Tokyo, Japan

Furukawa Electric Co., Ltd. is a Japanese electric and electronics equipment company. The company was founded by Furukawa Ichibei in 1884 in Yokohama when a copper-smelting facilityand a wire manufacturing factory were established. Furukawa was a Japanese businessman who founded one of the fifteen largest industrial conglomerates in Japan, called Furukawa zaibatsu, to which Furukawa Electric belongs to this day. The company is listed on the Tokyo stock Exchane and is constituent of the Nikkei 225 stock index.Furukawa Electric aids CERN's experiments on the search for the Higgs boson with its superconducting magnet wires. The company's products also include superconductivity cables.As of July 2013 the company has 137 subsidiaries and affiliate companies across Japan, Europe, North and South America. Wikipedia.

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Patent
Furukawa Electric Group | Date: 2017-01-26

An optical fiber fixing structure includes: a cylindrical member; an optical fiber inserted into a hole of the cylindrical member; and a fixing material configured to fix the cylindrical member and the optical fiber, wherein the optical fiber is a polarization maintaining optical fiber having a polarization axis, and a center of the optical fiber is arranged so as to be eccentric to a center of the hole, and an angle formed by an eccentric direction connecting the center of the hole and the center of the optical fiber and the polarization axis is 22.5 to 22.5, or 67.5 to 112.5.


Patent
Furukawa Electric Group | Date: 2017-01-27

A method of producing an optical fiber preform includes: an alkali-metal-doped silica glass body forming step of forming an alkali-metal-doped silica glass body doped with an alkali metal; a silica glass body forming step of forming a silica glass body to be at least a portion of a core portion around the alkali-metal-doped silica glass body such that the silica glass body contacts the alkali-metal-doped silica glass body; and a diffusing step of diffusing the alkali metal from the alkali-metal-doped silica glass body to the silica glass body by a heat treatment.


Patent
Furukawa Electric Group | Date: 2017-01-30

A planar heat pipe including a container having a protruded portion provided at a central part thereof, the protruded portion having a hollow portion formed by two plate-shaped bodies opposing each other, and a working fluid enclosed in the hollow portion. The hollow portion is provided with a wick structure. A peripheral portion surrounding the protruded portion is sealed by welding by applying heat. A groove is provided around the protruded portion between the protruded portion and a welded portion welded by the welding by applying heat.


An optical fiber sensor includes: a transmitting unit configured to output two lights into an optical fiber, wavelengths of the two lights being different from each other at a specific time, and at least one of the wavelengths of the two lights varying with time; and a measuring unit configured to receive back-scattered light output from the optical fiber and detect a temporal variation of an optical phase at an arbitrary interval in a longitudinal direction of the optical fiber by measuring measure an interference state of the two lights.


Patent
Furukawa Electric Group and Furukawa Automotive Systems Inc. | Date: 2017-01-30

Following the cylindrical bend processing of the shape crimping portion corresponding part corresponding to the crimping section in the sheet-shaped terminal base material, the high bending-rate processing process of bend processing at a bending rate higher than a bending rate for plastically deforming at least a part of a deformation portion to be plastically deformed in a predetermined bend processing shape in the crimping portion corresponding part, and the shaping process of shaping the crimping portion corresponding part into the cylindrical crimping section are performed in this order.


Patent
Furukawa Electric Group | Date: 2017-01-31

A semiconductor laser apparatus includes a semiconductor optical integrated device including a semiconductor laser array including a plurality of semiconductor laser elements, a semiconductor arrayed waveguide grating, made of a semiconductor, including an inputting slab waveguide connected to the plurality of the semiconductor laser elements, an array waveguide connected to the inputting slab waveguide and including a plurality of waveguides having different lengths from each other and arranged in a parallel manner, and an outputting slab waveguide connected to the array waveguide; a substrate on which the semiconductor laser array and the semiconductor arrayed waveguide grating are monolithically integrated; and an output facet outputting a laser light emitted from the semiconductor laserelements and including an output end of the outputting slab waveguide.


Patent
Furukawa Electric Group | Date: 2017-01-31

An optical semiconductor apparatus includes: semiconductor laser devices having different emission wavelengths and grouped into at least a first group and a second group; and an arrayed waveguide grating connected to the semiconductor laser devices of the first and second groups and configured to combine laser light beams radiating from the semiconductor laser devices into a same point. The arrayed waveguide grating is configured to combine laser light beams from the semiconductor laser devices belonging to the first group into the same point by diffraction in a first diffraction order in the arrayed waveguide grating, and combine laser light beams from the semiconductor laser devices belonging to the second group into the same point by diffraction in a second diffraction order different from the first diffraction order, in the arrayed waveguide grating.


A connector with built-in bent optical fibers (60) includes an optical fiber array (10) that includes a plurality of bent optical fibers (11), each bent optical fiber of the plurality of bent optical fibers including a bent portion (10d) and a linear portion (10a, 10b); and a ferrule (20) that has a plurality of positioning mechanisms (61) configured to array the end portions (10c) of the plurality of bent optical fibers (11). The bending angle of the bent portion (10d) is 85 to 150.The bent portion (10d) of one of the plurality of bent optical fiber (11) is divided into a plurality of regions along a longitudinal direction at 10, the variation in the bend radius among the plurality of regions excluding regions corresponding to 10 at both ends is 0.3 mm or less, and the an outer diameter of the bent portion (10d) of the optical fiber is smaller than an outer diameter of the linear portion (10a, 10b).


Patent
Furukawa Electric Group | Date: 2017-09-20

The areas of fin plates provided to heat pipes are optimized. At least one heat pipe 31, 32, 33 is fixed to each of fin plates 41, 42 and 43, a rectangular fin plate assembly 40 is constituted of the fin plate 41, the fin plate 42 and the fin plate 43 of the plurality of respective radiation fin parts 34, 35 and 36 as the plurality of radiation fin parts 34, 35 and 36 are seen from the direction in which the heat pipes 31, 32 and 33 extend, the plurality of heat pipes 31, 32 and 33 are composed of a first heat pipe group 30A and a second heat pipe group 30B, the first heat pipe group 30A is positioned at the center in the longitudinal direction of the fin plate assembly 40, the second heat pipe group 30B is positioned on both sides of the first heat pipe group 30A in the longitudinal direction of the fin plate assembly 40, and the fin plate 43 thermally connected to the first heat pipe group 30A includes expanding parts 43m and 43n.


Patent
Furukawa Electric Group | Date: 2017-09-13

The purpose of the present invention is to provide a means that exhibits excellent heat resistance and mounting reliability when bonding a power semiconductor device on to a metal lead frame, which is also lead-free and places little burden on the environment. Specifically, provided is an electrically conductive adhesive film, which comprises metal particles, a thermosetting resin, and a compound having Lewis acidity or a thermal acid generator, wherein the compound having Lewis acidity or thermal acid generator is selected from: boron fluoride or a complex thereof, a protonic acid with a pKa value of -0.4 or lower, or a salt or acid obtained by combining an anion that is the same as the salt thereof with hydrogen ion or any other cation. Further, the present invention provides a dicing die bonding film that is obtained by bonding the electrically conductive adhesive film with a pressure-sensitive adhesive tape.

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