Agency: European Commission | Branch: H2020 | Program: RIA | Phase: FoF-01-2014 | Award Amount: 4.20M | Year: 2015
Miniaturization, advanced high performance materials and functional surface structures are all drivers behind key enabling technologies in high added value production. It is in such areas that ultrashort pulse lasers have enabled completely new machining concepts, where the big advantages of laser machining are combined with a quasi non-thermal and therefore mild process, which can be used to machine any material with high precision. An important obstacle however that hinders the full exploitation of the unique process characteristics, is the lack of a smart / adaptive machining technology. The laser process in principle is very accurate, but small deviations, e.g. in the materials to be processed, can compromise the accuracy to a very large extend. Therefore feedback systems are needed to keep the process accurate. Within this project the goal is to develop an adaptive laser micromachining system, based on ultrashort pulsed laser ablation and a novel depth measurement sensor, together with advanced data analysis software and automated system calibration routines. The sensor can be used inline with the laser ablation process, enabling adaptive processes by fast and accurate 3D surface measurements. The integrated sensor can be used to: measure the surface topography while machining a part, in order to adapt the micromachining process, leading to highly increased machining accuracies and no defects, measure the surface topography before machining, to scan for existing surface defects that can be removed in an automatically generated machining process, measure complex shaped objects prior to machining, to precisely align the machining pattern to the workpiece, quickly validate results after machining. Therefore, the main objective of this project is to develop a sensor based adaptive micro machining system using ultra short pulsed lasers for zero failure manufacturing.
Agency: European Commission | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-02-2014 | Award Amount: 181.08M | Year: 2015
The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative device architecture and comprising demonstration of a lithographic platform for EUV and immersion technology, advanced process and holistic metrology platforms, new materials and mask infrastructure. A lithography scanner will be developed based on EUV technology to achieve the 7nm module patterning specification. Metrology platforms need to be qualified for N7s 1D, 2D and 3D geometries with the appropriate precision and accuracy. For the 7nm technology modules a large number of new materials will need to be introduced. The introduction of these new materials brings challenges for all involved processes and the related equipment set. Next to new deposition processes also the interaction of the involved materials with subsequent etch, clean and planarization steps will be studied. Major European stakeholders in EUV mask development will collaboratively work together on a number of key remaining EUV mask issues. The first two years of the project will be dedicated to find the best options for patterning, device performance, and integration. In the last year a full N7 integration with electrical measurements will be performed to enable the validation of the 7nm process options for a High Volume Manufacturing. The SeNaTe project relates to the ECSEL work program topic Process technologies More Moore. It addresses and targets as set out in the MASP at the discovery of new Semiconductor Process, Equipment and Materials solutions for advanced CMOS processes that enable the nano-structuring of electronic devices with 7nm resolution in high-volume manufacturing and fast prototyping.
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2011.3.5 | Award Amount: 4.44M | Year: 2012
VECTOR (Versatile Easy installable Connector incorporating new Technologies for accelerated fiber Optic network Roll outs in Europe) aims to develop and commercialize an innovative low-cost highly performing field installable connectivity system that will impact at a multi-million-euro scale the capital expenditure (CAPEX) and the operation expenditure (OPEX) of telecom fiber broadband networks and that will facilitate the achievement of the European 2020 objectives for broadband connectivity.\nThe VECTOR connectivity system will comprise a ferrule-less connector granting ultra-high optical performance and a fully automated installation tool allowing for field installation by a general-skill technician.\nDisruptive fibre-handling techniques based on heat-shrinkable materials, advanced nano-textiles, and plasma-shaping will be developed and incorporated in the installation tool to ensure reliability, whereas high-tech gels and micro-mechanical alignment systems will be included in the connector to yield superior optical performance. Finally, micro-fabrication and replication techniques will be propose to ensure ease of volume production at low price. The use of connectors instead of permanent splices will grant flexible reconfigurability of the network.\n\nOverall, VECTOR aims to outperform the state-of the-art of ferrule-based connectors by optical performance, flexibility, reliability and cost. This will ultimately break the current paradigm of ferrule-based optical connectivity requiring extensive pre-engineering and highly specialized manpower for field deployment.\nIn order to succeed in this ambitious goal, we created a consortium comprising the full portfolio of required technical knowledge, as well as the critical mass necessary to turn our connectivity system into a commercial reality that potentially can be deployed in the optical networks of whole Europe.