100 Gbit/s - which corresponds to a tripling of the state-of-the art bitrate.\nSOFI focuses on a proof-of concept implementation of ultra-fast ultra-low energy optical phase modulator waveguides such as needed in optical communications. These devices will ultimately be used to demonstrate an integrated circuit enabling the aggregation of low-bitrate electrical signals into a 100 Gbit/s OFDM data-stream having an energy consumption of only 5 fJ/bit. However, the SOFI technology is even more fundamental. By varying the characteristics of the organic layer one may also envision new sensing applications for environment and medicine.\nThe suggested approach is practical and disruptive. It combines the silicon CMOS technology and its standardized processes with the manifold possibilities offered by novel organic materials. This way, for instance, the processing speed limitations inherent in silicon are overcome, and an order-of-magnitude improvement can be achieved. More importantly, the new technology provides the lowest power consumption so far demonstrated for devices in its class. This is supported by calculations and first initial tests. The low power consumption is attributed to the tiny dimensions of the devices and to the fact, that optical switching is performed in the highly nonlinear cladding organic material rather than in silicon.


Grant
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2013.3.2 | Award Amount: 5.36M | Year: 2014

Multi-rate, multi-format and multi-reach operation of optical transceivers is important, but it is not enough for next generation terabit products. What is still missing to make these products viable is a solution for the flexible control of this enormous capacity at the optical layer and its distribution among a number of independent optical flows. PANTHER aims to provide this solution and develop multi-rate, multi-format, multi-reach and multi-flow terabit transceivers for edge switches and data-center gateways. To this end, PANTHER will combine electro-optic with passive polymers and will develop a novel photonic integration platform with unprecedented potential for high-speed modulation and optical functionality on-chip. It will also rely on the combination of polymers with InP gain chips and photodiode arrays, and on the use of the InP-DHBT platform for driving circuits based on 3-bit power-DACs and high-speed TIA arrays. Using 3D integration techniques, PANTHER will integrate these components in compact system-in-package transceivers capable of operation at rates up to 64 Gbaud, operation with formats up to DP-64-QAM, spectral efficiency up to 10.24 b/s/Hz, capacity using a dual-carrier scheme up to 1.536 Tb/s, and flexibility in the generation and handling of multiple optical flows on-chip. This impressive performance will come with a potential for 55% power consumption reduction and more than 60% cost/bit reduction, taking into account benefits from the material system, the integration concept, the operation at high baud-rates and the possibility for IP traffic offloading. PANTHER will incorporate the transceivers in edge switch and data-center gateway architectures and will evaluate their performance in lab and real-network settings. Finally, PANTHER will develop a thin software layer that will control the operation parameters of the transceivers, pioneering in this way the efforts for extending the SDN hierarchy down to the flexible optical transport.


Grant
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2009.3.7 | Award Amount: 3.92M | Year: 2010

Optical connectivity in data centers relies on 10Gb/s parallel optics that raise scalability and energy consumption issues. Efforts towards advanced modulation formats pose severe system complexity. The upgrade to 100 Gb/s to resolve the bandwidth bottleneck and increase the throughput of optical interconnect backplanes requires a disruptive yet straightforward solution. POLYSYS aims to provide this solution and realize 100Gb/s serial connectivity for rack-to-rack and chip-to-chip interconnects. POLYSYS will use electro-optic polymer as an integration platform where 100Gb/s modulators will be integrated monolithically, whereas InP lasers, detectors and electronics will be integrated hybridly. The InP-to-polymer integration technique will enable 95% coupling efficiency without using lenses and bulk optics. POLYSYS will fabricate the first serial 100Gb/s and 4x100Gb/s transmitters integrated with <1W-consuming electronic driver ICs, achieving 10 times higher line rates than mainstream 10 Gb/s VCSEL or silicon-based commercial products. POLYSYS will furthermore integrate 4x100Gb/s optoelectronic receivers monolithically in InP. The receivers will exhibit a high conversion gain to enable direct connectivity without optical amplifiers. The electronics will be integrated in arrays and the DEMUX circuit will demonstrate record low sensitivity. POLYSYS will demonstrate 4x100Gb/s direct data interconnection, increasing by 4 times the total throughput and reducing at least by a factor of 2 the required Energy/bit with respect to commercially available products. By demonstrating optical demultiplexing based on polymer, POLYSYS will show that the energy/bit can be further decreased by a factor of 5. Finally, POLYSYS will demonstrate serial 100Gb/s chip-to-chip interconnection by integrating transmitter and receiver at both ends of a polymer waveguide chip. As such POLYSYS will show compatibility with polymer backplanes and provide the technology for a tenfold capacity upgrade.


Patent
Gigoptix | Date: 2011-09-16

Multiple pins extend from the outside to the inside of an optical sub-assembly. A light receiver or a light transmitter is arranged inside the optical sub-assembly. A receiver circuit and transmitter circuit (TX) are arranged inside the optical sub-assembly and connected between the multiple pins and the light receiver and the light transmitter. The receiver circuit comprises a receiver communication interface in order to transform an output signal of the light receiver into a communication signal, and wherein the transmitter circuit comprises a transmitter communication interface to transform a communication signal into an input signal of the light transmitter. A control interface is connected with the receiver circuit and the transmitter circuit arranged inside the optical sub-assembly, wherein the control interface is connectable to two of the multiple pins.


Patent
Gigoptix | Date: 2012-11-11

A dual polarization quadrature modulator includes an input planar lightwave circuit (PLC) configured to deliver coherent light to a polymer-on substrate device including a plurality of electro-optic (E-O) polymer optical modulation waveguides configured to each phase modulate the coherent light, and the E-O polymer optical modulation waveguides output modulated coherent light to an output PLC configured to combine waveguide pairs of phase modulated light into Mach-Zehnder interferometric signals, combine pairs of Mach-Zehnder interferometric signals into quadrature modulated signals. A polarization rotator rotates modulated light from one of the quadrature modulated signals into an orthogonal polarization. The output PLC combines the quadrature-modulated and rotated quadrature modulated light to form a dual polarization, quadrature modulated light signal. The PLCs and the polymer-on-substrate device are integrated onto a single assembly substrate.


According to an embodiment, an electro-optic polymer comprises a host polymer and a guest nonlinear optical chromophore having the structure D--A, wherein: D is a donor, is a -bridge, and A is an acceptor; a bulky substituent group is covalently attached to at least one of D, , or A; and the bulky substituent group has at least one non-covalent interaction with part of the host polymer that impedes chromophore depoling.


The present invention relates to a linear, high sensitivity, high speed trans-impedance amplifier (TIA) Which allows a large dynamic range of input current up to very large values, maintains high linearity and keeps constant output voltage, maintains the same frequency response across the full gain control range, provides very high input sensitivity and large bandwidth, and allows input current monitoring without affecting input sensitivity. In other words, the novel circuit disclosed herein provides for the feedback path to maintain the same level of feedback even while the output signal is varied. This allows a wide and stable bandwidth, as well as a monitor to be placed in the TIA.


Patent
Gigoptix | Date: 2012-03-21

The invention concerns an optical sub-assembly. Multiple pins extend from the outside to the inside of optical sub-assembly. A light receiver (PD) or a light transmitter (VCSEL) is arranged inside the optical sub-assembly. A receiver circuit (RX) respectively a transmitter circuit (TX) is arranged inside the optical sub-assembly and connected between the multiple pins and the light receiver (PD) respectively the light transmitter (VCSEL), wherein the receiver circuit comprises a receiver communication interface (AP, AN) in order to transform an output signal of the light receiver (PD) into a communication signal, and wherein the transmitter circuit comprises a transmitter communication interface (ZP, ZN) in order to transform a communication signal into an input signal of the light transmitter (VCSEL). A control interface (SCL, SDA) connected with the receiver circuit (RX) respectively the transmitter circuit (TX) is arranged inside the optical sub-assembly, wherein the control interface (SCL, SDA) is connectable to two of the multiple pins.


An optical sub assembly can include a distributed feedback (DFB) tunable laser and an optical modulator. Wavelength selection and phase adjustment portions of the DFB laser, as well as an electro-optic (EO) modulator can be formed from polymer waveguides including hyperpolarizable chromophores disposed on a single substrate.


A low index of refraction hybrid optical cladding may be formed from a fluorinated sol-gel. An electro-optic device may include a poled organic chromophore-loaded modulation layer (electro-optic polymer) and at least one adjacent fluorinated hybrid sol-gel cladding layer.

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