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Windach, Germany

Koniger T.,DELO Industrial Adhesives
EMPC 2013 - European Microelectronics Packaging Conference: The Winding Roads of Electronics Packaging | Year: 2013

Key requirements on die attach materials for most MEMS packages include high flexibility. The reason for this is that temperature changes during the assembly process and application may lead to thermo-mechanical stress as a consequence of thermal mismatch (dissimilar coefficients of thermal expansion of substrate, chip and adhesive). Distortion of the signal characteristics of the extremely stress-sensitive MEMS device is the consequence of this thermo-mechanical stress. The newly developed adhesives provide an outstanding combination of high flexibility and high die shear strength, giving them a competitive edge over the currently used MEMS die attach adhesives. This paper describes highly flexible heat-curing adhesives on the basis of acrylates and the patented mCD chemistry with a Young's modulus down to 5 MPa at room temperature. DMTA measurements show that temperature storage at +120 °C does not cause adhesive embrittlement, which would have a negative effect on the MEMS package's reliability. The curing temperatures of these adhesives are extremely low down to +100 °C, which reduces stress development during the assembly process. In addition, the adhesives have very process-friendly properties with processing times of one week. The option of dual curing enables preliminary light fixation of the chip within just seconds. © 2013 IMAPS. Source


Bottcher M.,DELO Industrial Adhesives
Coating International | Year: 2011

When using radiation-curing adhesives, the best suitable curing lamp must be selected in order to achieve extremely short process times in production with top results. The question how light-curing adhesives and the appropriate wavelength must be matched for perfect curing was investigated in comprehensive laboratory tests. Source


Schmitt H.,Fraunhofer Institute for Integrated Systems and Device Technology | Duempelmann P.,Fraunhofer Institute for Integrated Systems and Device Technology | Fader R.,Fraunhofer Institute for Integrated Systems and Device Technology | Rommel M.,Fraunhofer Institute for Integrated Systems and Device Technology | And 5 more authors.
Microelectronic Engineering | Year: 2012

UV-enhanced substrate conformal imprint lithography (UV-SCIL) is a large area nano patterning technique which has the potential to find its way into industrial application. A promising application for UV-SCIL exists in the field of high brightness LEDs. Here, a surface patterning can increase the external quantum efficiency and therefore the light output of LEDs significantly. But, before UV-SCIL can be introduced as patterning technique into industrial application, process relevant parameters like the interaction between the PDMS stamp and the UV-curing material as well as the overall life time of PDMS stamps have to be evaluated. Within this work, stamps from different PDMS material compositions with a diameter of 150 mm were fabricated. These stamps were used to perform UV-SCIL with the epoxy based resist Katiobond OM VE 110707 from DELO Industrial Adhesives and it was found that the final resist layer thickness strongly depends on the PDMS material composition, the number of imprints, and the time between two subsequent imprints. This can be explained by diffusion of one or several components of the UV-curing material into the stamps, which influences the life time of the PDMS stamps. With the actual optimum PDMS material composition, 500 UV-SCIL imprints could be successfully performed without any visible degradation. © 2012 Elsevier B.V. All rights reserved. Source


Fader R.,Fraunhofer Institute for Integrated Systems and Device Technology | Schmitt H.,Fraunhofer Institute for Integrated Systems and Device Technology | Rommel M.,Fraunhofer Institute for Integrated Systems and Device Technology | Bauer A.J.,Fraunhofer Institute for Integrated Systems and Device Technology | And 6 more authors.
Microelectronic Engineering | Year: 2012

In this work, a novel kind of UV curing polymer is introduced as promising resist for UV-enhanced substrate conformal imprint lithography (UV-SCIL). This fully organic polymer is an epoxy based material and can crosslink via UV exposure to form a solid layer. The curing time of 17 s for this epoxy based resist is ten times shorter compared to commonly used resists for UV-SCIL. Imprints with this material are shown in this work as well as results of an HBr dry etch process of silicon, where the material served as etching mask. Using this polymer as resist for UV-SCIL enables shorter process times whereby the fidelity of the structures remains high. © 2012 Elsevier B.V. All rights reserved. Source


Koniger T.,DELO Industrial Adhesives
Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium | Year: 2015

High flexibility is one of the key requirements on die attach materials for most MEMS packages as temperature changes during the assembly process and application lead to thermo-mechanical stress as a consequence of thermal mismatch, i.e. dissimilar coefficients of thermal expansion of substrate, chip and adhesive. A distortion of the signal characteristics of the extremely stress-sensitive MEMS device may be the consequence of this thermo-mechanical stress. For the first time, newly developed adhesives provide an outstanding combination of high flexibility and high die shear strength, giving them a competitive edge over the currently used MEMS die attach adhesives. This paper describes highly flexible heat-curing adhesives on the basis of acrylates and a patented mCD chemistry with Young's modulus values down to 5 MPa (0.725 ksi) at room temperature. DMTA measurements show that temperature storage at +120 °C (+248 °F) does not cause adhesive embrittlement that could negatively affect the reliability of the MEMS package. The curing temperatures of these adhesives are extremely low down to +100 °C (+212 °F), which reduces stress development during the assembly process. In addition, the adhesives have very process-friendly properties and allow processing times of one week. The option of dual curing enables preliminary light fixation of the chip within just seconds. © 2014 IEEE. Source

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