News Article | November 11, 2016
SCOTTSDALE, AZ--(Marketwired - Nov 11, 2016) - MEMS & Sensors Industry Group (MSIG)'s MEMS & Sensors Executive Congress™ -- held November 9-11 in Scottsdale, AZ -- gave innovative developers of driverless vehicles and drone-defense makers -- as well as one of the world's top carriers -- a ready audience of industry execs as they shared their wants for new MicroElectroMechanical Systems (MEMS)/sensors for future products. Phillip M. Rayer II, general manager, Local Motors, described how his company uses "co-creation" -- involving as many as 50,000 developers -- to design driverless electric vehicles for target communities. Local Motors uses 3D printing to manufacture the vehicles in months rather than years. "Today's transportation system is characterized largely by privately owned, individually driven, gas-powered vehicles that sit unused 95 percent of the time, cost over $1 trillion annually and emit 1 gigaton of emissions each year," Phillip M. Rayer II, general manager, Local Motors. "A more cost-effective, efficient, equitable and convenient system is possible -- one that delivers a variety of shared, electrified and autonomous mobility options when and where they are needed. We call this 'mobility as a service' -- and we have proven it through the first 3D-printed structural car and the first self-driving electric vehicle to integrate the advanced cognitive computing capabilities of IBM Watson. Through co-creation, we are now working on the first 3D-printed driverless car for highways." Cameron Coursey, vice president of product development for AT&T's Internet of Things Solutions, told MEMS and sensors suppliers that they play a critical role in the "Fourth Industrial Revolution": the Internet of Things (IoT). Dan Hyman, president, XCOM Wireless, and partner, Icarus Technologies, Inc. introduced attendees to the concept of "democratizing airspace to defend against drones." Leveraging RF MEMS from XCOM Wireless, Icarus develops portable, affordable counter-drone products to stop drones used unwittingly by dangerous hobbyists as well as by willful enemies. MEMS & Sensors Industry Group Executive Director Karen Lightman expanded upon themes from MEMS & Sensors Executive Congress," In MEMS and sensors, there is a need for co-creation, standards, connectivity and audio technologies that enhance voice user interface as well as ultrasonics that redefine gesture control," said Lightman. "There was a collective buzz around driverless mobility solutions and environmental sensing. Attendees also learned about future-term technologies such as perpetual energy sources for autonomous sensing devices and printed hybrid electronics. As we look to 2017 and beyond, MEMS and sensors suppliers will continue to advance the user experience with every imaginable electronic product and system." Tech Showcase Winner and Hall of Fame MEMS & Sensors Technology Showcase is a forum through which five finalists competed for attendees' votes and the title of "winner." The 2016 Technology Showcase winner, i-BLADES' mobile Smartcase, is a new modular accessory that dramatically accelerates time to market and reach for IoT technologies. It lets new technologies quickly reach mass-market mobile consumers through one integrated smartphone accessory -- a mobile phone case that forms a "hard-wired" smartphone connection, enabling add-on MEMS and IoT technologies. MEMS & Sensors Industry Group also inducted three new members into the MEMS & Sensors Industry Group Hall of Fame: Ken Foust, platform manager, Intel Corporation; Dave Monk, vice president and general manager of motion sensors, NXP Semiconductor; and Jason Weigold, president, MEMStaff. Upcoming Events MSIG will also host a full-day conference track at 2017 International CES, MEMS & Sensors: Personalizing Consumer Technology, January 5, 2017 in Las Vegas, NV. MEMS & Sensors Technical Congress will take place May 10-11, 2017 at Stanford University in Stanford, CA. MEMS & Sensors Executive Congress US 2017 will take place November 1-2, 2017 at the Silverado Resort & Spa in Napa Valley, CA. For a complete list of MEMS & Sensors Industry Group events, please visit: www.memsindustrygroup.org or contact MEMS & Sensors Industry Group via phone: 412.390.1644 or email: email@example.com. About MEMS & Sensors Executive Congress Now in its 12th year, MEMS & Sensors Executive Congress 2016 is an annual event that brings together business leaders from a broad spectrum of industries: automotive, communications, consumer goods, energy/environmental, industrial and medical. It is a unique professional forum at which executives from companies designing and manufacturing MEMS/sensors technology sit side-by-side with their end-user customers to exchange ideas and information about the use of MEMS and sensors in commercial applications. Premier sponsors of MEMS & Sensors Executive Congress US 2016 include Platinum Sponsor EV Group; Gold Sponsors Enterprise Florida and SPTS Technologies; Silver Sponsors Lam Research and NXP; Bronze Sponsors Analog Devices, Applied Materials, OMRON, TECNISCO, ULVAC and X-FAB MEMS Foundry. About MEMS & Sensors Industry Group MEMS & Sensors Industry Group (MSIG) is the trade association advancing MEMS and sensors across global markets. MSIG advocates for near-term commercialization of MEMS/sensors-based products through a wide range of activities, such as conferences, technical working groups and education. By bringing the TSensors™ (Trillion Sensors) initiative under the umbrella of events and programs, MSIG also increases worldwide awareness of emerging MEMS/sensors-based applications with huge commercialization potential in the next decade and beyond. Nearly 200 companies and industry partners comprise MEMS & Sensors Industry Group. For more information, visit: www.memsindustrygroup.org and follow MSIG on LinkedIn and Twitter (use @MEMSGroup). MEMS & Sensors Industry Group, the MEMS & Sensors Industry Group logo, MEMS & Sensors Executive Congress and TSensors are trademarks of MEMS & Sensors Industry Group. All other product and company names are trademarks or registered trademarks of their respective holders.
News Article | October 11, 2016
Home > Press > MEMS & Sensors Industry Group Reveals Tech Showcase Finalists --MSIG hosts competition for unique MEMS/sensors demos at MEMS & Sensors Executive Congress, 11/10/16 in Scottsdale, AZ Abstract: MEMS & Sensors Industry Group (MSIG)s annual MEMS & Sensors Technology Showcase at MEMS & Sensors Executive Congress® 2016 (November 9-11, 2016 in Scottsdale, AZ) highlights some of the newest and most unique MEMS/sensors-enabled applications in the industry. MSIG today announced the shortlist of finalists who will compete for the title of winner at this years event. i i-BLADES Smartplatform i-BLADES mobile Smartcase is a new modular accessory that dramatically accelerates time to market and reach for MEMS and Internet of Things (IoT) technologies. It lets new technologies quickly reach mass-market mobile consumers through one integrated smartphone accessory -- a mobile phone case. It not only provides protection but also a Smartplatform that forms a hard-wired smartphone connection, enabling add-on MEMS and IoT technologies. Developers can add new sensors to Smartcase directly or through snap-on Smartblade modules. With i-BLADES, technologies can quickly go onto hundreds of millions of smartphones as an after-market opportunity, making smartphones smarter. i-BLADES partnered with Bosch to deploy successfully the BME680 sensor faster than via other routes. For more information, visit: www.i-blades.com or watch video: https://www.youtube.com/watch?v=dVcOewMhopE&feature=youtu.be Chirp Microsystems MEMS-Based Ultrasonic Sensing Solution Todays VR and gaming systems are limited by their reliance on complex computer vision techniques for controller tracking, resulting in higher cost, limited tracking area and lack of mobility due to high power consumption. Chirp Microsystems ultrasonic tracking technology addresses these limitations, offering solutions that enable truly mobile VR and AR systems at attractive price points suitable for multiple tiers of products. Chirp Microsystems new ultrasonic time-of-flight (ToF) technology uses pulses of ultrasound to measure an objects range with millimeter accuracy. This ultra-low power ultrasonic ToF technology enables low-latency, millimeter-accurate 6 degrees of freedom (DOF) inside-out controller tracking for VR/AR and gaming systems. This system solution is enabled by Chirps ultra-low power ultrasonic ToF sensor, which offers ultra-wide field-of-view, noise and light immunity, fast sample rate, and small package size. The ToF sensor is a system in package (SiP) that combines a MEMS ultrasound transducer with a power-efficient digital signal processor (DSP) on a custom integrated circuit. In wearable applications, Chirps ultrasonic SiP provides a transformative and intuitive touchless gesture interface. For more information, visit: www.chirpmicro.com Integrated Device Technologys Gas Sensor for Air Quality and Breath Detection Integrated Device Technologys (IDTs) new highly sensitive gas sensor family based on the ZMOD3250 targets indoor air quality with a roadmap that includes environmental (outdoor) air quality and breath detection. The ZMOD3250 family detects total volatile organic compounds (VOCs) and odors, and can be used to selectively identify several VOCs, including formaldehyde, ethanol and toluene. The company is promoting several features and applications of this new gas sensor product line, including the off-gassing detection of chemicals from common home and office materials, odor detection, selective measurements among VOCs and detection of several breath components. IDTs flagship product, the ZMOD3250, features a unique silicon microhotplate with nanostructured sensing material that enables a highly sensitive measurement of gas. The accompanying ASIC provides a flexible solution for integration of the sensor with various consumer devices, including mobile phones, wearables and appliances. Packaged in a 12 pin LGA assembly (3.0 mm x 3.0 mm x 0.7 mm), the sensor emulates a sensor array with a single sensor element. Suitable for a wide range of applications, the sensor features programmable-measurement sequence and highly integrated CMOS design. To request more information about the ZMOD3250, visit: www.idt.com or watch video: http://www.idt.com/video/uv-sensor-and-gas-sensor-demonstration-idt Valencells Biometric Gaming Biometric input adds a new element to gaming. For example, fitness games can use heart rate as a key control measure, or action games can require users to hold their breath while their characters are swimming. Audio earbuds, headsets, armbands and wrist devices all of which make good use of MEMS/sensors -- are natural peripherals for gaming -- and as well as for exercising. Valencell has created a demonstration game that not only involves real-time biometric data to affect the gaming experience, but also collects meaningful health metrics in the background. This has implications not only for the gaming industry, but also for healthcare and medical markets. In fact, healthcare practitioners are integrating biometric game play into physical therapy and surgery recovery protocols to measure and manage recovery processes. Valencell will demonstrate the game as well as its biometric output and analysis. For more information, visit: www.valencell.com or watch video: https://www.youtube.com/watch?v=QMTJP6OBmjA Vespers Wake-on Sound MEMS Microphone Always-listening MEMS microphones may signal a new era of ubiquitous sensors that can run indefinitely on small batteries. Thats good news for developers of TV remote controls, smart speakers, smartphones, intelligent sensor nodes, hearables and other electronic devices. Its even better news for consumers who want to cut the power cord but end up incessantly charging devices or replacing batteries, even when those devices arent in regular use. Vesper--developer of the worlds only piezoelectric MEMS microphones--will demonstrate VM1010, the first quiescent-sensing MEMS microphone, during MEMS & Sensors Technology Showcase. VM1010 alleviates the heavy power consumption typical of speech recognition--which consumes up to 1000 µW or more. Because it supports wake-on sound at practically zero power draw (a mere 3 µA of current while in listening mode), VM1010 reduces standby power by two orders of magnitude and can increase standby time by a factor of 100. Vesper will also demonstrate the extremely fast response time of VM1010, showing how it can go to full power within microseconds, quick enough to record what a user is saying and capture keywords and other acoustic event triggers. For more information, visit: www.vespermems.com or watch video: https://www.youtube.com/watch?v=KhFtrjbpffE Join Us for MEMS & Sensors Technology Showcase Sponsored by Rogue Valley Microdevices, MEMS & Sensors Technology Showcase will take place from 11:15 am-12:15 pm. on November 10, 2016. Audiences will choose a winner, which MSIG Executive Director Karen Lightman will announce at the close of MEMS Executive Congress US 2016 on November 11. About MEMS & Sensors Industry Group MEMS & Sensors Industry Group (MSIG) is the trade association advancing MEMS and sensors across global markets. MSIG advocates for near-term commercialization of MEMS/sensors-based products through a wide range of activities, such as conferences, technical working groups and education. By bringing the TSensors® (Trillion Sensors) initiative under the umbrella of events and programs, MSIG also increases worldwide awareness of emerging MEMS/sensors-based applications with huge commercialization potential in the next decade and beyond. Nearly 200 companies and industry partners comprise MEMS & Sensors Industry Group. For more information, visit: www.memsindustrygroup.org and follow MSIG on LinkedIn and Twitter (use @MEMSGroup). MEMS & Sensors Industry Group, the MEMS & Sensors Industry Group logo, MEMS & Sensors Executive Congress and TSensors are registered trademarks of MEMS & Sensors Industry Group. All other product and company names are trademarks or registered trademarks of their respective holders. About MEMS & Sensors Executive Congress Now in its 12th year, MEMS & Sensors Executive Congress 2016 is an annual event that brings together business leaders from a broad spectrum of industries: automotive, communications, consumer goods, energy/environmental, industrial and medical. It is a unique professional forum at which executives from companies designing and manufacturing MEMS/sensors technology sit side-by-side with their end-user customers in panel discussions and networking events to exchange ideas and information about the use of MEMS and sensors in commercial applications. Premier sponsors of MEMS & Sensors Executive Congress US 2016 include: Platinum Sponsor EV Group; Gold Sponsors Enterprise Florida and SPTS Technologies; Silver Sponsor NXP; Bronze Sponsors Analog Devices, Applied Materials, OMRON, TECNISCO, ULVAC and X-FAB MEMS Foundry. Event sponsors include: Bosch Automotive Electronics (AE), Bosch Sensortec GmbH, Coventor, Huawei, IHS Markit, MCA Public Relations, MEMS Journal, microGen Systems, MIPI Alliance, PNI Sensor, Rogue Valley Microdevices and Yole Développement. MEMS & Sensors Executive Congress US will take place November 9-11, 2016 at the JW Marriott Scottsdale Camelback Inn Resort & Spa. For more information, please contact MSIG via phone: +412/390-1644, email: or visit MEMS & Sensors Executive Congress US at: http://msigevents.org/msec2016/ Registration For conference registration, please visit: http://msigevents.org/msec2016/registration/ . For press registration, please contact Maria Vetrano, Vetrano Communications, email: maria[at]vetrano.com. For more information, please click If you have a comment, please us. Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Dussault D.,ProSys Inc. |
Fournel F.,CEA Grenoble |
Dragoi V.,EV Group
ECS Transactions | Year: 2012
The increased complexity of microelectronic and sensor applications that have emerged over the past decade have driven wafer bonding to mature as a production technology for both MEMS and 3D stacked die manufacturing. The use of CMOS device wafers has restricted the types of viable bonding processes to low temperature fusion bonding, adhesive bonding and metal bonding. Due to the specific requirements of CMOS technology the allowed bonding processes had to be adapted in order to fulfill the specific CMOS-compatibility demands. This paper presents a novel single wafer Megasonic based cleaning method with enhanced process control capabilities. This cleaning process is integrated in low temperature fusion bonding process and enables higher bonding yields and a reduction in process fluid usage. © The Electrochemical Society.
CE & Mobile, ADAS Makers Look to MEMS Sensors Industry for Enhanced User Experiences at MEMS Executive Congress US 2015 Smartphone, wearables, ADAS, VR Companies Engage with MEMS Sensors Suppliers at MEMS & Sensors Industry Groups annual executive event
News Article | November 9, 2015
Home > Press > CE & Mobile, ADAS Makers Look to MEMS/Sensors Industry for Enhanced User Experiences at MEMS Executive Congress US 2015 --Smartphone, wearables, ADAS, VR Companies Engage with MEMS/Sensors Suppliers at MEMS & Sensors Industry Groups annual executive event Abstract: MEMS & Sensors Industry Groups MEMS Executive Congress® US 2015 -- held November 4-5 in Napa, CA -- gave some of the worlds leading manufacturers of virtual reality (VR), mobile handsets, wearables and advanced driver assistance systems (ADAS) a ready audience of industry execs as they shared their wants for new micro-electromechanical systems (MEMS)/sensors for future products. Xianfeng Ding, chief scientist of sensing at Huawei -- the worlds third largest mobile phone manufacturer and top 10 wearables maker -- called upon the whole MEMS/sensors industry to innovate in power management, sensing and wireless connectivity -- critical functionality in smartphones and wearables. Jack McCauley, co-founder of Oculus VR and now principal of McCauley Labs, is working on more sophisticated VR head tracking systems, all of which require MEMS to function properly. McCauley sees MEMS micro mirrors as the next potential solution. Jeff Owens, CTO and executive vice president of Delphi Automotive, shared some metrics from a coast-to-coast automated drive using a vehicle built with Delphis advanced driver assistance systems (ADAS). Delphis coast-to-coast automated drive was 3,400 miles over nine days through 15 states using 20 active safety sensors plus GPS, navigation, vision systems and driver-state monitoring. More than 99% of the distance was fully automated, and we gathered three terabytes of valuable data. With their car generally the most sophisticated piece of electronics that people own, according to Owens, growth in ADAS is one more market driving the MEMS/sensors industry forward. MEMS & Sensors Industry Group Executive Director Karen Lightman described the impetus for such active speaker-attendee engagement, The MEMS and sensors industry is providing billions of devices that define the personalized, interactive and contextual user experiences in the products we use on a daily basis. MEMS Executive Congress brings the catalysts from both sides of the equation -- the executive decision-makers buying and supplying MEMS technology -- into the room with a common purpose: driving sales of more highly differentiated products that will produce positive revenue streams. MEMS & Sensors Industry Group also celebrated innovation through three popular annual events: · MEMS & Sensors Technology Showcase is a forum through which five finalists competed for attendees votes and the title of winner. The 2015 Technology Showcase winner, Bosch eBike Systems, boosts a bicyclists human power with electric power at speeds up to 20 mph. The core components that give Bosch eBike Systems cyclists that tailwind feeling are a Bosch microprocessor and three sensors that measure a bicyclists torque, cadence and wheel speed 1,000 times per second. · Elevator Pitch Session is a Shark Tank-like event for five finalists representing a mixture of startups, established companies, researchers and individuals, each presenting products for potential funding to a panel of judges. This years Elevator Pitch winner, NXTSENS Microsystems, is designing MEMS-based timing solutions that feature ultra-stable, low jitter and temperature compensated oscillators. In addition to bragging rights, Bosch eBike Systems and NXTSENS Microsystems won one free year of MEMS & Sensors Industry Group membership. · Best in MEMS & Sensors Innovation Awards (MEMsies) -- winners were selected through an open month-long voting process for finalists in a number of categories. 2015 MEMsies winners include: · MEMS/Sensors Device of the Year: mCube -- MC3571 (1x1mm WLCSP 3-axis accelerometer) · MEMS/Sensors Engineer of the Year: Stephen Lloyd, InvenSense, for ICM-30630 (FireFly platform) · MEMS/Sensors Foundry of the Year: TSMC for MEMS foundry process(es) · MEMS/Sensors Startup of the Year: Dyna Image Corp. for optical and inertial sensors, hybrid sensors, and fusion software · MEMS/Sensors Supplier of the Year: EV Group for wafer bonders · MEMS/Sensors Designer of the Year: Eugene Hwang, Analog Devices (ADI) for ADI gyroscopes with innovative proof-mass design and transduction mechanism · MEMS/Sensors Analyst of the Year: Jérémie Bouchaud, senior director, IHS, for best market overview and understanding · MEMS/Sensors Integrator of the Year: Dyna Image and mCube -- DI5113 (light sensor and accelerometer in a 2x2mm package) · MEMS/Sensors Executive of the Year: Ben Lee, president and CEO, mCube · MEMS/Sensors Lifetime Achievement Award: Stefan Finkbeiner, CEO, Bosch Sensortec MEMS & Sensors Industry Group also inducted two new members into the MEMS Industry Group Hall of Fame: MaryAnn Maher, president and CEO, SoftMEMS, and Mike Stanley, Sensors and Actuators Group, Freescale. Upcoming Events MEMS & Sensors Industry Group will host a full-day conference track at 2016 International CES, The Internet of MEMS and Sensors, January 7, 2016 in Las Vegas, NV. MEMS Technical Congress 2016 will take place March 7-8, 2016 in Munich, Germany. MEMS Executive Congress US 2016 will take place November 9-11, 2016 at the JW Marriott Scottsdale Camelback Resort & Spa in Scottsdale, AZ. For a complete list of MEMS & Sensors Industry Group events, please visit: events.memsindustrygroup.org or contact MEMS & Sensors Industry Group via phone: 412.390.1644 or email: About MEMS & Sensors Industry Group MEMS & Sensors Industry Group is the trade association advancing MEMS and sensors across global markets. Nearly 200 companies and industry partners comprise MEMS & Sensors Industry Group, including Analog Devices, Applied Materials, ARM, Bosch, EV Group, Freescale Semiconductor, GE, GLOBALFOUNDRIES, HP, HTC Corporation, Huawei, Goertek, Infineon, Intel, InvenSense, Jawbone, Kionix, Knowles Corporation, Lenovo, OMRON Electronic Components, Qualcomm Technologies, Inc., SONY Electronics, SPTS Technologies, STMicroelectronics, Texas Instruments and TSMC. For more information, visit: www.memsindustrygroup.org. MEMS Executive Congress, MEMS Industry Group and the MEMS Industry Group logo are registered trademarks of MEMS Industry Group. All other product and company names are trademarks or registered trademarks of their respective holders. About MEMS Executive Congress Now in its eleventh year, MEMS Executive Congress is an annual event that brings together business leaders from a broad spectrum of industries: automotive, communications, consumer goods, energy/environmental, industrial and medical. It is a unique professional forum at which executives from companies designing and manufacturing MEMS/sensors technology sit side-by-side with their end-user customers in panel discussions and networking events to exchange ideas and information about the use of MEMS and sensors in commercial applications. Premier sponsors of MEMS Executive Congress US 2015 include: Platinum Sponsor EV Group; Gold Sponsors SPTS Technologies and Lam Research Corporation; Silver Sponsors Analog Devices and Freescale Semiconductor; Bronze Sponsors Applied Materials and X-Fab MEMS Foundry. Event sponsors include: Acuity, Akustica, Bosch Automotive Electronics (AE), Bosch Sensortec GmbH, Coventor, Expertech, IEEE Standards Association (IEEE-SA), MCA PR, MEMS Journal, MEMS & Technology Exchange (MNX), PNI Sensor Corporation, Solid State Technology, Teledyne DALSA, WiSpry and Yole Développement. For more information, please click If you have a comment, please us. Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Dragoi V.,EV Group |
Pabo E.,EV Group Inc.
ECS Transactions | Year: 2010
Wafer bonding processes offer valuable solutions not only for MEMS devices but more recently for wafer-level 3D interconnects, advanced packaging and LED applications. The increased complexity of the wafer bonding based applications requires very accurate process design. Unfortunately bonding process selection and design is not always well documented or understood and some important details may not be considered, possibly resulting in major issues during product prototyping or even manufacturing. The main topics to be considered for wafer bonding process selection are summarized and explained. ©The Electrochemical Society.
Peic A.,EV Group
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings | Year: 2014
The increasing adoption of advanced wafer-level packaging (WLP) technologies and high-density interposer concepts clearly reflects the permanent need for form factor reduction, smaller process geometries and higher-count I/O on ICs. Currently, several strategies are being pursued to achieve these goals. The most promising approaches are summarized under the concept of three-dimensional integrated circuits (3D-IC) and three-dimensional wafer level packaging (3D-WLP) technology. The transition from two-dimensional (2D) packaging to more advance 3D packaging is considered to be one of the major developments in the semiconductor industry. © 2014 IEEE.
Rebhan B.,EV Group |
Rebhan B.,Johannes Kepler University |
Hingerl K.,Johannes Kepler University
Journal of Applied Physics | Year: 2015
The study of the physical mechanisms driving Cu-Cu wafer bonding allowed for reducing the bonding temperatures below 200 °C. Metal thermo-compression Cu-Cu wafer bonding results obtained at such low temperatures are very encouraging and suggest that the process is possible even at room temperature if some boundary conditions are fulfilled. Sputtered (PVD) and electroplated Cu thin layers were investigated, and the analysis of both metallization techniques demonstrated the importance of decreasing Cu surface roughness. For an equal surface roughness, the bonding temperature of PVD Cu wafers could be even further reduced due to the favorable microstructure. Their smaller grain size enhances the length of the grain boundaries (observed on the surface prior bonding), acting as efficient mass transfer channels across the interface, and hence the grains are able to grow over the initial bonding interface. Due to the higher concentration of random high-angle grain boundaries, this effect is intensified. The model presented is explaining the microstructural changes based on atomic migration, taking into account that the reduction of the grain boundary area is the major driving force to reduce the Gibbs free energy, and predicts the subsequent microstructure evolution (grain growth) during thermal annealing. © 2015 AIP Publishing LLC.
News Article | November 10, 2016
FREIBURG, Germany and ST. FLORIAN, Austria, Nov. 9, 2016 /PRNewswire/ -- Researchers at the Fraunhofer Institute for Solar Energy Systems ISE together with the Austrian company EV Group (EVG) have successfully manufactured a silicon-based multi-junction solar cell with two contacts and an...
News Article | November 14, 2016
A silicon-based multi-junction solar cell with an efficiency of 30.2% has been manufactured by researchers at the Fraunhofer Institute for Solar Energy Systems and EV Group, the two organisations said. Known as a III-V/Si multi-junction solar cell, it consists of a sequence of stacked subcells made of gallium-indium-phosphide (GaInP), gallium-arsenide (GaAs) and silicon (Si), which collectively span an absorption range of 300-1180nm. The record conversion efficiency for the III-V / Si multi-junction solar cell of 4 sq cm was measured at Fraunhofer ISE’s calibration laboratory. In comparison, Fraunhofer states, the highest efficiency measured to date for a pure silicon solar cell is 26.3%, and the theoretical efficiency limit is 29.4%. “We are working on methods to surpass the theoretical limits of silicon solar cells,” said Frank Dimroth, department head at Fraunhofer ISE. Manufactured with two contacts, the researchers used a ‘direct wafer bonding’ process to transfer a few micrometers of semiconductor material to a silicon substrate. After plasma activation, the subcell surfaces are bonded together in a vacuum by applying pressure. The atoms on the surface of the III-V subcell form bonds with the silicon atoms, creating a monolithic device. EV Group (EVG), the Austrian supplier of process solutions for semiconductor manufacturing, applied its technology for resistance-free bonding of different semiconductors without the use of adhesive in the manufacture of the cell. “Key to the success was to find a manufacturing process for silicon solar cells that produces a smooth and highly doped surface which is suitable for wafer bonding as well as accounts for the different needs of silicon and the applied III-V semiconductors,” explained Jan Benick, team leader at Fraunhofer ISE.
News Article | December 5, 2016
WiseGuyReports.Com Publish a New Market Research Report On – “3D Semiconductor Packaging Industry Global Key Vendors,Manufacturers,Suppliers and Analysis Market Report 2020”. The analysts forecast the global 3D semiconductor packaging market to grow at a CAGR of 16.27% during the period 2016-2020. Recent technology advances along with improved durability, reduced energy consumption, superior performance, enhanced quality, and highly efficient features of 3D semiconductor packaging equipment are making this equipment attractive packaging proposition in the semiconductor industry, especially in the consumer electronics industry. The increasing demand for consumer electronics is expected to increase the revenue of the global 3D semiconductor packaging market during the forecast period. For more information or any query mail at [email protected] Covered in this report The report covers the present scenario and the growth prospects of the global 3D semiconductor packaging market for 2016-2020. To calculate the market size, the report considers revenue generated from the sales of 3D semiconductor packaging equipment to semiconductor component manufacturers. The market is divided into the following segments based on geography: • Americas • APAC • EMEA The report, Global 3D Semiconductor Packaging Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market. Key vendors • Amkor Technology • SUSS Microtek • EV Group • Tokyo Electron Other prominent vendors • ACCRETECH Tokyo Seimitsu • Rudolph Technologies • SEMES • Ultratech • ULVAC Market driver • Need to control chip design costs • For a full, detailed list, view our report Market challenge • High capital investment in 3D semiconductor packaging • For a full, detailed list, view our report Market trend • Short replacement cycle of portable electronic devices • For a full, detailed list, view our report Key questions answered in this report • What will the market size be in 2020 and what will the growth rate be? • What are the key market trends? • What is driving this market? • What are the challenges to market growth? • Who are the key vendors in this market space? • What are the market opportunities and threats faced by the key vendors? • What are the strengths and weaknesses of the key vendors? PART 02: Scope of the report • Definition • Report overview • Base year and forecast period • Geographical segmentation • Common currency conversion rates • Vendor offerings PART 06: Market segmentation by application • Global 3D semiconductor packaging market by application 2015-2020 • Consumer electronics • Others PART 07: Geographical segmentation • 3D semiconductor packaging market in APAC • 3D semiconductor packaging market in EMEA • The Americas For more information or any query mail at [email protected] Wise Guy Reports is part of the Wise Guy Consultants Pvt. Ltd. and offers premium progressive statistical surveying, market research reports, analysis & forecast data for industries and governments around the globe. Wise Guy Reports features an exhaustive list of market research reports from hundreds of publishers worldwide. We boast a database spanning virtually every market category and an even more comprehensive collection of market research reports under these categories and sub-categories.