München, Germany
München, Germany
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A method for producing a piezoelectric component is disclosed. In an embodiment, the method includes producing a ceramic precursor material of the general formula Pb_(1-x-y-(2a-b)/2)V_((2a-b)/2)Ba_(x)Sr_(y)[(Ti_(z)Zr_(1-z))_(1-a-b)W_(a)RE_(b)]O_(3), where RE is a rare earth metal and V is a Pb vacancy, mixing the ceramic precursor material with a sintering aid, forming a stack which includes alternating layers including the ceramic precursor material and a layer including Cu and debindering and sintering the stack thereby forming the piezoelectric component having Cu electrodes and at least one piezoelectric ceramic layer including Pb_(1-x-y-[(2a-b)/2]-p/2)V_([(2a-b)/2-p/2])Cu_(p)Ba_(x)Sr_(y)[(Ti_(z)Zr_(1-z))_(1-a-b)W_(a)RE_(b)]O_(3), where 0x0.035, 0y0.025, 0.42z0.5, 0.0045a0.009, 0.009b0.011, and 2a>b, p2ab.

Epcos AG | Date: 2016-12-28

The invention relates to an NTC component, comprising a first electrode (1) and a second electrode (2). The NTC component also comprises an NTC part (3), which is arranged between the first electrode (1) and the second electrode (2), wherein the NTC part (3) comprises a ceramic having the general composition AB2O4 and wherein A and B each comprise one or more of the materials Mn, Ni, Co, and Cu and B additionally comprises one or more of the materials Fe, Y, Pr, Al, In, Ga, and Sb.

The present disclosure concerns a microphone assembly (1) comprising a MEMS dual backplate microphone (2) configured to provide a differential output signal, an ASIC (3) comprising a differential amplifier (9) configured to receive the differential output signal, and a control element (14) configured to adjust a setting of the MEMS dual backplate microphone (2) and/or of the ASIC (3). Further, the present disclosure concerns a method of manufacturing said microphone assembly.

Epcos AG | Date: 2017-03-15

A sensor component having a first sensor element and a second sensor element (SE1, SE2) for one sensor function each is proposed, in which a base element (BE), a wall element (WE) in the form of a frame and a cover (DE) together enclose a cavity (CV) of a housing. The first sensor element (SE1) is a MEMS sensor and is mounted inside the cavity on the base element of the housing. The second sensor element (SE2) is in the form of an ASIC with an active sensor surface (SA) and is mounted on or under the cover or is embedded in the cover. Electrical external contacts (AK) for the first and second sensor elements are provided on an external surface of the housing. The cavity has at least one opening (OE) or bushing (DF).

Disclosed is a sensor element (1) comprising a ceramic base (2), at least one electrode (4, 8) on the base (2), and at least one contact piece (26, 27) for electrically contacting the electrode (4, 8), the contact piece (26, 27) being attached to the electrode (4, 8) using a welding or bonding process. Also disclosed is a sensor array (24) comprising a substrate (25) for supporting the base (2).

An electronic device comprises- a first capacitor (C1) being coupled in series to a first one-way conductor (D1), that allows current flow in one direction, and the first one-way conductor (D1) and the first capacitor (C1) being coupled between a load node (LOAD) and a reference potential (0), and- a second capacitor (C2) being coupled in series to a second one-way conductor (D2), that allows current flow in the opposite direction, the second one-way conductor (D2) and the second capacitor (C2) being coupled between the load node (LOAD) and the reference potential (0), and- a third capacitor (C3) being coupled between the load node (LOAD) and the reference potential (0), and- a first switch (S1) bypassing the first one-way conductor (D1), and-a second switch (S2) bypassing the second one-way conductor (D2).

Epcos AG | Date: 2017-01-04

Disclosed is a surge protection element (100) comprising a first electrode (1), a second electrode (2), and a gas discharge chamber (10). The gas discharge chamber (10) is located between the first electrode (1) and the second electrode (2). The surge protection element (100) also comprises an intermediate electrode structure (3) that is located in the gas discharge chamber (10) and is electrically insulated from the first and second electrodes (1, 2).

A microphone assembly (1) is provided, the assembly comprising a transducer (2) and an electronic circuit (3) operatively connected to the transducer (2). The electronic circuit (3) comprises a test mode circuitry (12) for selectively setting the microphone assembly (1) in one or more test modes or an operational mode. The test modes enable determining at least one parameter of the transducer (2). Furthermore, a method is provided, the method enabling determining at least one parameter of a transducer (2) in a microphone assembly (1).

Epcos AG | Date: 2017-01-11

A non-uniform stress distribution of a MEMS microphone having a non-circular shape is compensated by a structured back plate that has a compensating structure to provide a stress distribution opposite to that of the membrane.

Agency: European Commission | Branch: H2020 | Program: SGA-RIA | Phase: FETFLAGSHIP | Award Amount: 89.00M | Year: 2016

This project is the second in the series of EC-financed parts of the Graphene Flagship. The Graphene Flagship is a 10 year research and innovation endeavour with a total project cost of 1,000,000,000 euros, funded jointly by the European Commission and member states and associated countries. The first part of the Flagship was a 30-month Collaborative Project, Coordination and Support Action (CP-CSA) under the 7th framework program (2013-2016), while this and the following parts are implemented as Core Projects under the Horizon 2020 framework. The mission of the Graphene Flagship is to take graphene and related layered materials from a state of raw potential to a point where they can revolutionise multiple industries. This will bring a new dimension to future technology a faster, thinner, stronger, flexible, and broadband revolution. Our program will put Europe firmly at the heart of the process, with a manifold return on the EU investment, both in terms of technological innovation and economic growth. To realise this vision, we have brought together a larger European consortium with about 150 partners in 23 countries. The partners represent academia, research institutes and industries, which work closely together in 15 technical work packages and five supporting work packages covering the entire value chain from materials to components and systems. As time progresses, the centre of gravity of the Flagship moves towards applications, which is reflected in the increasing importance of the higher - system - levels of the value chain. In this first core project the main focus is on components and initial system level tasks. The first core project is divided into 4 divisions, which in turn comprise 3 to 5 work packages on related topics. A fifth, external division acts as a link to the parts of the Flagship that are funded by the member states and associated countries, or by other funding sources. This creates a collaborative framework for the entire Flagship.

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