Tokyo, Japan

Furukawa Electric Co., Ltd. is a Japanese electric and electronics equipment company. The company was founded by Furukawa Ichibei in 1884 in Yokohama when a copper-smelting facilityand a wire manufacturing factory were established. Furukawa was a Japanese businessman who founded one of the fifteen largest industrial conglomerates in Japan, called Furukawa zaibatsu, to which Furukawa Electric belongs to this day. The company is listed on the Tokyo stock Exchane and is constituent of the Nikkei 225 stock index.Furukawa Electric aids CERN's experiments on the search for the Higgs boson with its superconducting magnet wires. The company's products also include superconductivity cables.As of July 2013 the company has 137 subsidiaries and affiliate companies across Japan, Europe, North and South America. Wikipedia.


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Patent
Furukawa Electric Group | Date: 2017-01-13

The present invention provides a two-layer structure colored optical fiber which includes a colored secondary coating layer improved in collectability and separability. The two-layer structure colored optical fiber in an embodiment of the present invention includes a glass optical fiber, a primary coating layer coating the glass optical fiber, and a colored secondary coating layer coating the primary coating layer. The secondary coating layer has such characteristics that a surface cure percentage is 99% or more at an infrared absorption peak of a wave number of 1407 cm^(1 )and a surface kinetic friction force in Knot Test is less than 0.075 N.


A method of producing an optical fiber, comprising:(a) a resin application step of applying an ultraviolet curable resin, onto an outer circumference of an optical fiber;(b) a heating step of heating the ultraviolet curable resin; and(c) a light irradiation step of irradiating the ultraviolet curable resin with ultraviolet light emitted from a semiconductor light emitting element, in a state in which the ultraviolet curable resin is heated, to cure the ultraviolet curable resin into a coating resin.


A connector with built-in bent optical fibers includes an optical fiber array including a plurality of bent optical fibers each having a bent portion and a linear portion formed integrally with the bent portion, a ferrule having a plurality of positioning mechanisms that align end portions of the plurality of bent optical fibers, and a resin portion disposed at an outer periphery of the bent portion. The resin portion is filled in the ferrule. The bent portion has a bending angle of 85-150. When the bent portion of one bent optical fiber is divided into a plurality of regions along a longitudinal direction at 10, a variation in bend radius among the plurality of regions excluding regions corresponding to 10 at both ends is 0.3 mm or less, an outer diameter of the bent portion of the bent optical fiber is smaller than an outer diameter of the linear portion.


Patent
Furukawa Electric Group | Date: 2017-01-27

A method of producing an optical fiber preform includes: an alkali-metal-doped silica glass body forming step of forming an alkali-metal-doped silica glass body doped with an alkali metal; a silica glass body forming step of forming a silica glass body to be at least a portion of a core portion around the alkali-metal-doped silica glass body such that the silica glass body contacts the alkali-metal-doped silica glass body; and a diffusing step of diffusing the alkali metal from the alkali-metal-doped silica glass body to the silica glass body by a heat treatment.


Patent
Furukawa Electric Group | Date: 2017-01-30

A planar heat pipe including a container having a protruded portion provided at a central part thereof, the protruded portion having a hollow portion formed by two plate-shaped bodies opposing each other, and a working fluid enclosed in the hollow portion. The hollow portion is provided with a wick structure. A peripheral portion surrounding the protruded portion is sealed by welding by applying heat. A groove is provided around the protruded portion between the protruded portion and a welded portion welded by the welding by applying heat.


An optical fiber sensor includes: a transmitting unit configured to output two lights into an optical fiber, wavelengths of the two lights being different from each other at a specific time, and at least one of the wavelengths of the two lights varying with time; and a measuring unit configured to receive back-scattered light output from the optical fiber and detect a temporal variation of an optical phase at an arbitrary interval in a longitudinal direction of the optical fiber by measuring measure an interference state of the two lights.


Patent
Furukawa Electric Group | Date: 2017-02-02

A semiconductor optical integrated device includes: a substrate; at least a lower cladding layer, a waveguide core layer, and an upper cladding layer sequentially layered on the substrate, a buried hetero structure waveguide portions each having a waveguide structure in which a semiconductor cladding material is embedded near each of both sides of the waveguide core layer; and a ridge waveguide portion having a waveguide structure in which a semiconductor layer including at least the upper cladding layer protrudes in a mesa shape. Further, a thickness of the upper cladding layer in each of the buried hetero structure waveguide portions is greater than a thickness of the upper cladding layer in the ridge waveguide portion.


Patent
Furukawa Electric Group and Fujitsu Limited | Date: 2017-01-26

The present invention provides an optical modulator, which can be reduced in size with size reduction of an optical waveguide and electric wiring as compared to a conventional optical modulator. An optical modulator according to an embodiment includes a substrate; an optical waveguide provided on the substrate and configured to guide light; a modulation unit formed of part of the optical waveguide and configured to modulate the light; and electric wires provided on the substrate and configured to supply a high-frequency electric signal to the modulation unit. One end portion and another end portion of the optical waveguide are provided on a first end surface, one end portion of the electric wiring is provided along the first end surface, another end portion of the electric wiring is provided along a second end surface being different from the first end surface.


Patent
Furukawa Electric Group and Furukawa Automotive Systems Inc. | Date: 2017-02-07

The terminal connection strip includes: a carrier formed in a strip shape; and a plurality of terminal fitting which project from at least one edge side of the carrier in a width direction. The terminal fitting includes a crimping section which connects by crimping at least a conductor tip of an insulated wire provided with the conductor tip where a conductor is covered with an insulating cover and the conductor is exposed by peeling off the insulating cover on a distal end side of the insulated wire to the terminal fitting. The crimping section is formed into a hollow shape which allows the insertion of at least the conductor tip from a proximal end side of the crimping section and allows the crimping section to surround the conductor tip.


Patent
Furukawa Electric Group | Date: 2017-02-07

A semiconductor device includes: a semiconductor layered structure including an active layer, a first region including a part of the active layer and extending in a layered direction, a second region including at least a part of an end portion of the active layer and extending in the layered direction, disordering of the second region being higher than the first region, and a third region including a portion of the active layer between the first region and the second region and extending in the layered direction, disordering of the third region being higher than the first region and lower than the second region; and an electrode configured to inject an electric current to the active layer.

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