Hon Hai Precision Industry Co., Ltd., trading as Foxconn Technology Group, is a Taiwanese multinational electronics contract manufacturing company headquartered in Tucheng, New Taipei, Taiwan. It is the world's largest electronics contractor manufacturer, and the third-largest information technology company by revenue.Foxconn is primarily a contract manufacturer and its clients include major American, European, and Japanese electronics and information technology companies. Notable products that the company manufactures include the BlackBerry, iPad, iPhone, Kindle, PlayStation 4, Xbox One, and Wii U.Foxconn has been involved in several controversies relating to how it manages employees in China. There has been a history of suicides at its factories blamed on working conditions. In January 2012, about 150 Foxconn employees threatened to commit mass-suicide in protest at their working conditions. Wikipedia.
Foxconn Technology Group and CHAMP Technology OPTICAL FOSHAN CORPORATION | Date: 2015-09-22
A wall lamp includes a lamp body, a connector, a power box, a light emitting unit and a driving device. The light emitting unit is fixed on a bottom of the lamp body. The driving device is received in the power box and supplies power for the light emitting unit. The connector includes a first connecting part and a second connecting part. The first connecting part is fixed on a top of the lamp body. The second connecting part is fixed on a top of the power box. The first connecting part is rotationally connected to the second connecting part, thereof adjusting illumination angle of the light emitting unit and making the wall lamp in a closed state or unfolded state.
CHAMP Technology OPTICAL FOSHAN CORPORATION and Foxconn Technology Group | Date: 2015-09-22
A street lamp includes a housing, a plurality of light emitting units and a driving device supplying power for the light emitting units. The housing includes a first chamber and a second chamber located at an end of the first chamber. The first chamber and the second chamber are non-communicating. The light emitting units and the driving device are received in the first chamber and the second chamber respectively. A plurality of fins are formed on bottom of the first chamber. A plurality of convection holes are defined on periphery edges of the first chamber. The convection holes locate at an outside of the light emitting units.
CHAMP Technology OPTICAL FOSHAN CORPORATION and Foxconn Technology Group | Date: 2015-10-12
A light emitting diode module (LED includes a base, a light emitting unit, a heat dissipation portion located between the base and the light emitting unit, a lens located on the heat dissipation portion to receive the light emitting unit therein. The heat dissipation portion includes a main portion, a first connecting portion and a second connecting portion respectively located on both ends of the main portion. A drive receives in a cavity defined collectively by the main portion, the first connecting portion and the second connecting portion. The drive element is coupled with the light emitting unit and the base, the drive element.
CHAMP Technology OPTICAL FOSHAN CORPORATION and Foxconn Technology Group | Date: 2015-09-08
A light emitting diode (LED) lamp includes a lamp holder, a light source and a driver. The lamp holder includes a first receiving chamber, a second receiving chamber and a heat dissipating structure. The first receiving chamber and the second receiving chamber are separated by the heat dissipating structure. The light source is received in the first receiving chamber. The driver is received in the second receiving chamber. The lamp holder has a first surface and a second surface opposite to the first surface. The heat dissipating structure defines a plurality of the air channels. The air channels are formed through the first surface and the second surface.
CHAMP Technology OPTICAL FOSHAN CORPORATION and Foxconn Technology Group | Date: 2015-09-28
A vapor chamber includes a condensation board and an evaporation board. The evaporation board includes an evaporation surface. The condensation board includes a condensation surface. A groove is defined on the condensation surface. The groove is sealed up by the condensation board and the evaporation board therebetween with the evaporation surface facing the condensation surface. A plurality of isolation boards are positioned in the groove. The groove is divided into a plurality of separated cavities by the isolation boards.
Foxconn Technology Group | Date: 2015-10-13
A method for manufacturing a coil loading board includes following steps: providing a first plate configured single-side adhesive and double-side adhesive on both sides thereof; defining a first slot, a first through hole, a first connection hole and a groove through both sides of the first plate; providing a second plate configured double-die adhesive on a side thereof; forming a second slot, a second through hole and a second connection hole through both sides of the second plate; fixing the first plate and the second plate together; removing the single-side adhesive of the first plate.
CHAMP Technology OPTICAL FOSHAN CORPORATION and Foxconn Technology Group | Date: 2016-07-25
A vibration-proofed fan frame includes a housing and a base surrounded by the housing. A hollow tube is arranged on the base and has the rotary connection with an impeller of the heat dissipation fan. The base includes a disc and a plurality of ribs extending outwards from periphery of the disc. The fan frame further includes a buffer member within the structural interconnections between the disc and the housing. The buffer member includes first elements. The first elements are embedded in the disc. A heat dissipation fan having the fan frame described is also presented.
Furui Precise Component Kunshan Co. and Foxconn Technology Group | Date: 2016-08-12
An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.
Fu Zhun Precision Industry Shen Zhen Co. and Foxconn Technology Group | Date: 2016-05-23
A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold including a male die and a female die; positioning an outer frame in a cavity of the female die, the outer frame including a plurality of latching portions protruding from an inner surface inwardly and a plurality of latching grooves, each latching portion including at least one receiving groove; assembling the male die to the female die; casting pressured molten metal-alloy into the cavity to form an inner structural member embedded in the outer frame, the inner structural member including a plurality of engaging portions respectively embedded in the plurality of receiving grooves, and a plurality of matching portions respectively embedded in the plurality of latching grooves; dissembling the male die from the female die; and removing the outer frame and the inner structural member from the female die.
Fu Zhun Precision Industry Shen Zhen Co. and Foxconn Technology Group | Date: 2016-03-29
A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold, including a male die and a female die engaging with the male die, the male die defining a pouring gate therein, and the female die defining a cavity therein corresponding to the pouring gate; positioning a metallic outer case in the cavity of the female die as an insert; assembling the male die to the female die to cover the cavity, thereby communicating the pouring gate with the cavity; casting pressured molten metal-alloy into the cavity via the pouring gate to form an inner structural member embedded in an inner side of the outer case; dissembling the male die from the female die to expose the cavity, and removing the outer case and the inner structural member from the female die.