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Burkhart M.,Georg Fischer Piping Systems | Mueller H.,Georg Fischer Piping Systems
Ultrapure Water | Year: 2011

A test was conducted to examine the use of deionized materials for piping system to transport water. Samples of 32-millimeter and 50-mm outside diameter PE pipes and fittings were obtained through normal distribution channels and in their original factory packaging. The test items were capped and placed in an oven along with the perfluoroalkoxy vessels containing the pipe pieces. A set of 5 blanks was prepared to determine the detection limits and the preparation procedure. The detection limits for the elements are defined as three times the standard deviation of the blank solutions using a 3-sigma method. The study showed that piping systems out of thermoplastic materials like PE, PP, and polyvinylidene fluoride (PVDF) show a quite forgiving behavior under cycling loads or hydraulic shocks. The level of E-Modulus can indicate the ability to absorb cycling loads. A low E-Modulus means that the material can compensate cycling loads or hydraulic shocks by deformation. Source


Wermelinger J.,Georg Fischer Piping Systems | Mueller H.,Georg Fischer Piping Systems | Burkhart M.,Hi Pure Technology Inc.
Ultrapure Water | Year: 2011

450-mm wafer processing is coming sooner ratherthan later. Thelntemational Technology Roadmap for Semiconductors along with SEMI arc already making plans for the transition via timeline considerations (16) in the former and wafer specification documentation (17) in the latter. Gaigini (18) speculates that, "Moore's Law could be extended indefinitely via new architectures, heterogeneous integration, 3D" (19), suggesting that 450 mm might not be the end of wafer size needed a few more years down the road. The thermal plastic pipe maker has decided to be prepared in advance and to be ready when fabs needed materials for construction. The patent-pending twin concept of segmented fittings and associated installation equipment out lined in this article demonstrates that large, cleanconduits suitable for450-mm wafer fabs are dovetailing the seeds of the arketplace when the transitionfrom 300 mm to 450 mm takes place. Finite element analysis confirms that the twin concept has less stress than fully molded fittings. Source

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