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Mizuuchi K.,Osaka Municipal Technical Research Institute | Inoue K.,University of Washington | Agari Y.,Osaka Municipal Technical Research Institute | Sugioka M.,Osaka Municipal Technical Research Institute | And 6 more authors.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy | Year: 2014

cBN-particle-dispersed-aluminum (AI) matrix composites were fabricated in solid-liquid co-existent state by Spark Plasma Sintering (SPS) process from the mixture of cBN powders, AI powders and Al-5mass%Si powders. The microstructures and thermal conductivities of the composites fabricated were examined. These composites were all well consolidated by heating at a temperature range between 798 K and 876 K for 1.56 ks during SPS process. No reaction at the interface between the cBN particle and the AI matrix was observed by scanning electron microscopy for the composites fabricated under the sintering conditions employed in the present study. The relative packing density of the Al/cBN composite fabricated at a pressure of 300 MPa was higher than 99% in a volume fraction range of cBN between 35% and 50%. Thermal conductivity of the Al/cBN composite increased with increasing the cBN content in the composite in a volume fraction range between 35 and 45 vol%. The highest thermal conductivity was obtained for Al-45 vol%cBN composite and reached 305 W/mK. The coefficients of thermal expansion of the composites were a little higher than the theoretical values estimated by the upper line of Kerner's model, indicating the bonding between the cBN particle and the AI matrix in the composite is weak a little.


Mizuuchi K.,Osaka Municipal Technical Research Institute | Inoue K.,University of Washington | Agari Y.,Osaka Municipal Technical Research Institute | Sugioka M.,Osaka Municipal Technical Research Institute | And 6 more authors.
Microelectronics Reliability | Year: 2014

Diamond-particle-dispersed aluminum (Al) matrix composites consisting of monomodal and bimodal diamond particles were fabricated in spark plasma sintering process, where the mixture of diamond, pure Al and Al-5 mass% Si alloy powders were consolidated in liquid and solid co-existent state. Microstructures and thermal properties of the composites fabricated in such a way were investigated and the monomodal and bimodal diamond particle effect was evaluated on the thermal properties of the composites. The composites can be well consolidated in a temperature range between 773 K and 878 K and scanning electron microscopy detects no reaction product at the interface between the diamond particle and the Al matrix. Relative packing density of the composite containing monomodal diamond particles decreased from 99.1% to 87.4% with increasing volume fraction of diamond between 50% and 60%, whereas that of the composite containing bimodal diamond particles was higher than 99% in a volume fraction of diamond up to 65%. The thermal conductivity of the composite containing bimodal diamond particles was higher than that of the composite containing monomodal diamond particles in a volume fraction of diamond higher than 60%. The coefficients of thermal expansion (CTEs) of the diamond-particle-dispersed Al-matrix composites fall in the upper line of Kerner model, indicating good bonding between the diamond particle and the Al matrix in the composite. The thermal conductivity of the composite containing 70 vol.% bimodal diamond particles was 578 W/m K and its CTE was 6.72 × 10-6 at R.T. © 2014 Elsevier Ltd.


Mizuuchi K.,Osaka Municipal Technical Research Institute | Inoue K.,University of Washington | Agari Y.,Osaka Municipal Technical Research Institute | Sugioka M.,Osaka Municipal Technical Research Institute | And 6 more authors.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy | Year: 2015

Diamond-particle-dispersed-copper (Cu) matrix composites were fabricated by spark plasma sintering (SPS) process from the mixture of diamond particles, pure-Cu and boron (B) powders. The microstructures and thermal conductivities of the composites fabricated were examined. These composites were all well consolidated at a temperature of 1173 K for 600 s by spark plasma sintering (SPS) process. No reaction at the interface between the diamond particle and the Cu matrix was observed by scanning electron microscopy and X-ray diffraction analysis for the composites fabricated under the sintering condition employed in the present study. The relative packing density of the diamond particle dispersed Cu matrix composites with B addition was 3.5-6.1 % higher than that without B addition. The thermal conductivity of the Cu/diamond composite drastically increased with B addition. The thermal conductivity of (Cu-B)-50vol%diamond composites was 594 ∼ 689 W/mK in a volume fraction range of B between 1.8 and 13.8 vol% in Cu matrix. Numerous transgranular fractures of diamond particles were observed on the bending fracture surface of diamond particle dispersed Cu matrix composites with B addition, indicating strong bonding between the diamond particle and the Cu matrix in the composite.


Trademark
Fuji Electronic Industrial Co. and Sps Syntex Kabushiki Kaisha | Date: 2008-07-15

Sintering machines.


Trademark
Fuji Electronic Industrial Co., Sumiseki Materials Co. and Sumitomo Sekitan Kogyo Kabushiki Kaisha | Date: 2001-09-04

sintering machines.

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