News Article | February 16, 2017
DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, has announced that its 2017 Design for Reliability Conference will be held on March 20, 2017 at the Sheraton Inner Harbor in historic Baltimore, Maryland. Pioneers from Automotive, Aerospace, and Solid State Drive industries will join DfR Solutions’ design and reliability experts to explore the latest challenges facing electronics manufacturing and the implementation of Physics of Failure techniques into electronics products and systems. As the demand for smaller, faster, and more functional electronics continues to rise, so does the challenge of reliability. Whether designing electronics technology for aerospace, automotive, battery, data storage, defense, semiconductor, or other industries, effective Physics of Failure (PoF) techniques can help predict and prevent problems that lead to critical product failures. Physics of Failure or Reliability Physics is a science-based approach that leverages the knowledge and understanding of the processes and mechanisms that induce failure to predict reliability and improve product performance. DfR Solutions is a leader in the use of Physics of Failure based software and services to maximize and accelerate reliable product design and development while saving time, managing resources and improving customer satisfaction. Industry thought leaders speaking at the 2017 Design for Reliability Conference include Automotive expert Meg Novacek, previously with Fiat Chrysler Automotive, who will examine the Top 3 Reliability Challenges Facing Autonomous Vehicles; reliability expert Vincent Doan of WD/HGST who will discuss Implementing Physics of Failure (PoF) at Box-Level; and Lloyd Condra, who recently joined DfR Solutions after retiring from Boeing as a Technical Fellow, will cover Reliable Implementation of COTS Parts and Assemblies into Aerospace Systems. At this full day technical conference, DfR Solutions' CEO, Dr. Craig Hillman, will discuss the future of electronics reliability and design. Dr. Vidyu Challa will explore how and why batteries fail, Dr. Nathan Blattau and Dr. Maxim Serebreni will discuss solder joint reliability, and Ed Dodd and Mike Howard will provide insight into using Physics of Failure in complex systems. The day will wrap up with renowned electronics manufacturing and packaging expert Greg Caswell as he shares all that he has learned in his 45 years in the electronics industry. “As electronics proliferate product design across just about every industry, how can we guarantee that these products will perform as needed, and safely?” asked Dr. Craig Hillman, CEO and Managing Partner at DfR Solutions. “At DfR Solutions, we employ Physics of Failure tools and techniques to do just that. At our conference in March, we will be discussing this critical topic with other industry leaders with the ultimate goal of producing safer, more reliable products in every industry.” For the full agenda and to register for the conference, visit http://www.dfrconference.eventbrite.com. About DfR Solutions, LLC: DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry. The company’s integrated use of Physics of Failure (PoF) and Best Practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. DfR Solutions specializes in providing knowledge- and science-based solutions to maximize and accelerate the product integrity assurance activities of their clients in every marketplace for electronic technologies (consumer, industrial, automotive, medical, military, telecom, oil drilling, and throughout the electronic component and material supply chain). For more information regarding DfR Solutions, visit http://www.dfrsolutions.com.
Hillman C.,DfR Solutions
IEEE Consumer Electronics Magazine | Year: 2014
Leave no technology behind-this slight twist on the mantra of the U.S. Armed Forces is a rusting signpost on the highway of consumer electronic innovation. From the DOS prompt to the RS-232 connector, from CTRL-ALT-DEL to the CD drive, there are an amazing number of technologies that are not left behind, even within an industry obsessed with the next big thing. Though, with the persuasive announcement that Moore's law is dead and buried (see Zvi Or-Bach's recent blog in Solid State Technology ), the perpetual risk of obsolescence may be reaching its swan song. A very quick side thought: it is thought-provoking to speculate on how the electronics industry will eventually take the form of the automotive industry, a market based on relatively stagnant technology. Because it will. © 2014 IEEE.
Caswell G.,DfR Solutions
IEEE Aerospace Conference Proceedings | Year: 2014
Today's analyses of electronics reliability at the system level typically use a 'black box approach', with relatively poor understanding of the behaviors and performances of such 'black boxes' and how they physically and electrically interact. Box level analyses tend to use simplistic empirical predictive models, and the effort is typically driven by cost and time constraints. The incorporation of more rigorous and more informative approaches and techniques needs to better understand and to take advantage of the advances in user interfaces and intelligent data capture, which will allow for a broader range of users and for similar resource allocation. Understanding the Physics of Failure (PoF) is imperative. It is a formalized and structured approach to Failure Analysis/Forensics Engineering that focuses on total learning and not only fixing a particular current problem. It can involve material science, physics and chemistry; also variation theory and probabilistic mechanics. The approach necessitates an up-front understanding of failure mechanisms and variation effects. In this paper we will present an explanation of various physical models that could be deployed through this method, namely, wire bond failures; thermo-mechanical fatigue; and vibration. We will provide insight into how this approach is being accepted by system assemblers, as it allows for failure oriented accelerated testing, for substitution or 'what if' analyses in lieu of the traditional accelerated life testing. This paper will also provide insight into a process to develop viable test plans and a tool that facilitates the entire process so that minimal testing is performed, thus reducing costs and schedule impacts. Examples of this approach will be presented. © 2014 IEEE.
Brown D.,DfR Solutions
2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016 | Year: 2016
In the 2000s, red phosphorous flame retardants were at the root of widespread and costly failures in electronics products. The most prominent of these failures were in plastic encapsulated microcircuits. These failures were widely reported and painfully experienced. As a result, users of electronic components and finished products came to expect that technical diligence, marketplace forces, and the threat of lawsuits were sufficient to prevent a recurrence. It is therefore surprising that in what appears to be only a few short years after IDMs and OSATs discontinued using red phosphorus flame retardants in semiconductor manufacturing, manufacturers of other types of components began using them. Two or three years after line cord and connector manufacturers went into production with red phosphorus flame retardants, they too started to get field returns. © 2016 SMTA.
Agency: Department of Defense | Branch: Navy | Program: SBIR | Phase: Phase II | Award Amount: 735.75K | Year: 2011
Knowledge of the potential failure mechanisms and their drivers provides a foundation to this proposal, which is designed to assess the impacts of the harsh environmental stresses on the various packaging technologies proposed. From this assessment, the DoD and their supply chain will have a clear understanding of how the transition to Pb-free electronic packaging may change the mean time between failure (MTBF) of the component, and have a clear delineation based on physical parameters when environmental conditions introduces too high of a risk of part failure.
Agency: Department of Defense | Branch: Navy | Program: SBIR | Phase: Phase II | Award Amount: 300.00K | Year: 2011
This Phase II SBIR is focused on expanding on the Phase I results regarding reballing Ball Grid Array (BGA) parts from tin-silver-copper (SAC305) solder to SnPb eutectic solder. Other solder alloys, printed wiring board surface finishes, the die-package impact, solder ball pitch, different size BGAs (ball count), and test methodologies will be examined to fully characterize this process. For the military, this is an excellent interim approach prior to wholesale adoption of Pb-free parts and processes. It is important to understand the reliability risks associated with the reballing procedure, particularly as it relates to thermal cycling, shock and vibration environments.
Agency: Department of Defense | Branch: Air Force | Program: SBIR | Phase: Phase I | Award Amount: 149.98K | Year: 2014
ABSTRACT: Minimally operating or non-operating systems provide little or no opportunity for measuring functional parameters as they degrade, reducing visibility into the condition of system reliability. The negative effects of this phenomenon are seen to a greater degree in systems that are required to operate once with near-perfect reliability following a period of prolonged dormancy. Cruise missiles that require minimum maintenance and inspection throughout their lifetimes do not have a methodology to properly predict the reliability of the subsystems . Nuclear cruise missiles may be stored on a pylon in uncontrolled environments for six years between major maintenance actions, with minimal testing performed every two years. Phase I of this effort is focused on defining the current state and evaluating the methodologies necessary to obtain a predictive model for the entire missile as the sum of its LRUs. Phase II will involve integrating these models into the Sherlock architecture to provide both LRU level and an aggregated missile level reliability prediction. BENEFIT: A tool that provides a prediction model of LRU level reliability for aging weapon systems that can be used to establish maintenance and replacement schedules and provide targeted preventative and life extending repair during depot level maintenance periods. Supplier participation will improve the accuracy of the predictions by bringing a greater level of fidelity to the design files being analyzed while allowing for more effective design decisions throughout their design development process. Ultimately, as part of the Model Based Engineering initiative, the DoD is expected to establish a neutral exchange or repository, where design data can be used as inputs to reliability models without compromising the integrity of the intellectual property. Tools based on the technology developed during this project will allow the Air Force to leverage this data to drastically improve the average total cost of ownership through more informed maintenance actions. Also, as the availability of quantified Physics of Failure based reliability analyses increases, they are expected to become a greater factor in the government procurement process.
Agency: Department of Defense | Branch: Air Force | Program: SBIR | Phase: Phase II | Award Amount: 749.55K | Year: 2015
ABSTRACT:This effort focuses on developing a method to aggregate physics based reliability predictions in dormant missile systems. The approach to aggregating these predictions can be similarly applied to non-dormant systems. DfR Solutions will explore dormant failure mechanism models and produce a tool that allows system aggregation of LRU level analysis results. Reliability models for aging solder joint survivability and thermal battery humidity degradation will be developed and combined with existing physics based reliability models in a tool to provide LRU reliability predictions. A systems level tool will then be developed to aggregate LRU reliability predictions at the system level.BENEFIT:Using the resulting tools, dormant system maintenance can be scheduled based on improved information. Commercial systems developers will be able to integrate reliability analysis into their existing model based engineering practices. LRU suppliers will be able to provide customers insight into the expected reliability performance of their products, and contribute in a collaborative way without exposing the intellectual property associated with their design.
Agency: Department of Defense | Branch: Missile Defense Agency | Program: SBIR | Phase: Phase I | Award Amount: 99.94K | Year: 2016
DfR Solutions and the Rochester Institute of Technology (RIT) have formed a team of experts in solder joint reliability and gold embrittlement to perform a series of experiments that will provide the data necessary to create mechanistic reliability models. Critical to any application of these models and of interpreting experimental results is the ability to determine solder joint gold contamination percent by weight. Phase I will explore non-destructive methods for plating measurement and gold content calculation, and perform destructive analysis to verify the optimal method for determining gold content in solder joints of physical samples. The gold content prediction methodology derived during Phase I will provide the basis for establishing an effective design of experiments to determine the long term reliability effects of various levels of gold contamination. In Phase II and beyond, DfR Solutions and RIT will perform the required testing and create mechanistic reliability models. Prior experience developing solder joint reliability models and a history of creating tools for industry to apply them reduces program risk and provides a clear path to commercial application. Approved for Public Release 16-MDA-8620 (1 April 16)
News Article | February 28, 2017
DfR Solutions, a leader in quality, reliability, and durability (QRD) solutions for the electronics industry, made major strides in further developing its team of experts with several new additions in 2016. Their vast experience and knowledge will allow DfR Solutions to provide enhanced capabilities and deeper insight into the advancement of technology reliability. Dr. Vidyu Challa, PhD, Technical Director — Dr. Challa has a diverse background in engineering technology and R&D that spans the semiconductor and battery industries, including failure analysis efforts to diagnose product and process defects. Dr. Rita Mohanty, PhD, Senior Member, Technical Staff — Dr. Mohanty joins the team with a career that spans R&D, technology management, product development, technical road mapping, IP management, segment market selling, global customer support, manufacturing and consultative services. Lloyd Condra, Senior Consultant — A pioneer in electronics manufacturing and leader in the aerospace, defense, high performance (ADHP) industry, and as a Technical Fellow at Boeing, Mr. Condra led efforts to use COTS parts and assemblies. Dr. Maxim Serebini, PhD, Research Engineer — Dr. Serebini’s background is in experimental mechanics and mechanical characterization of non-ferrous metallic alloys. His research attracted support from the electronics industry and he is currently working on consortium efforts to characterize fatigue performance of Pb-free components. Ashok Alagappan, Senior Member, Technical Staff — A semiconductor professional with 12 years engineering experience in product development, process integration and yield enhancement, Mr. Alagappan has expertise in data analysis, problem solving, project management, technology transfer, new product introductions, and circuit design and layout. Natalie Hernandez, PhD, Product Engineer — As an experimental physicist, Ms. Hernandez brings strong analytical, quantitative and technical skills with key competencies in solid state physics/materials science, data analysis and optical experimentation. Josh Akman, Technical Staff — A mechanical engineer with a reliability focus, Mr. Akman has several years of broad experience with various accelerated testing and failure analysis techniques. His previous research examined the thermomechanical effects on encapsulation on electronics. Tyler Ferris, Technical Staff — A former research fellow at the University of Pittsburgh, Mr. Ferris completed research projects to improve methodologies for various aspects of nuclear power plants, and contributed to the design, fabrication, and testing of medical surgical devices. Also, DfR Solutions has contracted with independent consultant Meg Novacek, a reliability expert with 28 years of automotive experience who offers engineering and quality process improvement advice to the industry, notably those affecting the autonomous vehicle sector. “The addition of so many notable experts from various industries and backgrounds is a major contribution to our company,” said Dr. Craig Hillman, CEO and Managing Partner at DfR Solutions. “These individuals’ knowledge, combined with their dedication to results-driven solutions, positions us to better serve our customers' needs and further the success of their products.” Hear the expertise and insight of DfR Solutions team members at the 2017 Annual Design for Reliability Conference: Implementing Physics of Failure in Electronic Products and Systems being held Monday, March 20 in Baltimore. Agenda and registration information is available at https://dfrconference.eventbrite.com. ABOUT DFR SOLUTIONS, LLC DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry. The company’s integrated use of Physics of Failure (PoF) and Best Practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. DfR Solutions specializes in providing knowledge- and science-based solutions to maximize and accelerate the product integrity assurance activities of their clients in every marketplace for electronic technologies (consumer, industrial, automotive, medical, military, telecom, oil drilling, and throughout the electronic component and material supply chain). For more information regarding DfR Solutions, visit http://www.dfrsolutions.com.