Freescale Inc.

Tianjin, China

Freescale Inc.

Tianjin, China
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An integrated circuit includes a scan chain, a clock divider circuit, and clock selection circuitry. The scan chain includes a plurality of dual edge flip flops, wherein each dual edge flip flop includes a data input, a scan input, a clock input, and data output. The clock divider circuit is coupled to receive a test clock and is configured to divide the test clock to provide a divided test clock. The clock selection circuitry has a first input coupled to receive the divided test clock, a second input coupled to receive a system clock, a control input coupled to receive a scan enable signal, and an output coupled to provide one of the divided test clock and the system clock as a clock signal to the clock inputs of the scan chain based on the scan enable signal.


Patent
Freescale Inc. | Date: 2015-12-11

A method of fabricating a laterally diffused metal-oxide-semiconductor (LDMOS) transistor device having a bipolar transistor for electrostatic discharge (ESD) protection includes doping a substrate to form a body region of the LDMOS transistor device in the substrate, the body region having a first conductivity type, forming a doped isolating region of the LDMOS transistor device in the substrate, the doped isolating region having a second conductivity type and surrounding a device area of the LDMOS transistor device in which the body region is disposed, forming a base contact region of the bipolar transistor, the base contact region being disposed within the body region and having the first conductivity type, and doping the substrate to form an isolation contact region for the doped isolating region that defines a collector region of the bipolar transistor, to form source and drain regions of the LDMOS transistor device in the substrate, and to form an emitter region of the bipolar transistor within the body region.


Patent
Freescale Inc. | Date: 2014-10-20

A quad flat package integrated circuit (IC) device has alternating inner and outer leads that protrude from a package body. The inner leads are j-shaped leads and the outer leads are gull-wing shaped leads. The package body is formed such that it includes plastic lead webbings between adjacent leads, which help prevent metal particles from getting lodged between the leads and causing electrical shorts. The webbings are made of the same molding compound as the package body and are formed together with the package body.


A sensor device includes sensors that sense different physical stimuli. Fabrication of the device entails forming a device structure having a first and second wafer layers with a signal routing layer interposed between them. Active transducer elements of one or more sensors are formed in the second wafer layer. A third wafer layer is attached with the second wafer layer to produce one or more cavities in which the active transducer elements are located. Ports may be formed in the third wafer layer to adjust the pressure within the cavities during manufacture. The third wafer layer includes either a reference element or diaphragm of a pressure sensor. A fourth wafer layer may be coupled to the third wafer layer. The third and fourth wafer layers can include active and non-active circuitry such as integrated circuits, sensor components, microcontrollers, and the like.


Patent
Freescale Inc. | Date: 2013-08-30

A process integration is disclosed for fabricating non-volatile memory (NVM) cells having spacer control gates (108) along with a high-k-metal-poly select gate (121, 123, 127) and one or more additional in-laid high-k metal CMOS transistor gates (121, 124, 128) using a gate-last HKMG CMOS process flow without interfering with the operation or reliability of the NVM cells.


Patent
Freescale Inc. | Date: 2013-03-15

A power source delivers power from a main power source using switching by a normally on transistor. A driver switches on and off the normally on transistor under a control signal by a controller during regular operation. A housekeeping power supply delivers auxiliary power to the driver. The driver switches off the normally on transistor during irregular operation. Irregular operation occurs at least when the control signal is absent or no auxiliary power is available or during transients such a power up or down. Bridge block pairs thereof can be arranged to form a half bridge power switch, an H bridge switch, a three phase bridge switch, a multi-phase switch, a buck converter, a buck-boost converter, or a boost converter.


Patent
Freescale Inc. | Date: 2013-03-15

A negative charge pump is responsive to a pump enable signal. A voltage controlled current source provides a current. A resistor is coupled between a node from the voltage controlled current source and a negative charge output from the negative charge pump. A capacitor is placed in parallel with the resistor. A comparator generates the pump enable signal to control the negative charge pump. The comparator is coupled to the resistor and the capacitor and measures an IR drop thereacross and compares this measurement against a reference threshold. A level of the pump enable signal can be variable by tuning an amount of resistance of the resistor or capacitor or adjusting the reference threshold. A memory can be driven by a method of the negative charge pump.


Patent
Freescale Inc. | Date: 2013-08-08

A process integration is disclosed for fabricating non-volatile memory (NVM) cells having recessed control gates (118, 128) on a first substrate area (111) which are encapsulated in one or more planar dielectric layers (130) prior to forming in-laid high-k metal select gates and CMOS transistor gates (136, 138) in first and second substrate areas (111, 113) using a gate-last HKMG CMOS process flow without interfering with the operation or reliability of the NVM cells.


A continuous time sigma delta analog to digital converter is provided. The continuous time sigma delta analog to digital converter may include, but is not limited to, an analog to digital converter having a feedback loop, and a feedback loop controller coupled to the analog to digital converter, the feedback loop controller configured to adjust delay in the feedback loop by controlling a variable delay component in the feedback loop.


Patent
Freescale Inc. | Date: 2013-12-04

A method includes forming a connection between a first metal layer and a second metal layer. The second metal layer is over the first metal layer. A via location for a first via between the first metal layer and the second metal layer is identified. Additional locations for first additional vias are determined. The first additional vias are determined to be necessary for stress migration issues. Additional locations necessary for second additional vias are determined. The second additional vias are determined to be necessary for electromigration issues. The first via and the one of the group consisting of (i) the first additional vias and second additional vias (ii) the first additional vias plus a number of vias sufficient for electromigration issues taking into account that the first additional vias, after taking into account the stress migration issues, still have an effective via number greater than zero.

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