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Agency: Cordis | Branch: FP7 | Program: CP | Phase: ICT-2007.3.1 | Award Amount: 4.69M | Year: 2008

The CopPeR project will provide a novel copper deposition process based on the useof non-aqueous solvents to overcome the limitations of currently employedinterconnect formation processes enabling device scaling beyond the 32 nmtechnology node. This non-aqueous process will open novel routes to implementdirect on barrier plating, focussing on tantalum and ruthenium as diffusion barriers.As another main advantage the process developed and implemented within theCopPeR project will significantly improve the quality of the Cu metallization due to thefact that more space is available in trenches for high quality, low resistivity Cu, due tothe fact that the resistivity limiting seed-Cu will be eliminated and thinner barrier filmscan be applied, e.g. by ALD (atomic layer deposition).CopPeR will achieve the final goal through collaborations within a very strongconsortium based on a team with outstanding scientific, engineering andmanufacturing qualifications. In a first phase, electrolyte ingredients will be selectedand experimentally verified, a deposition cell designed through modelling andsimulation as well as new analytical techniques evaluated to enable adequateanalysis of the deposited films. The second phase will focus on the development ofthe copper deposition process based on the findings from phase one with theadditional support of micro-modelling and the process scaled and integrated into a300mm proof-of-concept. In the third and final phase, the process will be integratedinto a complete interconnect scheme, and optimized according to the industrial chipmanufacturers needs.

Agency: Cordis | Branch: FP7 | Program: BSG-SME | Phase: SME-1 | Award Amount: 1.60M | Year: 2010

Current ECM process technology is limited in machining accuracy and process stability. The primary reason for this limitation is that the power supply units, which are at the heart of ECM are traditionally designed for the millisecond pulsed current range. Developing a power supply unit that has the capability of pulsing in the microsecond / nanosecond range, will result in more control of the process and better product, leading to improved uptimes on the shop floor and improved product quality. The SME partners in this project consortium have identified a commercial opportunity for a new generation of ECM that can offer: - Improved process stability and control - Increased accuracy (at a micron level) - Better process uptime and increased efficiency / outputs - Consistently better performing and better quality products - Shorter product development lead time This project will undertake the research and development work necessary to ensure that the SMEs in the consortium can realise this commercial opportunity through the development of a power supply unit (SMPS) that can support the next generation of ECM. The project aims to develop an SMPS that will deliver quicker electrical current pulsing rates in the microsecond / nanosecond range, resulting in an ECM with a machining accuracy better than 1 micron. The project will also develop a demonstrator / prototype that will be used for validating and demonstrating the next generation ECM. Based on research undertaken by CDAMC (in conjunction with SMPS manufacturers and suppliers), it is clear that power units in this performance range are currently not commercially available. The availability of a new generation of SMPS could result in a major step change in ECM capability and help sustain Europes leading position in ECM technology.

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