Fujisawa, Japan
Fujisawa, Japan

Ebara Corporation is a publicly traded company based in Tokyo, Japan which makes environmental and industrial machinery such as pumps and turbines. It is the owner of the Elliott Company in the United States and Sumoto S.r.l. in Italy. This company does not make food products such as barbecue sauce and teriyaki sauce- those products are made by a different company of the same name.Ebara is divided into three main divisions:Fluid Machinery & Systems Company, which produces:Pumps: standard and engineered pumps and pumping system engineeringTurbines: Gas and steam turbines of various sizes, including micro gas turbinesTurbo-compressors, blowers, and fansChillersEnvironmental Engineering Company, which produces:Water treatment and sewage and industrial wastewater systemsSolid waste processing/utilization systemsGas treatment systemsEnvironmental remediation servicesPlant operation & maintenance servicesPrecision Machinery Company which produces:CMP, Plating, and Cleaning systemsDry vacuum and turbo-molecular pumpsGas scrubber systemsOzonized water generatorsChemical filters↑ 1.0 1.1 1.2 1.3 1.4 ↑ ↑ ↑ Wikipedia.


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Patent
Ebara Corporation | Date: 2016-08-26

A polishing apparatus includes a polishing table for supporting a polishing pad and a substrate holding device for pressing a substrate against the polishing pad. The substrate holding device includes an elastic film to form multiple pressure chambers to press the substrate, and a pressure control unit controlling pressure of the pressure chambers. The pressure control unit includes a first flow path connected to a first pressure chamber, and first and second pressure regulation mechanisms. The pressure control unit performs switching control from first pressure regulation mechanism to second pressure regulation mechanism when a set pressure within first pressure chamber reaches a first threshold value. Then, the pressure control unit performs switching control from second pressure regulation mechanism to first pressure regulation mechanism when the set pressure within the first pressure chamber reaches a second threshold value lower than the first threshold value.


Patent
Ebara Corporation | Date: 2016-08-31

An eddy current sensor 1-50 arranged in the vicinity of a substrate includes a core part 1-60 and a coil part 1-61. The core part 1-60 includes a common part 1-65, and four cantilever parts 1-66 to 69 connected to the common part 1-65. Ends of a first cantilever part 1-66 and a second cantilever part 1-67 are close and adjacent to each other. Ends of a third cantilever part 1-69 and a fourth cantilever part 1-68 are close and adjacent to each other. At the common part 1-65, an excitation coil is arranged. A first detection coil 1-631 is arranged at the first cantilever part 1-66 and a second detection coil 1-632 is arranged at the second cantilever part 1-67. A first dummy coil 1-642 is arranged at the third cantilever part 1-69, and a second dummy coil 1-641 is arranged at the fourth cantilever part 1-68.


Patent
Ebara Corporation | Date: 2016-10-28

The present invention provides a cleaning brush and a cleaning apparatus that can effectively discharge dust, removed from a dresser disk of a CMP apparatus upon cleaning the dresser disk, to the outside of the cleaning system in order to prevent the dust from being again deposited on the dresser disk. A cleaning brush includes a large number of brushes formed to protrude on its top surface, vertical through-holes and into which a nozzle for ejecting a cleaning fluid is inserted, and a recessed groove formed on a lower surface that lower ends of the through-holes and face. It is configured such that dust deposited onto the brushes upon cleaning the dresser disk is discharged to outside from the recessed groove through a gap between the surrounding of the nozzle and the inner surface of the through-holes and together with the cleaning fluid.


A method includes: vacuuming at least one area among a plurality of areas formed concentrically between a top face of the elastic film and the top ring body under a state where a bottom face of the substrate is supported by a support member and a top face of the substrate contacts a bottom face of the elastic film; measuring a flow volume of gas in an area located outside one or more areas to be vacuumed; determining whether the substrate is adsorbed to the top ring based on the flow volume of the gas; and after it is determined that the substrate is adsorbed to the top ring, separating the elastic film to which the substrate is adsorbed from the support member.


Patent
Ebara Corporation | Date: 2016-11-02

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.


Patent
Ebara Corporation | Date: 2016-08-26

Disclosed is a reversing machine that reverses a substrate upside down. The reversing machine includes: a first arm pair configured to mount a substrate thereon; a second arm pair facing the first arm pair; an opening/closing mechanism configured to open/close the second arm pair so as to grip the substrate mounted on the first arm pair; and a rotating mechanism configured to rotate the first arm pair and the second arm pair around a predetermined axis that is set inside the first arm pair and the second arm pair and extends along an extension direction of the first arm pair and the second arm pair such that the substrate is reversed upside down.


Patent
Ebara Corporation | Date: 2016-08-26

In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.


A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.


Patent
Ebara Corporation | Date: 2017-02-08

The present invention relates to a driving apparatus for driving an electric motor, such as a synchronous motor or an induction motor, and more particularly to a driving apparatus which performs a vector control based on an output current of an inverter. The driving apparatus of the present invention includes an inverter (10), a current detector (12) configured to detect an output current of the inverter (10), and a vector controller (11) configured to transform the output current, detected by the current detector (12), into a torque current and a magnetization current and to control the torque current and the magnetization current. The vector controller (11) includes a target-output-voltage determination section (27) configured to determine a target output voltage from the torque current, the magnetization current, an angular velocity of the rotor, and motor constants, and a target-magnetization-current determination section (26) configured to determine a magnetization-current command value based on a deviation between the torque-voltage command value and the target output voltage.


Patent
Ebara Corporation | Date: 2016-06-01

A polishing apparatus capable of measuring a film thickness of a wafer using a plurality of optical sensors, without using an optical-path switching device for optical fibers, is disclosed. The polishing apparatus includes: an illuminating fiber having a plurality of distal ends arranged at different locations in a polishing table; a spectrometer configured to break up reflected light from a wafer in accordance with wavelength and measure an intensity of the reflected light at each of wavelengths; a light-receiving fiber having a plurality of distal ends arranged at the different locations in the polishing table; and a processor configured to generate a spectral waveform indicating a relationship between the intensity and wavelength of the reflected light and determine a film thickness based on the spectral waveform.

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