Ev Group E Thallner Gmbh | Date: 2015-09-30
A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.
Ev Group E Thallner Gmbh | Date: 2013-12-04
A method for microcontact embossing of a structure by transferring an embossing material onto a target surface of a substrate by means of an embossing surface of a structural die. The embossing material is comprised at least predominantly of silane or at least predominantly of at least one silane derivative and in that the structural die is a soft die. A corresponding method is provided in which the embossing material is a molecular component that is comprised at least predominantly of organic molecules.
Ev Group E Thallner Gmbh | Date: 2013-11-05
A device for bonding of a second substrate onto a first substrate, comprising a receiving apparatus for receiving the first substrate which has been coated with a bond layer and the second substrate which is held on the bond layer, and an action apparatus for applying a bond force to the second substrate on one action side of the second substrate, which side faces away from the bond layer proceeding from an initial zone A, which lies within an edge zone R of the action side as far as action on the entire action side. Furthermore, this invention relates to a corresponding method.
Ev Group E Thallner Gmbh | Date: 2015-05-20
A method for embossing a structure material on a substrate disposed within a device having side walls, a base plate and a cover that define a working space that is isolated from a surrounding environment. The method includes the steps of: a) moving the substrate using a first calibration means and aligning the substrate with an application means, b) applying the structure material to the substrate, c) moving the substrate using a second calibration means that is located at least partially in the working space wherein the substrate is disposed within the working space and is aligned with an embossing means that is located at least partially in the working space, and d) embossing the structure material on the substrate while the substrate is in the working space using the embossing means, wherein the working space has a defined atmosphere, before and during the step of embossing, without interruption.
Ev Group E Thallner Gmbh | Date: 2015-04-22
A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.