Los Altos, CA, United States
Los Altos, CA, United States

DSP Group, Inc. is a provider of chipsets for VoIP, multimedia, and digital cordless applications. Founded in 1987 with headquarters in San Jose, California, DSP Group employs over 400 people at three US sites and offices in Germany, Scotland, Israel, India, Hong Kong and Japan. Wikipedia.

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Patent
DSP Group | Date: 2016-12-05

A method for sonic acoustic beacon processing. The method may include constantly operating a microphone and a chip, even when an application processor is asleep; receiving by the microphone, while the application processor is asleep, an acoustic beacon; converting by the acoustic beacon to electrical signals representative of the acoustic beacon; receiving by the chip the electrical signals representative of the acoustic beacon; searching, by the chip and in the electrical signals representative of the acoustic beacon for a predefined preamble; when detecting the predefined preamble then decoding, by the chip, electrical signals representative of a rest of the acoustic beacon to provide digital data, and determining by the chip whether to awake the application processor; when determining to awake the application processor then participating, by the chip, in an awakening of the application processor; and sending, by the chip, the digital data to the application processor, after the awakening of the application processor.


A method for charge-reuse, the method may include performing multiple repetitions of the steps of: operating a second capacitive load while the second capacitive load is disconnected from a first capacitive load; wherein the second capacitive load is a Microelectromechanical systems (MEMS) capacitive load or a Nanoelectromechanical systems (NEMS) capacitive load; electrically coupling a first capacitive load to a second capacitive load via a path that comprises an inductor; charging the first capacitive load with a second charge provided from the second capacitive load; electrically disconnecting the first capacitive load, the second capacitive load and the inductor from each other; feeding the inductor with a supply current provided by a supply circuit; disconnecting the inductor from the supply circuit and coupling the inductor to the first capacitive load; charging the first capacitive load by the inductor; electrically coupling the first capacitive load to the second capacitive load via the path that comprises the inductor; charging the second capacitive load with a first charge provided from the first capacitive load; and operating the second capacitive load while the second capacitive load is disconnected from the first capacitive load.


An integrated circuit that includes a die with an active radio frequency (RF) unit embedded thereon; a first port for receiving an output signal from the active RF unit; a harmonic filter that comprises a first harmonic filter inductor; and a first RF inductive load that is electrically coupled to the first port and is magnetically coupled to the first harmonic filter inductor.


An integrated circuit that includes a die with an active radio frequency (RF) unit embedded thereon; a first port for receiving an output signal from the active RF unit; a harmonic filter that comprises a first harmonic filter inductor; and a first RF inductive load that is electrically coupled to the first port and is magnetically coupled to the first harmonic filter inductor.


A MEMS speaker that includes a control unit and multiple MEMS elements that include a membrane positioned in a first plane, a blind that is positioned in a second plane and a shutter that is positioned in a third plane. The control unit is configured to control the multiple MEMS elements to operate in an audio output mode or an ultrasonic output mode. The MEMS speaker is configured, when operating in the ultrasonic output mode, to oscillate at least one of the membrane, blind and shutter thereby generating an ultrasonic signal without audio-modulating the ultrasonic signal. The MEMS speaker is configured, when operating in the audio output mode, to oscillate the membrane thereby generating the ultrasonic signal and oscillate at least one of the shutter and the blind thereby modulating the ultrasonic acoustic signal to generate an audio signal.


A biasing device for direct current (DC) biasing a linear power amplifier that comprises multiple linear power amplifier circuits that are ideally identical to each other; wherein the biasing device may include a replica circuit that is a replica of a linear power amplifier circuit of the multiple linear power amplifier circuits; and a bias control circuit; wherein the bias control circuit is configured to feed the replica circuit with one or more DC biasing signals thereby maintaining at a constant value a replica DC current that is consumed by the replica circuit, and maintaining at a fixed value a replica DC voltage of a replica output node of the replica circuit; and wherein the replica circuit is coupled the multiple linear power amplifier circuits and is configured to supply DC voltage bias signals that force each linear power amplifier circuit of the multiple linear power amplifier circuits to consume a linear power amplifier circuit DC current that equals the replica DC current, when the linear power amplifier circuit is fed with a linear power amplifier DC voltage that either equals the replica DC voltage or differs from the replica DC voltage by a fraction of the replica DC voltage.


A novel and useful linear, efficient, smart wideband CMOS hybrid power amplifier that combined an analog linear amplification path and a digital power amplification (DPA) path. PA path control logic analyzes the input I and Q signals and determines which amplification paths to steer the input I and Q signals to. The analog linear amplification path comprises digital to analog converters for both I and Q paths and one or more analog linear power amplifiers. The digital power amplification path comprises I and Q up-sampling circuits and I and Q RF DAC circuits (e.g., digital PA circuits). In operation, the PA path control logic compares the I and Q signals to thresholds (which may or may not be different) and based on the comparisons, selects one or more paths for the input I and Q signals. Whether the signals from the analog and digital amplification paths are to be combined or selected (i.e. switched), the PA path control circuit is operative to generate select (switch) control signals which are applied to summer/selector elements which generate the output of the hybrid PA.


Patent
DSP Group | Date: 2016-06-02

A method for detecting whispered speech of a user of a mobile computerized device, the method comprises: detecting, by the mobile computerized device, whispered speech context; and attempting to detect, by the mobile computerized device and by using whispered speech detection parameters, the whispered speech; and wherein at least one whispered speech detection parameter of the whispered speech detection parameters differs from at least one corresponding non-whispered speech parameter that is used for detecting non-whispered speech.


Patent
DSP Group | Date: 2016-06-23

A two-port air pump speaker that includes at least two active, phase-modulated, bi-directional shutters and an ultrasonic pumping chamber having at least two ports; a first port facing towards the listener, the forward port, and a second port facing another direction, the backward port which may be behind an acoustic baffle or inside a speaker enclosure. A two-port speaker with two active steering shutters can create continuous bi-directional airflow which leads to low distortion reproduction of low audio frequencies. The same improved design can be used also for other applications where acoustic modulation is required, especially in ultrasonic frequencies.


Patent
DSP Group | Date: 2016-03-21

A MEMS speaker that may include a membrane positioned in a first plane, wherein the membrane may be configured to oscillate at a first frequency thereby generating an ultrasonic acoustic signal; and an acoustic modulator that may include a blind and a shutter; wherein the blind may be positioned in a second plane; wherein the shutter may be positioned in a third plane; wherein the first plane, the second plane and the third plane may be substantially separated from each other; and wherein the acoustic modulator may be configured to (a) receive or generate a shutter control signal and a blind control signal, and (b) modulate, in response to the shutter control signal and the blind control signal, the ultrasonic acoustic signal such that an audio signal may be generated.

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