Groß Sankt Florian, Austria
Groß Sankt Florian, Austria
Time filter
Source Type

Abadie K.,EVGroup | Fournel F.,University Grenoble Alpes | Fournel F.,CEA Grenoble | Montmeat P.,University Grenoble Alpes | And 2 more authors.
2016 6th Electronic System-Integration Technology Conference, ESTC 2016 | Year: 2016

This paper deals with the mechanical behaviour and the delamination mechanisms in temporary bonding. The presented work relies on developing a test vehicle in which a controlled delamination is created. Then, this test vehicle is used to compare the resistance against delamination of four thermoplastic adhesives. To finish, the thermo-mechanical behaviour of these four adhesives is also studied. © 2016 IEEE.

Abadie K.,EVGroup | Fournel F.,University Grenoble Alpes | Fournel F.,CEA Grenoble | Morales C.,University Grenoble Alpes | And 4 more authors.
ECS Transactions | Year: 2016

This article deals with the transfer of a thin Si film (100nm) on top of a Si substrate using a room temperature covalent bonding. No annealing is performed post direct bonding. Before to detail this process, the equipment used for the bonding process is characterized in terms of particle and metal contamination. The etching occurring during one of the sub process of the surface preparation is also studied. Characterizations performed after layer transfer are presented. They include C-SAM inspections, SP2-HAZE measurements and TEM. © 2016 The Electrochemical Society.

Glinsner T.,EVGroup | Veres T.,Industrial Materials Institute of Canada | Kreindl G.,EVGroup | Roy E.,Industrial Materials Institute of Canada | And 6 more authors.
Microelectronic Engineering | Year: 2010

Nanoimprint lithography (NIL) is a fast replication technology for structures with sizes ranging from micrometer down to few nanometers range. This paper describes the technology for imprinting of polymer substrates as well as spin-on polymers by using soft working stamp materials. A fully automated hot embossing system, the EVG®750 was built to use this rapid replication processes. By utilizing soft working stamps, we demonstrate the possibility to replicate, in fully automated mode, both high-aspect ratio features in thermoplastic materials as needed for microfluidic lab-on-chip applications as well as high resolution features down to 50 nm in polymer that can be used as templates for pattern transfer in the fabrication of plasmonic substrates for bio-sensing applications. © 2009 Elsevier B.V. All rights reserved.

Kreindl G.,EVGroup | Glinsner T.,EVGroup | Fodisch R.,EVGroup | Treiblmayr D.,EVGroup | Miller R.,EVGroup Inc.
2010 10th IEEE Conference on Nanotechnology, NANO 2010 | Year: 2010

This work demonstrates unmatched needs for wafer-level camera applications like lateral lens to lens position accuries of < ± 200 nm on arbitrary x and y distances as well as optic axes tilt measurements using step and repeat UV-nano imprint lithography. ©2010 IEEE.

Kreindl G.,EVGroup | Glinsner T.,EVGroup | Miller R.,EVGroup Inc. | Treiblmayr D.,EVGroup | Fodisch R.,EVGroup
Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics | Year: 2010

Herein, the authors demonstrate the use of step-and-repeat nanoimprint lithography for the fabrication of wafer level lens master. Thereby, the authors will focus on so far unmet needs in regard to lateral lens to lens positioning, residual layer uniformities, as well as optic axis tilt control to enable the fabrication of high-end megapixel camera modules. © 2010 American Vacuum Society.

Kreindl G.,EVGroup | Matthias T.,EVGroup
Proceedings of SPIE - The International Society for Optical Engineering | Year: 2013

The history of imprint technology as lithography method for pattern replication can be traced back to 1970's but the most significant progress has been made by the research group of S. Chou in the 1990's. Since then, it has become a popular technique with a rapidly growing interest from both research and industrial sides and a variety of new approaches have been proposed along the mainstream scientific advances. Nanoimprint lithography (NIL) is a novel method for the fabrication of micro/nanometer scale patterns with low cost, high throughput and high resolution. Unlike traditional optical lithographic approaches, which create pattern through the use of photons or electrons to modify the chemical and physical properties of the resist, NIL relies on direct mechanical deformation of the resist and can therefore achieve resolutions beyond the limitations set by light diffraction or beam scattering that are encountered in conventional lithographic techniques. The ability to fabricate structures from the micro- to the nanoscale with high precision in a wide variety of materials is of crucial importance to the advancement of micro- and nanotechnology and the biotech- sciences as a whole and will be discussed in this paper. Nanoimprinting can not only create resist patterns, as in lithography, but can also imprint functional device structures in various polymers, which can lead to a wide range of applications in electronics, photonics, data storage, and biotechnology. © 2013 Copyright SPIE.

Eibelhuber M.,EVGroup | Razek N.,EVGroup | Dragoi V.,EVGroup | Flotgen C.,EVGroup | And 2 more authors.
Proceedings of the Electronic Packaging Technology Conference, EPTC | Year: 2016

Recent developments in direct wafer bonding make this technology a versatile tool for heterogeneous integration. Advances in process flows and equipment technology trigger new types of application schemes for novel types of device architecture. © 2015 IEEE.

Figura D.,EVGroup | Bartel J.,EVGroup
ECS Transactions | Year: 2010

In recent years SU-8 resist attracted a high interest for fabrication of structures with high topography or high aspect ratio structures. The reasons for SU-8 popularity can be found in its unique properties - high chemical and mechanical stability, biological compatibility, optical transparency, high aspect ratio capability and low cost of fabrication. SU-8 can be used as an alternative molding material to LIGA process; in comparison to the standard LIGA process, relatively thick (1 mm range) SU-8 layers can be processed with UV lithography and do not require expensive X-ray light source. Nevertheless, processing of thick layers of SU-8 is not without challenges - coating high viscosity material, critical soft bakes in order of several hours, exposure requiring good contact, critical post exposure bake and extremely long development times. One aspect of the SU-8 processing, which is explored in this paper, is improvement of the development process time - by using single wafer megasonic-enhanced development. In this paper, the experimental results from manufacturing of SU-8 structures with aspect ratio 1:23 by using UV lithography and megasonic-enhanced development will be presented. Significant development time reduction from 240 min down to 10 min was achieved. ©The Electrochemical Society.

Eibelhuber M.,EVGroup | Matthias T.,EVGroup | Glinsner T.,EVGroup
International Conference on Optical MEMS and Nanophotonics | Year: 2014

In recent years direct writing methods as e-beam lithography have been extensively used for research and development of photonic structures but these techniques cannot be easily scaled up for cost efficient production. The restrictions in pattern size and fabrication of 3D structures, in combination with long process time and high costs make high quality, nanoimprinting techniques an attractive solution for next generation lithography methods. There are several Nanoimprint Lithography (NIL) techniques which can be categorized depending on the process parameters and the imprinting method - either step & repeat or full wafer imprinting. A variety of potential applications has been demonstrated using NIL (e.g. SAW devices, vias and contact layers with dual damascene imprinting process, Bragg structures, patterned media) [1,2]. In this work UV-NIL has been selected for the fabrication process of 3D-photonic crystals. Results with up to five layers will be demonstrated. © 2014 University of Strathclyde.

Eibelhuber M.,EVGroup | Uhrmann T.,EVGroup | Glinsner T.,EVGroup
Proceedings of SPIE - The International Society for Optical Engineering | Year: 2015

Nanoimprinting techniques are an attractive solution for next generation lithography methods for several areas including photonic devices. A variety of potential applications have been demonstrated using nanoimprint lithography (NIL) (e.g. SAW devices, vias and contact layers with dual damascene imprinting process, Bragg structures, patterned media) [1,2]. Nanoimprint lithography is considered for bridging the gap from R and D to high volume manufacturing. In addition, it is capable to adapt to the needs of the fragmented and less standardized photonic market easily. In this work UV-NIL has been selected for the fabrication process of 3D-photonic crystals. It has been shown that UVNIL using a multiple layer approach is well suited to fabricate a 3D woodpile photonic crystal. The necessary alignment accuracies below 100nm were achieved using a simple optical method. In order to obtain sufficient alignment of the stacks to each other, a two stage alignment process is performed: at first proximity alignment is done followed by the Moiré alignment in soft contact with the substrate. Multiple steps of imprinting, etching, Si deposition and chemical mechanical polishing were implemented to create high quality 3D photonic crystals with up to 5 layers. This work has proven the applicability of nanoimprint lithography in a CMOS compatible process on 3D photonic crystals with alignment accuracy down to 100nm. Optimizing the processes will allow scaling up these structures on full wafers while still meeting the requirements of the designated devices. © 2015 SPIE.

Loading EVGroup collaborators
Loading EVGroup collaborators