Fujikoshi Machinery Corporation

Nagano-shi, Japan

Fujikoshi Machinery Corporation

Nagano-shi, Japan
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Patent
Fujikoshi Machinery Corporation, Japan National Institute of Advanced Industrial Science and Technology | Date: 2016-12-06

The work processing apparatus of the present invention comprises: a processing section for processing or treating a work; and a liquid chemical supplying section for supplying a liquid chemical to the processing section. The liquid chemical supplying section includes: a plurality of liquid chemical bags for storing the liquid chemical; a bag holding part in which the liquid chemical bags are attached and held; and a liquid feeding part, to which the liquid chemical bags are detachably connected, for feeding the liquid chemical from the liquid chemical bags to the processing section. Each of the liquid chemical bags is produced by overlapping flexible resin sheets with each other and welding their edge parts to form into a bag. Each of the liquid chemical bags has a port part communicating with an outside. A joint with a valve is attached to each of the port parts.


Patent
Fujikoshi Machinery Corporation | Date: 2016-10-26

To provide a double-side polishing apparatus (30) that can satisfactorily carry out polishing of a high-hardness material. A first rotary shaft (45) rotating the upper surface plate (44) has a cylindrical shape, extends vertically, and has the lathe dog (46) fixed to an upper end thereof; the second rotary shaft (54) rotating the sun gear (55) is rotatably inserted through the first rotary shaft (45) in a cylindrical shape and extends vertically, and has a pinion gear (61) fixed to an upper end thereof; the sun gear (55) has a cylindrical shape and is rotatably supported outside an upper end part of the first rotary shaft (45), and has an internal tooth (55d) formed on an inner circumference part and an external tooth (55e) that meshes with the carrier (53), formed on an outer circumference part; and a void part is formed at an upper part of the first rotary shaft (45), and in the void part, a planetary gear (62) which meshes with the pinion gear (61) being provided on the second rotary shaft (54) for driving the sun gear (55) and the internal tooth (55d) of the sun gear (55) and which transmits rotation of the second rotary shaft (54) to the sun gear (55), is disposed.


Patent
Japan National Institute of Advanced Industrial Science, Technology and Fujikoshi Machinery Corporation | Date: 2013-11-22

A method of manufacturing semiconductor wafers is provided which facilitates formation of orientation flat lines and allows beveling work without problems. The method of manufacturing semiconductor wafers according to the present invention is a method of manufacturing semiconductor wafers, in which a plurality of small-diameter wafers is cut out from a large-diameter semiconductor wafer, the method including: a marking step of forming straight groove-like orientation flat lines by a laser beam so as to cross the respective small-diameter wafers in each row in the large-diameter semiconductor wafer, wherein cutout positions of the small-diameter wafers are aligned in rows in a specific direction, collectively for each of the rows; and a cutting step of cutting out the small-diameter wafers separately from the large-diameter semiconductor wafer by a laser beam after the marking step.


Patent
Japan National Institute of Advanced Industrial Science, Technology and Fujikoshi Machinery Corporation | Date: 2013-12-04

The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.


Patent
FUJIKOSHI MACHINERY Corporation | Date: 2015-03-04

The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.


Patent
FUJIKOSHI MACHINERY Corporation | Date: 2016-07-29

The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.


Patent
Fujikoshi Machinery Corporation | Date: 2015-09-16

The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work (W) onto a polishing part (18) of a rotating polishing plate (16); and supplying slurry while performing the pressing step. The method is characterized in that an activated gas (a gas turned into plasma so as to generate an activated gas), which has been activated by gas discharge, is turned into micro-bubbles and mixed into the slurry.


Patent
Fujikoshi Machinery Corporation | Date: 2012-02-29

The polishing apparatus (10) comprises: a polishing head (14) for holding a work (30); a polishing plate (12) having a polishing face; and a driving mechanism for relatively moving the polishing head (14) with respect to the polishing plate (12). The polishing head (14) includes: a holding plate (22); an elastic sheet member (28) being fixed to the holding plate (22), the elastic sheet member (28) having a lower face for pressing the work (30) onto the polishing plate (12); a pressure chamber, to which a pressure fluid is supplied, being formed between the holding plate (22) and the elastic sheet member (28); a seal ring (36) concentrically dividing the pressure chamber into chambers (40, 42), the seal ring (36) having a seal lip (38); and a fluid supply section (29, etc.) for individually supplying the fluid to the divided chambers (40, 42).


Patent
FUJIKOSHI MACHINERY Corporation | Date: 2012-11-09

The method for adhering works is capable of polishing the works so as to have the same thickness. The method for adhering works is performed in a work adhering apparatus comprising: a press table; and a plurality of pressing heads being provided above the press table and capable of independently moving close to and away from the press table. The press table and the pressing heads press and adhere the works onto a plate with an adhesive agent. Each of the pressing heads presses and adheres the one work onto the plate at a constant pressure.


Patent
Fujikoshi Machinery Corporation | Date: 2016-07-01

To provide a dressing apparatus capable of uniformly dressing a polishing pad. The apparatus includes first and second dressing grind stones 51 and 52 which grind polishing pads 17 and 18 by moving in a radial direction of upper and lower polishing plates 12 and 14 while abutting on corresponding polishing pads 17 and 18, in which the first and second dressing grind stones 51 and 52 are set so as to have: an inner side region portion P; an outer side region portion Q; and an intermediate region portion R, wherein the length of each of the inner side region portion P and the outer side region portion Q extending in a circumferential direction of the polishing plates 12 and 14 is longer than the length of the intermediate region portion R extending in a circumferential direction of the polishing plates.

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