Waterloo, Canada
Waterloo, Canada

Teledyne DALSA is a Canadian company specializing in the design and manufacture of specialized electronic imaging components as well as specialized semiconductor fabrication . Wikipedia.


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Patent
Dalsa | Date: 2015-09-11

The disclosed embodiments include an image sensor and a method to manufacture thereof. In one embodiment, the method includes forming a plurality of semiconductor slices having a uniform width, at least two of the semiconductor slices having different lengths, and each of the semiconductor slices having a slice edge defining a side of the semiconductor slice. The method further includes arranging the semiconductor slices to form a semi-rectangular shape defining boundaries of the image sensor, each of the semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices. Forming each semiconductor slice includes forming a plurality of pixel arrays over the semiconductor slice, the pixel arrays having an approximately uniform pixel pitch, and forming a seal ring around the semiconductor slice, the seal ring enclosing the semiconductor slice and the pixel arrays of the semiconductor slice, and each semiconductor slice having a different seal ring.


Patent
Dalsa | Date: 2017-03-15

The disclosed embodiments include an image sensor (100) and a method to manufacture thereof. In one embodiment, the method includes forming a plurality of semiconductor slices (104, 106, 108, 110) having a uniform width, at least two of the semiconductor slices having different lengths, and each of the semiconductor slices having a slice edge (152A, 152B, 154A, 154B, 156A, 156B, 158A, 158B) defining a side of the semiconductor slice. The method further includes arranging the semiconductor slices to form a semi-rectangular shape defining boundaries of the image sensor, each of the semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices. Forming each semiconductor slice includes forming a plurality of pixel arrays (112, 114, 116) over the semiconductor slice (104), the pixel arrays having an approximately uniform pixel pitch, and forming a seal ring (160) around the semiconductor slice, the seal ring enclosing the semiconductor slice and the pixel arrays of the semiconductor slice, and each semiconductor slice having a different seal ring.


A microfluidic check valve has a first chamber (62) divided by a barrier (66) into first and second subchambers (62a,62b) having respectively an inlet port (68) and an outlet port (70). A membrane (56) forms a wall of the first chamber and co-operates with the barrier (66) to selectively permit and prevent fluid flow between the inlet and outlet ports (68,70). A second chamber (54) adjoining the first chamber (62) has a wall formed by the membrane (56). A microfluidic channel (72) establishes fluid communication between the second chamber (54) and the first subchamber (62a). The membrane (56) deflects to permit fluid flow around the barrier (66) when the pressure in the first subchamber (62a) is lower than the pressure in the second subchamber (62b). A microfluidic diaphragm pump comprising two of such check valves is also disclosed.


An apparatus for compressing a video image file is disclosed. The image file includes line segments having a length of M pixels of N bits and a header of H bits. Each pixel is represented by t bits. The apparatus includes a circuit configured to read a first number of unencoded pixel values in a first line segment and read a second number of unencoded pixel values of a second line segment. The first and second line segments preceded by a header of H bits and each pixel value is represented by t bits. The differences between each of the first and second unencoded pixel values is determined. The differences between each of the first and second unencoded pixel values are encoded only using a smallest number of bits t for a given number of bits for each pixel value in the segment, wherein t is defined as an integer between 1 and N.


Patent
Dalsa | Date: 2013-10-02

A radiation imaging device having a moisture impermeable metal layer compressed against a scintillator layer by compressible layer that is mechanically compressed against the scintillator layer. The metal layer is attached to the scintillator substrate by an adhesive ring surrounding the perimeter of the scintillator substrate. The adhesive can further include moisture getter particles. Preferably the metal layer is comprised of aluminum with a thickness between 25 m and 100 m to allow the layer to be flexible as free of pinholes to prevent ingress of moisture. The compressible layer can be compressed by the housing to maintain the metal layer in contact with the scintillator layer. The metal layer not only provides moisture protection for the scintillator but also increases the output of the scintillator by reflecting photons generated by the scintillator layer toward the photodetector array of the radiation imaging device.


Patent
Dalsa | Date: 2013-02-06

A microfabricated device is fabricated by depositing a first metal layer on a substrate to provide a first electrode of an electrostatic actuator, depositing a first structural polymer layer over the first metal layer, depositing a second metal layer over said first structural polymer layer to form a second electrode of the electrostatic actuator, depositing an insulating layer over said first structural polymer layer, planarizing the insulating layer, etching the first structural polymer layer through the insulating layer and the second metal layer to undercut the second metal layer, providing additional pre-formed structural polymer layers, at least one of which has been previously patterned, and finally bonding the additional structural layers in the form of a stack over the planarized second insulating layer to one or more microfluidic channels. The technique can also be used to make cross over channels in devices without electrostatic actuators, in which case the metal layers can be omitted.


An apparatus for compressing a video image file is disclosed. The image file includes line segments having a length of M pixels of N bits and a header of H bits. Each pixel is represented by t bits. The apparatus includes a circuit configured to read a first number of unencoded pixel values in a first line segment and read a second number of unencoded pixel values of a second line segment are read. The first and second line segments preceded by a header of H bits and each pixel value is represented by t bits. The differences between each of the first and second unencoded pixel values is determined. The differences between each of the first and second unencoded pixel values encoded only using a smallest number of bits t for a given number of bits for each pixel value in the segment, wherein t is defined as an integer between 1 and N.


Stand-offs are attached around the periphery of the fiber optic plate (FOP) to ensure a certain minimum thickness between the FOP and the imaging sensor to reduce shear stress and the risk of delamination due to shear stress in an X or Gamma ray detector. A coupling material fills the gap between the FOP and the imaging sensor.


Wirebond protection is provided for imaging tiles in which the imaging sensor and PCB are mounted side-by-side on a tile carrier for use in X or Gamma Ray indirect imaging detectors without use of a glob top encapsulant. A glass cap comprising a bead of adhesive material and a lid is formed to provide an enclosed open-air cavity around the wire bonds. As such, any expansion of the bead material does not produce mechanical stress on the wire bonds.


An imaging sensor having a coupling portion consisting of a plurality of resist portions that act as a light guide to direct light from a fiber optic plate to an imaging die layer. The resist portions can be formed through a photolithographic process to define an air gap between adjacent resist portions. The imaging sensor can further include a scintillator layer that can convert ionizing radiation, such as X-rays and gamma rays used in medical imaging, into optical radiation for detection by the imaging die layer.

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