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Sundaresan S.G.,Sundaresan Consulting Services LLC | Sundaresan S.G.,Emerson Climate Technologies GmbH
IOP Conference Series: Materials Science and Engineering | Year: 2015

Today, Low Global Warming Potential Refrigerants are being evaluated, optimized and applied. Higher pressure refrigerants, refrigerant blends, and new chemical families of refrigerants are candidates. Compressor designs and system components are being evaluated to deliver the desired capacity, efficiency and reliable performance for intended applications. Once the Refrigerant family is chosen based on Environmental and Heat transfer properties, System Chemistry between the Refrigerant and Lubricant families are scrutinized for optimum miscibility and solubility. These directly affect the Phase separation between the 2 liquid phases and reduction of viscosity. Over the entire Operating Envelope, the oil return and viscosity reduction problems are assessed. Compatibility aspects between chemicals (Refrigerants, Lubricants) and materials of construction (metallic, polymeric, elastomeric) are verified to avoid failures in use. System Components, compressor bearings, expansion devices and heat transfer coils are adversely affected due to contaminants circulating in systems. Rust, Copper plating, Formicary corrosion, elastomer swelling are example. Advances in Analytical Chemistry Techniques help the compressor and system manufacturers characterize the problems. Further, System Chemistry guides selection of lubricant additives. This presentation explains how lubricant selection is accomplished using Tribology and System Chemistry aspects.

Ouakad H.M.,King Fahd University of Petroleum and Minerals | Younis M.I.,Binghamton University State University of New York | Alsaleem F.,Emerson Climate Technologies GmbH
Journal of Micromechanics and Microengineering | Year: 2012

In this paper, we present a theoretical and experimental investigation into the dynamic response of an electrostatically actuated microbeam when subjected to drop-table test. For the theoretical part, a reduced-order model based on an Euler-Bernoulli beam model is utilized. The model accounts for the electrostatic bias on the microbeam and the shock pulse of the drop-table test. Simulation results are presented showing the combined effect of electrostatic force and mechanical shock in triggering early pull-in instability of the cantilever microbeams. The analytical simulation results are validated by finite-element results for the static response. Dynamic pull-in threshold as a function of the mechanical shock amplitude is shown over a wide range of shock spanning hundreds of thousands of g up to zero g. For the experimental part, a micromachined cantilever beam made of gold of length 50 μm is subjected to drop-table tests while being biased by electrostatic loads. Several experimental data are shown demonstrating the phenomenon of collapse due to the combined shock and electrostatic forces. It is also demonstrated that by biasing short and too stiff microbeams with electrostatic voltages, their stiffness is weakened. This lowers their threshold of collapse considerably to the range of acceleration that enables testing them with in-house shock testing equipments, such as drop-table tests. © 2012 IOP Publishing Ltd.

Emerson Climate Technologies GmbH | Date: 2013-07-18

The present disclosure provides an improved welding process for joining two components of which at least one comprises a brass alloy. In one exemplary embodiment, an intermediate part that includes a metal material different from a brass alloy may be arranged between the components such that it is in contact with the components in marginal regions. The intermediate part may then be heated during the welding process such that it enters into a connection having material continuity with the components in the marginal regions.

Emerson Climate Technologies GmbH | Date: 2013-01-23

The invention relates to an apparatus for determining the moisture content of a fluid flowing through a pipe line, having a housing with a sight glass arranged at a first side of the housing, a housing opening which allows an entry of the fluid into an inner housing space and a moisture indicator which is visible through the sight glass, wherein a dimension of the housing opening in at least one direction is smaller than a dimension of the sight glass in the same direction.

News Article | October 30, 2014
Site: tech.co

GlobalHack, a hackathon coming to us from St. Louis, has made the decision to sustain the momentum generated by their first two successful events. They just announced the details for their much anticipated third event, GlobalHack III. The nonprofit organization fosters talent and innovation via coding competitions, and this time around they’re partnering with Emerson to host the hackathon. As it stands, the dates for GlobalHack III are December 5 through December 7, and given recent events, the hackathon will be hosted in Ferguson. “As members of the St. Louis community, we don’t want St. Louis and Ferguson to heal artificially. We want St. Louis to develop substantive and constructive efforts that foster collaboration amongst people of diverse backgrounds,” says Gabe Lozano, co-founder of GlobalHack. “We are thrilled about hosting GlobalHack III in Ferguson and partnering with Ferguson-based Emerson. Bringing together a diverse group of people to build great software is a micro example of what is possible as the St. Louis community searches for opportunities to achieve forward progress.” The event will bring together developers, designers, and entrepreneurs to compete for a $50,000 cash prize over an intense, 48 hour time frame. The computer programming event will challenge participants to solve technology-related problems for companies aiming to expand their St. Louis footprint. All teams will be assigned an identical project, the full details of which will only be released one hour before the start of the event. The project scope will be defined in collaboration with Emerson’s Climate Technologies’ Residential Retail Business Unit. Participants will then be asked to design, develop, and implement a new software feature for an existing Emerson product in the connected home market. Participating teams should have a baseline understanding of mobile application development – iOS and/or Android – and big data analytics; an understanding of electrical and mechanical engineering is a plus, but not required. “As an innovative and global company, we are excited to be sponsoring GlobalHack III in Ferguson. We first became involved with GlobalHack as a sponsor during GlobalHack II, and are anxious to see the same diversity, talent, and energy in GlobalHack III,” says Craig Johnson, President Residential Retail at Emerson Climate Technologies. Registration is currently open, so grab your spot while you still can!

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