Foxconn Electronics Inc.

Hsinchu, Taiwan

Foxconn Electronics Inc.

Hsinchu, Taiwan
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Wiseguyreports.Com Adds “Optical Transceiver -Market Demand, Growth, Opportunities and Analysis of Top Key Player Forecast To 2022” To Its Research Database This report focus on Global and regional market, providing information on major players like manufacturers, suppliers, distributors, traders, customers, investors and etc., major types, major applications from Global and major regions such as Europe, North American, South American, Asia (Excluding China), China and etc. Data type include capacity, production, market share, price, revenue, cost, gross, gross margin, growth rate, consumption, import, export and etc. Industry chain, manufacturing process, cost structure, marketing channel are also analyzed in this report. This report provides valuable information for companies like manufacturers, suppliers, distributors, traders, customers, investors and individuals who have interests in this industry. Major companies are as follows: Finisar Corp., Lumentum Holdings Inc., Accelink Technologies Co. Ltd., Oclaro, Inc., Sumitomo Electric Industries, Ltd., Foxconn Electronics Inc., Neophotonics Corp., Fujitsu Optical Components Ltd., Reflex Photonics Inc., Source Photonics, Inc. and more are profiled in the terms of product picture, specification, capacity, production, price, cost, gross, revenue, and contact information. Chapter One Industry Overview 1.1 Definition 1.2 Specification 1.3 Classification 1.3.1 850nm 1.3.2 1310nm 1.3.3 1550nm 1.4 Application 1.4.1 Telecom 1.4.2 Data Center 1.4.3 Enterprise Chapter Two Industry Chain Analysis 2.1 Up Stream Industries Analysis 2.1.1 Raw Material and Suppliers 2.1.2 Equipment and Suppliers 2.2 Manufacturing Analysis 2.2.1 Manufacturing Process 2.2.2 Manufacturing Cost Structure 2.2.3 Manufacturing Plants Distribution Analysis Chapter Five Major Manufacturers Analysis 5.1 Finisar Corp. 5.1.1 Company Profile 5.1.2 Product Specification 5.1.3 2011-2016 Global Market Performance 5.1.4 Contact Information 5.2 Lumentum Holdings Inc. 5.2.1 Company Profile 5.2.2 Product Specification 5.2.3 2011-2016 Global Market Performance 5.2.4 Contact Information 5.3 Accelink Technologies Co. Ltd. 5.3.1 Company Profile 5.3.2 Product Specification 5.3.3 2011-2016 Global Market Performance 5.3.4 Contact Information 5.4 Oclaro, Inc. 5.4.1 Company Profile 5.4.2 Product Specification 5.4.3 2011-2016 Global Market Performance 5.4.4 Contact Information 5.5 Sumitomo Electric Industries, Ltd. 5.5.1 Company Profile 5.5.2 Product Specification 5.5.3 2011-2016 Global Market Performance 5.5.4 Contact Information 5.6 Foxconn Electronics Inc. 5.6.1 Company Profile 5.6.2 Product Specification 5.6.3 2011-2016 Global Market Performance 5.6.4 Contact Information 5.7 Neophotonics Corp. 5.7.1 Company Profile 5.7.2 Product Specification 5.7.3 2011-2016 Global Market Performance 5.7.4 Contact Information 5.8 Fujitsu Optical Components Ltd. 5.8.1 Company Profile 5.8.2 Product Specification 5.8.3 2011-2016 Global Market Performance 5.8.4 Contact Information 5.9 Reflex Photonics Inc. 5.9.1 Company Profile 5.9.2 Product Specification 5.9.3 2011-2016 Global Market Performance 5.9.4 Contact Information 5.10 Source Photonics, Inc. 5.10.1 Company Profile 5.10.2 Product Specification 5.10.3 2011-2016 Global Market Performance 5.10.4 Contact Information 5.11 5.11.1 Company Profile 5.11.2 Product Specification 5.11.3 2011-2016 Global Market Performance 5.11.4 Contact Information 5.12 5.12.1 Company Profile 5.12.2 Product Specification 5.12.3 2011-2016 Global Market Performance 5.12.4 Contact Information 5.13 5.13.1 Company Profile 5.13.2 Product Specification 5.13.3 2011-2016 Global Market Performance 5.13.4 Contact Information 5.14 5.14.1 Company Profile 5.14.2 Product Specification 5.14.3 2011-2016 Global Market Performance 5.14.4 Contact Information 5.15 5.15.1 Company Profile 5.15.2 Product Specification 5.15.3 2011-2016 Global Market Performance 5.15.4 Contact Information 5.16 5.16.1 Company Profile 5.16.2 Product Specification 5.16.3 2011-2016 Global Market Performance 5.16.4 Contact Information 5.17 5.17.1 Company Profile 5.17.2 Product Specification 5.17.3 2011-2016 Global Market Performance 5.17.4 Contact Information 5.18 5.18.1 Company Profile 5.18.2 Product Specification 5.18.3 2011-2016 Global Market Performance 5.18.4 Contact Information 5.19 5.19.1 Company Profile 5.19.2 Product Specification 5.19.3 2011-2016 Global Market Performance 5.19.4 Contact Information 5.20 5.20.1 Company Profile 5.20.2 Product Specification 5.20.3 2011-2016 Global Market Performance 5.20.4 Contact Information Chapter Six Major Classification Analysis 6.1 2011-2016 Major Classification Market Share 6.2 850nm 6.3 1310nm 6.4 1550nm Chapter Seven Major Application Analysis 7.1 2011-2016 Major Application Market Share 7.2 Telecom 7.2.1 2011-2016 Consumption Analysis 7.2.2 Major Down Stream Customers Analysis 7.3 Data Center 7.3.1 2011-2016 Consumption Analysis 7.3.2 Major Down Stream Customers Analysis 7.4 Enterprise 7.4.1 2011-2016 Consumption Analysis 7.4.2 Major Down Stream Customers Analysis For more information, please visit

A new report says that Apple has yet to begin mass-producing the new 2017 iPhones, namely the iPhone 7s, iPhone 7s Plus, and the so-called iPhone 8. Out of the three, the OLED iPhone 8 is getting the short end of the stick, so to speak. That's because it could be delayed to November or December. To be clear, the iPhone 7s and iPhone 7s Plus is said to sport LCD screens that measure at 4.7 inches and 5.5 inches respectively. According to the Economic Daily News (via DigiTimes), the current production rate of Apple's 2017 iPhones isn't enough to be considered at massive volumes. "While there were previous reports indicating that volume production for new iPhone devices has commenced, yield rates at the two main ODMs, Foxconn Electronics and Pegatron, have not yet reached levels that warrant mass production," the report reads. ODM stands for original design manufacturer, and the Cupertino brand has inked deals with Foxconn, Pegatron, and Wistron to build the new iPhones. Specifically, Foxconn is set to build 95 percent of the iPhone 8 units and small numbers of the iPhone 7s and iPhone 7s Plus. Pegatron will manufacture 65 percent of the iPhone 7s and a small number of the iPhone 8, while Wistron will focus on producing the iPhone 7s Plus only. The ODMs Foxconn and Pegatron are expected to begin mass-production in August, which is about a month later than Apple's usual target time frame in terms of manufacturing new iPhones. However, the report did not explain the iPhone 8's delayed availability to November or December at the latest. Recently, Apple fell into panic mode because of software problems with the iPhone 8, particularly the company's 3D face-scanning security technology and wireless charging. This is likely a contributing factor to the potential delay, but as a countermeasure of sorts, the company is leasing equipment to suppliers to avoid production issues and ensure iPhone 8 parts won't come short. Another related determinant to consider is Apple's struggle to get the under-display Touch ID working on the iPhone 8 as fast and as accurate as the one found among the current brood. To sum things up, the iPhone 7s and iPhone 7s Plus may face a supply shortage due to a late start. Meanwhile, the iPhone 8's release date is said to be pushed back to sometime between November and December, but the report did not clear up why exactly. For the record, the three 2017 iPhones follow the iPhone 7 and iPhone 7 Plus. © 2017 Tech Times, All rights reserved. Do not reproduce without permission.

News Article | June 27, 2017

Apple’s iPhone 8 nearly two months away from being revealed, but it looks like the tech giant may face a serious problem. A new report claims that OLED supplies are going to be an issue, and may result in only 3-4 million units of the iPhone 8 being available at launch. Industry sources have predicted that shipment for the iPhone 8 could be interrupted due to yield rates at assembly plants and supply of OLED panels, according to DigiTimes. This means that shipments could end up being delayed, and may not keep up with Apple’s planned schedule. This kind of issue is surprising considering that chips and parts for the iPhone 8 arrived early from suppliers during the second quarter of 2017. Also, iPhone assemblers Foxconn Electronics, Pegatron and Wistron are also believed to have recruited more assemblers around the same time. “While Samsung Display has promised to fully support Apple with regards to the supply of OLED panels, only 3-4 million OLED-based new iPhone devices will be ready for shipping before the new smartphones are unveiled at a product event slated for September, said the sources.” Samsung Display is the main supplier of OLED display panels for Apple’s iPhone 8, which is said to come with screen size of 5.8 inches. It was also previously reported that Apple already had placed an order for 80 million units of OLED panels from Samsung Display, with the goal of shipping between 50 and 60 million new OLED-equipped iPhone 8 units in 2017. With today’s report however, it now looks like Apple might not be able to achieve that goal. There have been previous rumors that the iPhone 8 was going to be delayed due to the implementation of the in-display fingerprint sensor, but now it looks like it’s becoming a reality. Some have said that the iPhone 8’s release might even be delayed until early next year. Apple might face iPhone 8 shortages at launch if this new report is accurate. Apple usually sells over 10 million brand new iPhone models during the opening weekend alone, as pointed out by 9To5Mac. Apple is no stranger to supply shortages. The tech giant most recently handled shortages for its wireless AirPods, which have been in high demand ever since it was first released back in December. There was no mention of the iPhone 7S and iPhone 7S Plus, so it seems as though those two devices haven’t been affected by this issue. The 4.7-inch iPhone 7S and 5.5-inch 7S Plus are believed to still arrive this fall, will be look very similar to the iPhone 7 and 7 Plus and might also be equipped with OLED displays. The iPhone 8 is believed to arrive with a radical new design that’s expected to be nearly bezel-less with its edge-to-edge 5.8-inch OLED display. Last Friday, Steve Hemmerstoffer, also known as @OnLeaks on Twitter, shared what appears to be the final design of the iPhone 8, and it has everyone excited for it.

— Global Combination Steam Oven Market report is replete with detailed analysis from a thorough research, especially on questions that border on market size, development environment, futuristic developments, operation situation, pathways and trend of Combination Steam Oven. All these are offshoots of understanding the current situation that the industry is in, especially in 2017. The will chart the course for a more comprehensive organization and discernment of the competition situation in the Combination Steam Oven market. As this will help manufacturers and investors alike, to have a better understanding of the direction in which the Combination Steam Oven Market is headed. With this Combination Steam Oven Market report, one is sure to keep up with information on the dogged competition for market share and control, between elite manufacturers. It also features, price, production, and revenue. It is where you will understand the politics and tussle of gaining control of a huge chunk of the market share. As long as you are in search of key Industry data and information that can readily be accessed, you can rest assured that this report got them covered. Key companies profiled in this report are Robert Bosch, Electrolux, Siemens, Haier, Samsung, Metall Zug Group, Bertazzoni, Foxconn Electronics, Mieles, Smeg, Whirlpool, Sub-Zero & Wolf and others. Purchase a copy of this report at: When taking a good look at this report, based on the product, it is evident that the report shows the rate of production, price, revenue, and market share as well as of the growth of each product type. And emphasis is laid on the end users, as well as on the applications of the product. It is one report that hasn't shied away from taking a critical look at the current status and future outlook for the consumption/sales of these products, by the end users and applications. Not forgetting the market share control and growth rate of Combination Steam Oven Industry, per application. All the queries about this report can be asked at: List of Chapters: 1 Combination Steam Oven Market Overview 2 Global Combination Steam Oven Market Competitions by Manufacturers 3 Global Combination Steam Oven Capacity, Production, Revenue (Value) by Region (2012-2017) 4 Global Combination Steam Oven Supply (Production), Consumption, Export, Import by Region (2012-2017) 5 Global Combination Steam Oven Production, Revenue (Value), Price Trend by Type 6 Global Combination Steam Oven Market Analysis by Application 7 Global Combination Steam Oven Manufacturers Profiles/Analysis 8 Combination Steam Oven Manufacturing Cost Analysis 9 Industrial Chain, Sourcing Strategy and Downstream Buyers 10 Marketing Strategy Analysis, Distributors/Traders 11 Market Effect Factors Analysis 12 Global Combination Steam Oven Market Forecast (2017-2022) 13 Research Findings and Conclusion 14 Appendix For more information, please visit

Chiu H.-P.,Foxconn Electronics Inc | Tu C.-N.,Foxconn Electronics Inc | Wu S.-K.,Foxconn Electronics Inc | Chien-Hsiou L.,Fu Jen Catholic University
International Journal of Human-Computer Interaction | Year: 2015

Tablet computers have become ubiquitous. There is a serious risk that using tablets may lead to musculoskeletal disorders. This research aims to investigate, for tablet computer users, the musculature load and comfort perception of the engaged upper extremity for three angles of viewing and common task types performed at a computer workstation. Thirty healthy adults were recruited. A 3 × 2 repeated experimental design with tilt angle (22.5°, 45°, and 67.5° from horizontal) and task type (movie watching vs. game playing) was employed. The muscular activity of the upper extremity was assessed by electromyography measurement. Subjective comfort ratings were collected using the visual analogue scale. The results showed that when tablets were mounted at a high tilt angle (67.5°), neck muscle activity was low; however, when the tablet computer was mounted at a low tilt angle (22.5°), shoulder forward flexion activity was low, particularly during the game-playing task. This article suggests that users who feel musculoskeletal discomfort in the neck area increase the angle of their tablet computers to decrease neck stress and that users who have musculoskeletal discomfort in the shoulder area position the tablet computer at a lower tilt angle to decrease shoulder stress. Copyright © Taylor & Francis Group, LLC.

Agili S.S.,Pennsylvania State University | Morales A.W.,Pennsylvania State University | Li J.,Foxconn Electronics Inc. | Resso M.,Agilent Technologies
IEEE Transactions on Instrumentation and Measurement | Year: 2012

This paper presents the probability distribution function (PDF) of the ratio of two random waves. This result is used to obtain the PDF of S-parameters random errors in magnitude (in decibels) and phase, which are the quantities that most engineers work with. These results are further used on the development of a Monte Carlo simulation method in order to predict the variability of frequency-domain measurements. Experiments are performed to identify and characterize frequency-domain random errors, such as instrument noise, connector repeatability, and calibration variations, in measurement systems. By comparing with real measurement data, it is shown that random-error effects can be accurately estimated by the PDF's obtained and the Monte Carlo technique. © 2012 IEEE.

Wang C.-N.,National Kaohsiung University of Applied Sciences | Wang Y.-H.,University of Taipei | Hsu H.-P.,National Kaohsiung Marine University | Trinh T.-T.,Foxconn Electronics Inc.
IEEE Transactions on Semiconductor Manufacturing | Year: 2016

Semiconductor industry today is facing the transition from 300 to 450 mm wafer fabrication. However, the 450 mm wafers will pose challenges on handling and transport due to the increased size and weight. As the overhead hoist transport (OHT) system, which has been widely used in 300 mm wafer fabs, is likely to phase out, researchers have suggested using conveyor-based automated material handling systems (AMHSs) for 450 mm wafer fabrication. However, to best operate the AMHSs in a 450 mm wafer fab, effective dispatching methods that can best address the two critical problems: 1) traffic-jam and 2) lot prioritization, in the shop floor are required. In this research, we have proposed a heuristic preemptive dispatching method using Rotacaster (R-HPD) to operate the AMHS for 450 mm wafer fabrication. The R-HPD method includes some effective dispatching rules to control and dispatch wafer lots in the AMHS. Our simulation results showed that the R-HPD outperformed the differentiated preventive dispatching policy in terms of average lot delivery time (ALDT). The improvements of 49.8% and 61.9% of ALDTs for hot lots and normal lots were observed, respectively. © 1988-2012 IEEE.

Wang C.-N.,National Kaohsiung University of Applied Sciences | Huang Y.-F.,National Kaohsiung University of Applied Sciences | Le T.-N.,National Kaohsiung University of Applied Sciences | Ta T.-T.,Foxconn Electronics Inc
Sustainability (Switzerland) | Year: 2016

The Japanese automobile industry has been hit sharply by the economic downturn of recent decades. The rise in costs and decline in sales have led to serious problems in the auto industry. In order to address these issues, most companies engage in downsizing and redesigning production operations. It is crucial to investigate the time wasted by replacing assembly boards occurring in manufacturing lines. Therefore, the aim of this study was to provide an integrated approach, Teoriya Resheniya Izobreatatelskih Zadatch (TRIZ), to providing efficient solutions for the automobile industry. The first step of this methodology is to detail the technical problems using the Function and Attribute Analysis (FAA) model. Secondly, a contradiction matrix and the inventive principle were applied to find the solutions. In this study, an auto part supplier named Sumi-Hanel located in Hanoi, Vietnam, was taken as a case study; the empirical results showed that waste time had been reduced to 67%, nearly 8400 square meters was saved, and a 20% cost reduction was achieved by reusing old frames. The research proves that the combination of TRIZ and lean manufacturing successfully increases production performance and reduces waste due to technological advancements. © 2016 by the authors.

Wang C.-N.,National Kaohsiung University of Applied Sciences | Lee Y.-H.,National Kaohsiung University of Applied Sciences | Hsu H.-P.,National Kaohsiung Marine University | Nguyen D.-H.,National Kaohsiung University of Applied Sciences | Nguyen D.-H.,Foxconn Electronics Inc.
Computers and Industrial Engineering | Year: 2016

The 450 mm transition of wafer fabrication is the current trend of semiconductor industry. However, the increased size and weight of wafers pose challenges on wafer handling and transportation. To address this issue, conveyor-based automated material handling system (AMHS) has been suggested as a solution due to its advantages. However, the lack of an effective and efficient dispatching method will make a convey-based AMHS to remain suffer traffic-jams problem and short the capability to handle hot lots to meet customer needs. In this study, a heuristic preemptive dispatching method (HPDB) is proposed for controlling the movements of wafer lots in a convey-based AMHS that is restructured based on activated roller belt (ARB) and to be used for 450 mm wafer fabrication. To investigate the effectiveness of the HPDB, simulation experiments have been conducted and the results obtained from HPDB has been compared to that obtained from HPD. The experimental results show that HPDB outperforms HPD in terms of average delivery time, with the advantages of 55.11% for hot lots and 55.76% for normal lots. This indicates that HPDB can better solve the traffic-jam problem and reduce transportation time. © 2016 Elsevier Ltd. All rights reserved.

Wang S.-H.,MediaTek Inc. | Hsu C.-Y.,Foxconn Electronics Inc. | Hong Y.-W.P.,National Tsing Hua University
IEEE Transactions on Wireless Communications | Year: 2013

A channel-and-sensing-aware channel access (CSCA) policy is proposed for multi-channel interweave cognitive radio systems, where multiple secondary users (SUs) are competing for transmission to a common access point. The proposed CSCA policy consists of two key elements: (i) a decentralized channel selection policy that allows each SU to utilize knowledge of both the spectrum occupancy information and its local channel state information to make local channel access decisions and (ii) a channel reservation policy that allows each SU to compete for use of its selected channel by emitting short reservation packets at the beginning of each frame. In the reservation period, a channel-aware splitting algorithm is utilized to resolve collision among SUs that are competing for the same channel. The splitting procedure is optimized with respect to SUs' channel selection policy and ensures that the SU with the best channel quality prevails when collision is resolved. The CSCA policy is derived with the goal of maximizing the SU's throughput subject to a constraint on the probability of collision with primary users (PUs). To satisfy the collision probability constraint, a minimum channel gain threshold is set on each channel to limit the probability that the channel is accessed by SUs. An iterative algorithm is proposed to optimize the parameters in the channel selection and reservation policies, and a low-complexity policy is devised for use in systems with large numbers of channels. The proposed CSCA policies allow SUs to exploit optimally the tradeoff between spectrum availability and channel quality. © 2002-2012 IEEE.

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