Entity

Time filter

Source Type


Dadzis K.,Solar World Innovations GmbH | Vizman D.,West University of Timisoara | Friedrich J.,Fraunhofer Institute for Integrated Systems and Device Technology
Journal of Crystal Growth | Year: 2013

Directional solidification of large multi-crystalline silicon ingots is a distinctly unsteady process with a complex interaction between melt flow, crystallization interface, and species transport. Both the different time-scales and the three-dimensional character make numerical simulations of this process a challenging task. The complexity of such simulations increases further if external magnetic fields are used to enhance the melt flow. In this contribution, several three-dimensional coupled unsteady calculations are carried out for a 22 × 22 × 11 cm3 silicon melt directionally solidified in a traveling magnetic field. The justification of various approximations in the numerical models is discussed with an emphasis on the frequently used quasi steady-state models for the calculation of the interface shape. It is shown that an upward traveling magnetic field leads to a symmetric concave interface shape while a downward field results in a convex interface with a distinct asymmetry at the current supplies. These results agree in both unsteady and quasi steady-state calculations, but only unsteady calculations reveal the flow-induced local oscillations of the interface. The unsteady segregation process of carbon and oxygen impurities exhibits a non-uniform concentration along the crystallization interface although the bulk concentration is near to the complete mixing limit in the cases with a traveling magnetic field. © 2013 Elsevier B.V. All rights reserved. Source


Kozawa T.,Osaka University | Erdmann A.,Fraunhofer Institute for Integrated Systems and Device Technology
Japanese Journal of Applied Physics | Year: 2012

The reduction of wavelength is a trend in the development of lithography used for high-volume production of semiconductor devices. The lithography using 13.5 nm extreme ultraviolet (EUV) radiation has been intensively developed and is approaching realization. After the use of 13.5 nm EUV, the wavelength is expected to be reduced to 6.67 nm. In this study, we theoretically examined the resist properties required for 6.67 nm EUV lithography. Using an exposure tool with the numerical aperture of 0.5, the fabrication of 11nm line-and-space patterns with 0.9nm line width roughness (LWR) with 10 mJ cm-2 sensitivity requires >30- enhancement of the absorption coefficient, >30 wt% acid generators, and >5- enhancement of the effective reaction radius for deprotection from the current resists in order to simultaneously meet the requirements for resolution, LWR, and sensitivity. © 2012 The Japan Society of Applied Physics. Source


Kozawa T.,Osaka University | Erdmann A.,Fraunhofer Institute for Integrated Systems and Device Technology
Applied Physics Express | Year: 2011

With the realization of 13.5 nm extreme ultraviolet (EUV) lithography, further reduction in wavelength has attracted much attention. In this study, the optical images, sensitization processes, and chemical reactions in a chemically amplified resist were calculated to estimate the performance of the resist upon exposure to 6.67 nm EUV radiation. It was found that the reduction in wavelength improves the lithographic image quality even if the secondary electrons generated by high-energy photons are taken into account. One of the keys to the realization of 6.67nm lithography is the development of high-absorption resists. © 2011 The Japan Society of Applied Physics. Source


Tanasie C.,West University of Timisoara | Vizman D.,West University of Timisoara | Friedrich J.,Fraunhofer Institute for Integrated Systems and Device Technology
Journal of Crystal Growth | Year: 2011

Numerical simulations were carried out in order to study the effect of various types of magnetic fields (steady vertical and horizontal magnetic fields and a combination of a steady field and DC electric current) on melt convection and interface shape during directional solidification of multi-crystalline silicon ingots. It is shown that steady magnetic fields can decrease the interface deflection. The electromagnetic field produced by the combination of DC current through the melt and a steady magnetic field can produce a stirring effect in the melt for a relatively small value of magnetic field and electrical current. Consequently, a more uniform distribution of dopants and impurities can be obtained in the silicon crystals. The melt rotation rate can be easily controlled by the intensity of the electrical current. © 2010 Elsevier B.V. All rights reserved. Source


Home > Press > EuroCPS, a Horizon 2020 Project, Announces Next Round Of Support for Innovative Companies and their CPS projects Abstract: The Innovative-company-support Project Started in February 2015. 15 EuroCPS Members from Nine Countries Are Now Supporting Nine Projects out of the First Call. The Second Call for Industrial Projects Is Now open. CEA-Leti, coordinator of the pan-European consortium EuroCPS, today announced that the 15 partners are continuing their support for SMEs, midcaps and large companies with the second open call for industrial projects, which is open from Oct. 28 to Dec. 2. Innovative cyber-physical system (CPS) projects can be submitted. Innovative companies will have multiple support sources: - Technical support from platform partner (indirect funding) - Technical support from design center (indirect funding) - Cascade funding support (direct funding) EuroCPS project: Funded by the European Commission, the three-year, €9.2 million project is designed to help innovators (SMEs, midcaps and large companies) overcome barriers they face when entering new markets by providing technical expertise, coaching and access to advanced industrial CPS platforms. It gets innovators up to speed on the innovation ecosystem of “smart” products by facilitating access to the latest technologies and their implementation. It also taps existing regional ecosystems in several countries to bring the full value chain – from hardware/software platforms to cyber-physical systems – to high value-added products and services. Way of working and achievements: EuroCPS partners were made aware of the innovative companies-support project via local network organizations, brokerage events, technical forums, exhibitions and the EuroCPS homepage (www.eurocps.org). More than 1,000 companies received notice of EuroCPS. Out of a high number of interested parties, 29 companies submitted industrial experiments during the first call. The proposals came out of seven countries, addressing hardware, software and Integration projects and utilized all platforms that are provided within EuroCPS: · Avionics platform provided by Thales TRT · iNEMO® platform provided by STMicroelectronics · Integrated and open platform provided by AVL · Power management and XMC platform provided by Infineon · Quark platform provided by Intel · Silicon processes and package technology platform provided by STMicroelectronics · STM32F platform provided by STMicroelectronics Two external and independent experts assessed the proposals, and based on their ranking, nine industrial experiments were selected for funding and have started projects. The selected proposals show a huge variety of application areas, such as: low-power wireless connectivity, connected lighting, universal graphical data display, monitoring and optimization of different tasks in agri‐food production, remote data tracking for vehicles by use of hardware in the loop systems, tracking of clinical test tubes, multi-core platform for avionic domain; human system interfaces and security control of cloud data. In addition to the direct funding from the European Commission, the selected companies will get technical support from the platform partners and the following competence centers: · CEA-Leti (France) · Thales TRT (France) · AVL LIST GmbH (Austria) · Fraunhofer Institute for Integrated Systems and Device Technology (IISB) (Germany) · The Digital Catapult (UK) · Alma Mater Studiorum – University of Bologna (Italy) · Lulea Tekniska Universitet (Sweden) · Budapest University of Technology and Economics (Hungary) · Finepower GmbH (Germany) Second open call for industrial experiments: After selection and start of the first CPS projects, EuroCPS will support a new set of innovative companies. Based on the feedback of several companies, Infineon and STMicroelectronics enlarged their platform to provide a broader portfolio for the second round. Proposals can be submitted from Oct. 28 to Dec. 2. The networking partners in EuroCPS are pleased to help the new entrant companies with registration, submitting proposals and finding the right platform and competence center. Selected projects will be notified the beginning of February 2016. EuroCPS is part of the Smart Anything Everywhere Initiative under Horizon 2020 Leadership in Enabling Industrial Technologies, which aims to generating new and breakthrough technologies, boost competitiveness, create jobs and support growth by offering a Europe-wide network of design centers. A first group of four innovation actions included efforts under the combined 25M€ funding budget to support approximately 100 industrial experiments with the aim of involving more than 200 SMEs and midcaps in the field of cyber-physical systems (CPS), the Internet of Things (IoT) and smart systems integration (SSI). More details on available competences, platforms and design centers are available at www.eurocps.org. About CEA Leti As one of three advanced-research institutes within the CEA Technological Research Division, CEA Tech-Leti serves as a bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. It is committed to creating innovation and transferring it to industry. Backed by its portfolio of 2,800 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched 54 startups. Its 8,500m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. With a staff of more than 1,800, Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Follow us at www.leti.fr and @CEA_Leti. For more information, please click If you have a comment, please us. Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Discover hidden collaborations