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Seabrook, MD, United States

Teverovsky A.,Dell Services Federal Government Inc.
IEEE Transactions on Dielectrics and Electrical Insulation | Year: 2012

Breakdown voltages in 27 types of virgin and fractured X7R multilayer ceramic capacitors (MLCC) rated to voltages from 6.3 to 100 V have been measured and analyzed to evaluate the effectiveness of the dielectric withstanding voltage (DWV) testing to screen-out defective parts and get more insight into breakdown specifics of MLCCs with cracks. Fractures in the parts were introduced mechanically and by thermal shock stress. To simulate exposure of internal electrodes to environments in fractured parts, breakdown testing was carried out also on cross-sectioned and polished capacitors. © 1994-2012 IEEE.

Oldham T.R.,Dell Services Federal Government Inc. | Chen D.,NASA | Friendlich M.,MEI Technologies Inc. | Carts M.A.,NASA | And 2 more authors.
IEEE Transactions on Nuclear Science | Year: 2011

We have compared the data retention of irradiated commercial NAND flash memories with that of unirradiated controls. For parts aged by baking at high temperature, there was a statistically significant difference between irradiated samples and unirradiated controls. For parts aged by repetitive Program/Erase (P/E) cycling, the effect of radiation was not statistically significant. © 2011 IEEE.

Teverovsky A.,Dell Services Federal Government Inc.
46th International Symposium on Microelectronics, IMAPS 2013 | Year: 2013

Multilayer ceramic capacitors (MLCCs) constitute the majority of components used in electronic assemblies and most of their failures are related to cracks. It is often assumed that dissipation factor (DF), insulation resistance (IR), and breakdown voltage (VBR) are characteristics that are sensitive to the presence of mechanical defects, and screening of capacitors by measurements of these characteristics, and by dielectric withstanding voltage (DWV) testing assures high quality products. This work analyzes the effectiveness of these screening techniques for revealing cracks in high-volumetric efficiency, low-voltage ceramic capacitors. Various types of class II dielectric capacitors with rated voltages from 6.3 V to 100 V, and capacitances from 0.1 μF to 100 μF from different manufactures were used in this study. Fractures in the parts were introduced mechanically and by thermal shock stress. It has been shown that cracking results in relatively minor variations of capacitance and DF. Absorption currents prevail over leakage currents during standard IR measurements at room temperatures, and at high temperatures the intrinsic leakage currents exceed substantially leakage currents caused by cracking thus masking the presence of defects. Analysis of distributions of breakdown voltages in normal capacitors and capacitors with cracks showed that the majority of defective capacitors can pass the DWV testing. New, more effective methods of electrical testing and possible improvement of the existing techniques are discussed.

Kay M.J.,U.S. Navy | Gadlage M.J.,U.S. Navy | Duncan A.R.,U.S. Navy | Ingalls D.,U.S. Navy | And 2 more authors.
IEEE Transactions on Nuclear Science | Year: 2012

Consecutive write operations performed on a Samsung NAND flash memory are shown to significantly increase the total ionizing dose level at which data corruption occurs. Consequences of multiple consecutive write operations are discussed as well as the mechanisms at work. Elevated temperature exposure and page location within a block of the memory are shown to have significant effects on the amount of data corruption observed. The hardness assurance implications of these effects are discussed. © 1963-2012 IEEE.

Teverovsky A.,Dell Services Federal Government Inc.
EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings | Year: 2011

Different size X7R MLCCs have been subjected to three types of thermal shock testing: terminal solder pot dip test, ice water test, and liquid nitrogen drop test. Electrical characteristics of the parts were measured through various test conditions to determine critical temperatures that result in fracturing and electrical failures. Optical examinations and cross-sectional analysis were used to confirm the presence of cracks. Mechanisms of fracturing and the effectiveness of different thermal shock methods are discussed. It is shown that the heat conduction and direction of temperature changes (heating or cooling) are critical factors of thermal shock testing of MLCCs. The probability of fracturing depends also on the level of residual mechanical stresses, mostly in terminal areas of ceramic capacitors. © 2011 IMAPS.

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