Hillman C.,DfR Solutions
IEEE Consumer Electronics Magazine | Year: 2014
Leave no technology behind-this slight twist on the mantra of the U.S. Armed Forces is a rusting signpost on the highway of consumer electronic innovation. From the DOS prompt to the RS-232 connector, from CTRL-ALT-DEL to the CD drive, there are an amazing number of technologies that are not left behind, even within an industry obsessed with the next big thing. Though, with the persuasive announcement that Moore's law is dead and buried (see Zvi Or-Bach's recent blog in Solid State Technology ), the perpetual risk of obsolescence may be reaching its swan song. A very quick side thought: it is thought-provoking to speculate on how the electronics industry will eventually take the form of the automotive industry, a market based on relatively stagnant technology. Because it will. © 2014 IEEE. Source
Brown D.,DfR Solutions
2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016 | Year: 2016
In the 2000s, red phosphorous flame retardants were at the root of widespread and costly failures in electronics products. The most prominent of these failures were in plastic encapsulated microcircuits. These failures were widely reported and painfully experienced. As a result, users of electronic components and finished products came to expect that technical diligence, marketplace forces, and the threat of lawsuits were sufficient to prevent a recurrence. It is therefore surprising that in what appears to be only a few short years after IDMs and OSATs discontinued using red phosphorus flame retardants in semiconductor manufacturing, manufacturers of other types of components began using them. Two or three years after line cord and connector manufacturers went into production with red phosphorus flame retardants, they too started to get field returns. © 2016 SMTA. Source
Agency: Department of Defense | Branch: Navy | Program: SBIR | Phase: Phase II | Award Amount: 735.75K | Year: 2011
Knowledge of the potential failure mechanisms and their drivers provides a foundation to this proposal, which is designed to assess the impacts of the harsh environmental stresses on the various packaging technologies proposed. From this assessment, the DoD and their supply chain will have a clear understanding of how the transition to Pb-free electronic packaging may change the mean time between failure (MTBF) of the component, and have a clear delineation based on physical parameters when environmental conditions introduces too high of a risk of part failure.
Agency: Department of Defense | Branch: Air Force | Program: SBIR | Phase: Phase I | Award Amount: 149.98K | Year: 2014
ABSTRACT: Minimally operating or non-operating systems provide little or no opportunity for measuring functional parameters as they degrade, reducing visibility into the condition of system reliability. The negative effects of this phenomenon are seen to a greater degree in systems that are required to operate once with near-perfect reliability following a period of prolonged dormancy. Cruise missiles that require minimum maintenance and inspection throughout their lifetimes do not have a methodology to properly predict the reliability of the subsystems . Nuclear cruise missiles may be stored on a pylon in uncontrolled environments for six years between major maintenance actions, with minimal testing performed every two years. Phase I of this effort is focused on defining the current state and evaluating the methodologies necessary to obtain a predictive model for the entire missile as the sum of its LRUs. Phase II will involve integrating these models into the Sherlock architecture to provide both LRU level and an aggregated missile level reliability prediction. BENEFIT: A tool that provides a prediction model of LRU level reliability for aging weapon systems that can be used to establish maintenance and replacement schedules and provide targeted preventative and life extending repair during depot level maintenance periods. Supplier participation will improve the accuracy of the predictions by bringing a greater level of fidelity to the design files being analyzed while allowing for more effective design decisions throughout their design development process. Ultimately, as part of the Model Based Engineering initiative, the DoD is expected to establish a neutral exchange or repository, where design data can be used as inputs to reliability models without compromising the integrity of the intellectual property. Tools based on the technology developed during this project will allow the Air Force to leverage this data to drastically improve the average total cost of ownership through more informed maintenance actions. Also, as the availability of quantified Physics of Failure based reliability analyses increases, they are expected to become a greater factor in the government procurement process.
Agency: Department of Defense | Branch: Missile Defense Agency | Program: SBIR | Phase: Phase I | Award Amount: 99.94K | Year: 2016
DfR Solutions and the Rochester Institute of Technology (RIT) have formed a team of experts in solder joint reliability and gold embrittlement to perform a series of experiments that will provide the data necessary to create mechanistic reliability models. Critical to any application of these models and of interpreting experimental results is the ability to determine solder joint gold contamination percent by weight. Phase I will explore non-destructive methods for plating measurement and gold content calculation, and perform destructive analysis to verify the optimal method for determining gold content in solder joints of physical samples. The gold content prediction methodology derived during Phase I will provide the basis for establishing an effective design of experiments to determine the long term reliability effects of various levels of gold contamination. In Phase II and beyond, DfR Solutions and RIT will perform the required testing and create mechanistic reliability models. Prior experience developing solder joint reliability models and a history of creating tools for industry to apply them reduces program risk and provides a clear path to commercial application. Approved for Public Release 16-MDA-8620 (1 April 16)