Sankt Florian am Inn, Austria
Sankt Florian am Inn, Austria

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Grant
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: ICT-26-2014 | Award Amount: 3.23M | Year: 2015

The SAPHELY project focuses on the development and the preclinical validation of a nanophotonic-based handheld point-of-care (POC) analysis device for its application to the minimally-invasive early diagnosis of diseases, with a focus in cancer. Disease identification will be based in the fast (<5 minutes), ultra-sensitive (sub-pM) and label-free detection of novel highly-specific microRNA (miRNA) biomarkers, using a small volume of whole blood (<100 L). This POC analysis device, which will have a low cost (envisaged cost < 3000), will significantly help in the implementation of mass screening programs, with the consequent impact on clinical management, reducing also costs of treatments, and increasing survival rates. The ultra-high sensitivity required for the direct detection of miRNA biomarkers present in the bloodstream will be achieved by using a novel sensing amplification technique. This technique is based in the use of molecular beacon capture probes with an attached high index nanoparticle, so that the hybridization events are translated into the displacement of these nanoparticles from the sensor surface. The use of this self-amplification technique avoids the use of complex PCR-based amplification methods or labelling processes, which are difficult to implement on-chip. The cost, size and weight reduction required for deploying an affordable handheld POC device will be achieved by using a novel power-based readout scheme for photonic bandgap sensing structures where the use of expensive, bulky and heavy tuneable lasers and spectrometers is avoided. Special attention will be paid within the SAPHELY project to explore the potential deployment and commercialisation of the analysis device, by means of the involvement of relevant academic and industrial partners, as well as end users.


Grant
Agency: Cordis | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-02-2014 | Award Amount: 139.30M | Year: 2015

The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilot line between 2 companies: - Soitec for the fabrication of advanced engineered substrates (UTBB: Ultra Thin Body and BOx (buried oxide)) without and with strained silicon top film. - STMicroelectronics for the development and industrialization of state of the art FDSOI technology platform at 14nm and beyond with an industry competitive Power-Performance-Area-Cost (PPAC) trade-off. The project represents the first phase of a 2 phase program aiming at establishing a 10nm FDSOI technology for 2018-19. A strong added value network is created across this project to enhance a competitive European value chain on a European breakthrough and prepare next big wave of electronic devices. The consortium gathers a large group of partners: academics/institutes, equipment and substrate providers, semiconductor companies, a foundry, EDA providers, IP providers, fabless design houses, and a system manufacturer. E&M will contribute to the objective of installing a pilot line capable of manufacturing both advanced SOI substrates and FDSOI CMOS integrated circuits at 14nm and beyond. Design houses and electronics system manufacturer will provide demonstrator and enabling IP, to spread the FDSOI technology and establish it as a standard in term of leading edge energy efficient CMOS technology for a wide range of applications battery operated (consumer , healthcare, Internet of things) or not. Close collaboration between the design activities and the technology definition will tailor the PPAC trade-off of the next generation of technology to the applications needs.


Grant
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: PHC-10-2014 | Award Amount: 4.15M | Year: 2015

The PHOCNOSIS project aims at the development and the preclinical validation of a nanotechnology-based handheld point-of-care testing (POCT) analysis device for its application in the early diagnosis of cardiovascular diseases (CVD). The diagnosis will be carried out by means of the fast (<10 minutes), ultra-sensitive (<1 ng/L) and label-free detection of multiple cardiac biomarkers, using a small volume of whole blood (<100 L). This POCT analysis device will significantly help in the implementation of mass screening programs, with the consequent impact on clinical management, reducing also costs of treatments, and increasing survival rates. The PHOCNOSIS analysis device will be based on two state-of-the-art technological elements in order to obtain a compact and highly sensitive final device. First, an integrated micro-/nanofluidic system will be used for biomarkers separation, purification and concentration, targeting an effective concentration increase by a factor greater than 1000x for the targeted biomarkers. Then, the concentrated biomarkers will be detected using a novel nanophotonic-based sensing technique, envisaging a final combined detection limit below 1 ng/L. This novel sensing technique allows us to obtain systems which are low-cost, compact and with a lower complexity, thus making them suitable for the development of portable devices for POCT. The PHOCNOSIS project will target the deployment of disposable biochips with an envisaged cost below 3 to be used in a handheld analysis device with an envisaged cost below 3000. Special attention will be paid within the PHOCNOSIS project to explore the potential deployment and commercialisation of the analysis device, by means of the involvement of relevant academic and industrial partners, as well as end users.


Grant
Agency: Cordis | Branch: FP7 | Program: CP | Phase: ICT-2011.3.1 | Award Amount: 17.80M | Year: 2013

To extend beyond existing limits in nanodevice fabrication, new and unconventional lithographic technologies are necessary to reach Single Nanometer Manufacturing (SNM) for novel Beyond CMOS devices. Two approaches are considered: scanning probe lithography (SPL) and focused electron beam induced processing (FEBIP). Our project tackles this challenge by employing SPL and FEBIP with novel small molecule resist materials. The goal is to work from slow direct-write methods to high speed step-and-repeat manufacturing by Nano Imprint Lithography (NIL), developing methods for precise generation, placement, metrology and integration of functional features at 3 - 5 nm by direct write and sub-10nm into a NIL-template. The project will first produce a SPL-tool prototype and will then develop and demonstrate an integrated process flow to establish proof-of-concept Beyond CMOS devices employing developments in industrial manufacturing processes (NIL, plasma etching) and new materials (Graphene, MoS2). By the end of the project: (a) SNM technology will be used to demonstrate novel room temperature single electron and quantum effect devices; (b) a SNM technology platform will be demonstrated, showing an integrated process flow, based on SPL prototype tools, electron beam induced processing, and finally pattern transfer at industrial partner sites. An interdisciplinary team (7 Industry and 8 Research/University partners) from experienced scientists will be established to cover specific fields of expertise: chemical synthesis, scanning probe lithography, FEBIP-Litho, sub-3nm design and device fabrication, single nanometer etching, and Step-and-Repeat NIL- and novel alignment system design. The project coordinator is a University with great experience in nanostructuring and European project management where the executive board includes European industry leaders such as IBM, IMEC, EVG, and Oxford Instruments.


Grant
Agency: Cordis | Branch: FP7 | Program: CP | Phase: ICT-2013.3.3 | Award Amount: 11.05M | Year: 2013

SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D to equipment assessment experiments. The strategic objective is to effectively combine resources and expertise in a joint assessment of novel equipment for key enabling technologies to foster and accelerate the successful transfer of novel European equipment into the world-wide market.\nSEA4KET builds on the proven principle established in previous European SEA programs and projects: to take novel, innovative and promising equipment that has left the R&D phase into a joint assessment activity this bridges the well-known gap between the phase of having an engineered tool available and finding the first user and finally success in the market for it.\nWhile proven principles from previous SEA activities are kept, SEA4KET takes them to the new field of assessing equipment for Key Enabling Technologies: SEA4KET concentrates on process and metrology systems for important enablers of future technologies: 450 mm wafer equipment, SiC material and 3D processing. The proposal comprises 15 sub-projects each dedicated to a specific equipment. The assessment activities were to a lesser extent chosen by high S&T excellence, but by their expected chance on the market.\nWhile leading R&D institutes are active in each assessment experiment to support individual final developments, several cross-cut R&D activities were identified (and combined in a dedicated sub-project) that are relevant to multiple assessments. Training material will be provided and workshops will be organized, to support and strengthen the individual dissemination activities.\nSEA4KET will significantly strengthen the European equipment and material industry for the emerging market for Key Enabling Technologies in a sustainable way by combining advanced R&D with equipment assessment involving users, institutes and equipment suppliers with specific benefit for SME suppliers.


Grant
Agency: Cordis | Branch: FP7 | Program: CP | Phase: ICT-2013.3.3 | Award Amount: 18.11M | Year: 2013

The concept of the MSP project is based on a multi-project wafer approach that enables the development of highly innovative components and sensors based on Key Enabling Technologies (KETs). The central objective of the MSP-project is the development of a technology and manufacturing platform for the 3D-integration of sophisticated components and sensors with CMOS technology being the sound foundation for cost efficient mass fabrication.\nThe MSP project is focused on the development of essential components and sensors that are required for the realization of miniaturized smart systems capable for indoor and outdoor environmental monitoring:\n\ Gas sensors for detection of potentially harmful or toxic gases\n\ Sensors for particulate matter and ultrafine particles\n\ Development of metamaterial based IR sensors for presence and fire detection\n\ Development of optimized IR detectors based on SOI thermopiles\n\ Development of highly efficient photovoltaics and piezoelectrics for energy harvesting\n\ Development of light sensor and UV-A/B sensors.\nThe rigorous employment of Through-Silicon-Via technology enables a highly flexible plug-and play 3D-integration of these components and sensors to miniaturized smart systems with significantly advanced functionalities. The goal of the MSP project is the development of a smart multi-sensor platform for distributed sensor networks in Smart Building Management, which are able to communicate with smart phones.\nThe MSP project covers the heterogeneous integration of KETs and contributes to reinforce European industrial leadership through miniaturization, performance increase and manufacturability of innovative smart systems. The MSP project is focused on emerging innovative technologies and processes for customer needs with a special emphasis on SMEs to enable their take up of KETs for competitive, highly performing product development.


Grant
Agency: Cordis | Branch: H2020 | Program: IA | Phase: NMP-04-2014 | Award Amount: 7.93M | Year: 2015

Roll-to-roll (R2R) technologies are mature core processes in manufacturing lines for graphical printing industry. In several other areas (e.g. electronics or optics) R2R techniques are emerging, being expected to notably lower the unit prices of flexible devices. In particular, recently developed roller-based nanoimprinting methods enable unrivalled throughput and productivity for precise fabrication of micro- and nanoscale patterns. Areas that will benefit strongly from adopting such R2R nanoimprinting technologies are microfluidics and lab-on-chip products for diagnostics, drug discovery and food control. Such devices require combined printing of micro- and nanostructures and large quantities at low unit costs. The project R2R Biofluidics aims on the development of a complete process chain for first-time realization of production lines for two selected bioanalytical lab-on-chip devices based on high-throughput R2R nanoimprinting in combination with complementary printing and manufacturing technologies. Two types of demonstrators will be fabricated targeting application areas, which would clearly benefit from technology advancement in high volume manufacturing, show large potential for commercial exploitation and adopt current standard formats (microtiter plate and microscope slides). Demonstrator 1 will represent an in-vitro diagnostic (IVD) chip suitable for point-of-care applications, showing improved sensitivity thanks to imprinted nanoscale optical structures and microfluidic channels. R2R fabrication will further greatly reduce production costs and increase manufacturing capacity with respect to currently used products. Demonstrator 2 will provide a device for improved neuron based high-throughput screening assays in drug development. It will consist of nano to microstructured, interconnected channels in combination with dedicated biofunctionalized surfaces for alignment and controlled growth of neurons.


Patent
Ev Group E Thallner Gmbh | Date: 2016-07-12

A process for the production of a permanent, electrically conductive connection between a first metal surface of a first substrate and a second metal surface of a second substrate, wherein a permanent, electrically conductive connection is produced, at least primarily, by substitution diffusion between metal ions and/or metal atoms of the two metal surfaces.


Patent
Ev Group E Thallner Gmbh | Date: 2016-06-28

Device and method for alignment of a first contact surface of a first substrate with a second contact surface of a second substrate which can be held on a second platform. The device includes first X-Y positions of first alignment keys located along the first contact surface, and second X-Y positions of second alignment keys which correspond to the first alignment keys and which are located along the second contact surface, wherein the first contact surface can be aligned based on the first X-Y positions in the first alignment position and the second contact surface can be aligned based on the second X-Y positions in the second alignment position.


A method for measuring and/or acquiring layer thicknesses and voids of one or more layers of a temporary bonded wafer stack on a plurality of measuring points is provided. A sequence of the method includes an arrangement of a measurement means for measuring and/or acquiring the layer thicknesses and voids of the layers of the wafer stack at the measuring points relative to a flat side of the wafer stack. The sequence further includes an emission of signals in the form of electromagnetic waves by a transmitter of the measurement means, and a receiving the signals which have been reflected by the wafer stack by a receiver of the measurement means. The sequence also includes an evaluation of the signals which have been received by the receiver by an evaluation unit.

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