Fujisawa, Japan
Fujisawa, Japan

Ebara Corporation is a publicly traded company based in Tokyo, Japan which makes environmental and industrial machinery such as pumps and turbines. It is the owner of the Elliott Company in the United States and Sumoto S.r.l. in Italy. This company does not make food products such as barbecue sauce and teriyaki sauce- those products are made by a different company of the same name.Ebara is divided into three main divisions:Fluid Machinery & Systems Company, which produces:Pumps: standard and engineered pumps and pumping system engineeringTurbines: Gas and steam turbines of various sizes, including micro gas turbinesTurbo-compressors, blowers, and fansChillersEnvironmental Engineering Company, which produces:Water treatment and sewage and industrial wastewater systemsSolid waste processing/utilization systemsGas treatment systemsEnvironmental remediation servicesPlant operation & maintenance servicesPrecision Machinery Company which produces:CMP, Plating, and Cleaning systemsDry vacuum and turbo-molecular pumpsGas scrubber systemsOzonized water generatorsChemical filters↑ 1.0 1.1 1.2 1.3 1.4 ↑ ↑ ↑ Wikipedia.

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Patent
Ebara Corporation | Date: 2017-01-11

A cleaning apparatus includes: a cleaning chamber configured to clean a substrate; a transfer chamber positioned adjacent to the cleaning chamber and configured to transfer the substrate; a partition wall partitioning the cleaning chamber and the transfer chamber; a gutter fixed to the partition wall; and a discharge pipe connected to a bottom portion of the gutter. A first pass hole and a second pass hole positioned below the first pass hole are formed in the partition wall. The gutter is positioned between the first pass hole and the second pass hole, and extends from one side end to the other side end of the partition wall.


A cleaning device, according to one embodiment, for cleaning a substrate by being rotated, includes: a cleaning member configured to clean a substrate; and a sleeve configured to be provided along a circumference of the cleaning member, a lower part of the sleeve being divided into a plurality of chucking claws each of which holds a portion of a side face of the cleaning member, wherein at inside of each of the plurality of chucking claws, a plurality of protrusions are provided substantially parallel to a rotation direction of the cleaning member, an end of each of the plurality of protrusions is configured to contact the side face of the cleaning member.


A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.


Patent
Ebara Corporation | Date: 2017-02-08

The present invention relates to a driving apparatus for driving an electric motor, such as a synchronous motor or an induction motor, and more particularly to a driving apparatus which performs a vector control based on an output current of an inverter. The driving apparatus of the present invention includes an inverter (10), a current detector (12) configured to detect an output current of the inverter (10), and a vector controller (11) configured to transform the output current, detected by the current detector (12), into a torque current and a magnetization current and to control the torque current and the magnetization current. The vector controller (11) includes a target-output-voltage determination section (27) configured to determine a target output voltage from the torque current, the magnetization current, an angular velocity of the rotor, and motor constants, and a target-magnetization-current determination section (26) configured to determine a magnetization-current command value based on a deviation between the torque-voltage command value and the target output voltage.


Patent
Ebara Corporation | Date: 2017-07-12

Cleaning apparatus (1) provided with a heating unit (5) that heats a cleaning surface of a substrate (W), a cleaning unit (6) that supplies ozone water to the cleaning surface of the substrate (W) and cleans the cleaning surface and a control unit (7) that controls the heating of the cleaning surface and the supply of the cleaning liquid so as to clean the cleaning surface after heating the cleaning surface of the substrate (W).


An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion, The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.


Patent
Ebara Corporation | Date: 2017-02-16

A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.


Patent
Ebara Corporation | Date: 2017-02-20

Provided is a canned motor to be coupled to a vacuum pump and used as a rotary driving source for the vacuum pump. The canned motor includes: a stator core; a rotor provided on an inner side of the stator core; and a non-conductive can provided between the stator core and the rotor. The non-conductive can is configured to separate the stator core and the rotor from each other. The non-conductive can is made of resin, ceramic, or composite material thereof. The non-conductive can is bonded to the stator core with an adhesive.


Patent
Ebara Corporation | Date: 2017-02-20

A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.


Patent
Ebara Corporation | Date: 2017-03-06

A plating apparatus is described. The apparatus includes: a substrate holder configured to hold a substrate in a vertical position; at least one processing bath configured to process the substrate held by the substrate holder; a transporter configured to grip and horizontally transport the substrate holder; at least one lifter configured to receive the substrate holder from the transporter, lower the substrate holder to place the substrate holder in the processing bath, elevate the substrate holder from the processing bath after processing of the substrate, and transfer the substrate holder to the transporter; and a controller configured to control operations of the transporter and the lifter.

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