München, Germany
München, Germany

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Patent
Epcos AG | Date: 2016-12-14

A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to 40 C. and less than or equal to 150 C.


An electronic device comprises- a first capacitor (C1) being coupled in series to a first one-way conductor (D1), that allows current flow in one direction, and the first one-way conductor (D1) and the first capacitor (C1) being coupled between a load node (LOAD) and a reference potential (0), and- a second capacitor (C2) being coupled in series to a second one-way conductor (D2), that allows current flow in the opposite direction, the second one-way conductor (D2) and the second capacitor (C2) being coupled between the load node (LOAD) and the reference potential (0), and- a third capacitor (C3) being coupled between the load node (LOAD) and the reference potential (0), and- a first switch (S1) bypassing the first one-way conductor (D1), and-a second switch (S2) bypassing the second one-way conductor (D2).


Grant
Agency: Cordis | Branch: H2020 | Program: SGA-RIA | Phase: FETFLAGSHIP | Award Amount: 89.00M | Year: 2016

This project is the second in the series of EC-financed parts of the Graphene Flagship. The Graphene Flagship is a 10 year research and innovation endeavour with a total project cost of 1,000,000,000 euros, funded jointly by the European Commission and member states and associated countries. The first part of the Flagship was a 30-month Collaborative Project, Coordination and Support Action (CP-CSA) under the 7th framework program (2013-2016), while this and the following parts are implemented as Core Projects under the Horizon 2020 framework. The mission of the Graphene Flagship is to take graphene and related layered materials from a state of raw potential to a point where they can revolutionise multiple industries. This will bring a new dimension to future technology a faster, thinner, stronger, flexible, and broadband revolution. Our program will put Europe firmly at the heart of the process, with a manifold return on the EU investment, both in terms of technological innovation and economic growth. To realise this vision, we have brought together a larger European consortium with about 150 partners in 23 countries. The partners represent academia, research institutes and industries, which work closely together in 15 technical work packages and five supporting work packages covering the entire value chain from materials to components and systems. As time progresses, the centre of gravity of the Flagship moves towards applications, which is reflected in the increasing importance of the higher - system - levels of the value chain. In this first core project the main focus is on components and initial system level tasks. The first core project is divided into 4 divisions, which in turn comprise 3 to 5 work packages on related topics. A fifth, external division acts as a link to the parts of the Flagship that are funded by the member states and associated countries, or by other funding sources. This creates a collaborative framework for the entire Flagship.


A ceramic material for a thermoelectric element is described, wherein the ceramic material is based on the formula (Ca_(3-x)Na_(x))Co_(4)O_(9-), with 0.1 x 2.9 and 0 < 2. Furthermore, a thermoelectric element comprising the ceramic material, a thermoelectric generator comprising the thermoelectric element and a method for producing the ceramic material are described.


A method for producing a piezoelectric multilayer component is disclosed. Piezoelectric green films and electrode material are provided, arranged alternately on top of one another and sintered. The electrode material is provided with a PbO-containing coating and/or PbO is mixed into the electrode material.


A piezoelectric actuator of a multilayer design includes outer electrodes that are fastened by means of a bonding layer applied by thermal spraying. For example, the outer electrodes are formed as a woven wire fabric. Furthermore, a method for fastening an outer electrode in a piezoelectric actuator is specified.


The present invention concerns a line filter (1), which is configured to be installed onto a system cable (2), wherein the line filter (1) comprises a magnetic component (4), wherein the line filter (1) defines a cable path (6) through the line filter (1), wherein the line filter (1) is configured to allow a placement of the system cable (2) along the cable path (6) at the time of an installation, thereby providing a magnetic coupling of the system cable (2) to the magnetic component (4), and wherein the line filter (1) comprises an insulation displacement connector (16) and a shunt component (5) wherein the insulation displacement connector (16) is configured to be tightened at the time of the installation, thereby providing a galvanic connection of the system cable (2) to the shunt component (5). Further, the present invention concerns a method of installing a line filter (1) onto a system cable (2).


An inductive component and a method for producing an inductive component are disclosed. In an embodiment, the inductive component includes a first core part having wound first and second wires and a second core part arranged on the first core part. In various embodiments the inductive component has a low mode conversion, a low inductance in differential-mode operation, a high inductance for common-mode signals, a constant characteristic impedance, a low capacitive coupling of the wires, and/or a low leakage inductance.


A ceramic material for capacitors using multilayer technology of formula (I): Pb_((11.5a))A_(a)B_(b)(Zr_(1x)Ti_(x))_((1cdef))C_(e)Si_(c)0_(3)+y.PBO wherein A is selected from the group consisting of La, Nd, Y, Eu, Gd, Tb, Dy, Ho, Er and Yb; C is selected from the group consisting of Ni and Cu; and 0


Patent
Epcos AG | Date: 2016-04-26

The present invention relates to a microphone arrangement (M) which has a charge pump (LP), which produces a DC voltage, a transducer (WA), which converts acoustic signals into electrical signals and which is connected to the charge pump (LP), and a control unit (VCLFS), which controls the charge pump (LP) and which adjusts the DC voltage produced by the charge pump (LP).

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