Eindhoven, Netherlands
Eindhoven, Netherlands

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A method of using a Charged Particle Microscope (M) comprising:- A specimen holder (H), connected to a positioning stage, for holding a specimen;- A source (9), for producing a beam of charged particles;- An illuminator (1), for directing said beam so as to irradiate the specimen;- A detector (19), for detecting a flux of radiation emanating from the specimen in response to said irradiation,comprising the following steps:- Providing the microscope with an interferential optical position sensor (P1, P2) for determining a position of said specimen holder relative to a reference;- Providing an automatic controller (E) with a time-dependent position signal from said optical position sensor;- Invoking said controller to use said signal to produce a vibration profile for the microscope.


Patent
FEI Company | Date: 2017-04-26

An interferometric microscope comprising:- A specimen holder, for holding a specimen at an analysis location;- An illuminator, for illuminating the specimen with input radiation, so as to cause it to emit fluorescence light;- A pair of projection systems, arranged at opposite sides of said analysis location, to collect at least a portion of said fluorescence light and direct a corresponding pair of light beams into a respective pair of inputs of an optical combining element, where they optically interfere;- A detector arrangement, for examining output light from said combining element,wherein the illuminator is configured to produce a standing wave of input radiation at the analysis location.


Patent
FEI Company | Date: 2017-04-26

A wide-field interferometric microscope comprising:- A specimen holder, for holding a specimen at an analysis location;- An illuminator, for illuminating the specimen with input radiation, so as to cause it to emit fluorescence light;- A pair of projection systems, arranged at opposite sides of said analysis location, to collect at least a portion of said fluorescence light and direct a corresponding pair of light beams into a respective pair of inputs of an optical combining element, where they optically interfere;- A detector arrangement, for examining output light from said combining element, wherein:- The illuminator is configured to produce a standing wave of input radiation at the analysis location- The detector arrangement comprises exactly two interferometric detection branches.


A method for charged particle beam processing includesemitting ions from an ion source;forming the ions into an ion beam;directing the ion beam through an optical column having optical components positioned along an optical axis;directing the ion beam through a reference aperture (304) to form a reference beam having a reference beam current and a reference beam shape;adjusting the optical components to provide a desired reference beam profile at the work piece surface; andprocessing the work piece by directing the ion beam through a working aperture (312) instead of through the reference aperture to form a working beam, the working beam having a working beam current that is greater than the reference beam current and a working beam shape on the work piece surface that is different from the reference beam shape;wherein the reference beam profile includes an edge profile along a first direction and the working beam has the same edge profile along the same direction, thereby providing a higher current working beam to process a work piece more rapidly than the reference beam, while providing an edge sharpness that is similar to that of the reference beam in at least one direction. An apparatus is described for carrying out the method.


Patent
FEI Company | Date: 2017-04-26

An improved process control for a charged beam system is provided that allows the capability of accurately producing complex two and three dimensional structures from a computer generated model in a material deposition process. The process control actively monitors the material deposition process and makes corrective adjustments as necessary to produce a pattern or structure that is within an acceptable tolerance range with little or no user intervention. The process control includes a data base containing information directed to properties of a specific pattern or structure and uses an algorithm to instruct the beam system during the material deposition process. Feedback through various means such as image recognition, chamber pressure readings, and EDS signal can be used to instruct the system to make automatic system modifications, such as, beam and gas parameters, or other modifications to the pattern during a material deposition run.


Patent
FEI Company | Date: 2016-09-13

A method of imaging a specimen using an X-ray imaging apparatus, comprising the following steps:


Patent
FEI Company | Date: 2017-05-17

When detecting particulate radiation, such as electrons, with a pixelated detector, a cloud of electron/hole pairs is formed in the detector. Using the signal caused by this cloud of electron/hole pairs a position of the impact is estimated. Inventors found that, when the size of the cloud is comparable to the pixel size, or much smaller, the estimated position shows a strong bias to the center of the pixel and the corners, as well to the middle of the borders. This hinders forming an image with super-resolution. By shifting the position or by attributing the electron to several sub-pixels this bias can be countered, resulting in a more truthful representation. Inventors further found that by spreading the image Moir-effects and interferences in the image can be countered. As long as the image is a sparse image (almost all pixels representing one or no impact) this spreading is a reversible process. After spreading (effectively a spatial low-pass filtering) a high-pass filtering may be used to crisp the image. It is noted that shifting and/or spreading the information over several image pixels should take place before adding the events per image pixel. When said spreading is done after combining detector images, information is lost. It is noted that shifting cannot take place after combining detector images.


Patent
FEI Company | Date: 2017-05-17

Systems and methods for controlling an imaging device are disclosed. In one aspect, a method determines a set of control parameters for the imaging device, and acquires an image based on the set of control parameters. The method determines a plurality of image quality measurements of the first image. A polygon may be displayed on an electronic display based on a plurality of image quality measurements. For example, positions of polygon vertices may be determined relative to an origin point based on corresponding image quality measurements. In some aspects, input may be received from a user interface indicating a change in position of one or more of the vertices and the corresponding image quality measurements. In some aspects, a new set of control parameters may then be determined to achieve the changed image quality measurement(s). In some aspects a composite measure of the image quality measurements may also be displayed.


Patent
FEI Company | Date: 2017-05-24

A method of imaging a specimen using an X-ray imaging apparatus, comprising the following steps:- Providing the specimen on a specimen holder;- Directing a flux of X-rays from a source through the specimen and onto an X-ray camera,which method additionally comprises the following steps:- Embodying the source as a cluster of component sources, with a confined angular span relative to the specimen;- Using said camera to record a cumulative, composite image from said component sources;- Mathematically deconvolving said composite image.


Patent
FEI Company | Date: 2017-04-05

Methods, apparatuses, and systems for slice and view processing of samples with dual beam systems. The slice and view processing includes exposing a vertical wall of a trench formed in a sample surface; capturing a first image of the wall by interrogating the wall with an interrogating beam while the wall is at a first orientation relative to the beam; capturing a second image of the wall by interrogating the wall with the beam while the wall is at a second orientation relative to the beam, wherein first distances in the first image between a reference point and surface points on the wall are different than second distances in the second image between the reference point and the surface points; determining elevations of the surface points using the first distances and the second distances; and fitting a curve to topography of the wall using the elevations.

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