Waterloo, Canada
Waterloo, Canada

Teledyne DALSA is a Canadian company specializing in the design and manufacture of specialized electronic imaging components as well as specialized semiconductor fabrication . Wikipedia.

SEARCH FILTERS
Time filter
Source Type

A method of making a device having a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame, involves bringing the component and supporting frame together with a layer of adhesive applied between them. The part of the adhesive layer in the shadow of the opaque portions is cured by directing actinic rays obliquely through the openings so that they are reflected internally into the part of the adhesive layer in the shadow of the opaque portions.


Patent
Dalsa | Date: 2017-03-15

The disclosed embodiments include an image sensor (100) and a method to manufacture thereof. In one embodiment, the method includes forming a plurality of semiconductor slices (104, 106, 108, 110) having a uniform width, at least two of the semiconductor slices having different lengths, and each of the semiconductor slices having a slice edge (152A, 152B, 154A, 154B, 156A, 156B, 158A, 158B) defining a side of the semiconductor slice. The method further includes arranging the semiconductor slices to form a semi-rectangular shape defining boundaries of the image sensor, each of the semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices. Forming each semiconductor slice includes forming a plurality of pixel arrays (112, 114, 116) over the semiconductor slice (104), the pixel arrays having an approximately uniform pixel pitch, and forming a seal ring (160) around the semiconductor slice, the seal ring enclosing the semiconductor slice and the pixel arrays of the semiconductor slice, and each semiconductor slice having a different seal ring.


Patent
Dalsa | Date: 2017-05-31

A device has planar components forming part of a stack on a support frame, such as a substrate and upper layer, for example a fiber optic scintillator/fiber optic plate, bonded together by an adhesive layer of well-defined thickness. The device is made by providing a trench in a peripheral recess extending in a marginal portion of the support frame. Excess adhesive is applied to one of the planar components, which are then brought together such that the adhesive layer of well-defined thickness is formed between the two components and surplus adhesive is collected in the trench.


Patent
Dalsa | Date: 2015-09-11

The disclosed embodiments include an image sensor and a method to manufacture thereof. In one embodiment, the method includes forming a plurality of semiconductor slices having a uniform width, at least two of the semiconductor slices having different lengths, and each of the semiconductor slices having a slice edge defining a side of the semiconductor slice. The method further includes arranging the semiconductor slices to form a semi-rectangular shape defining boundaries of the image sensor, each of the semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices. Forming each semiconductor slice includes forming a plurality of pixel arrays over the semiconductor slice, the pixel arrays having an approximately uniform pixel pitch, and forming a seal ring around the semiconductor slice, the seal ring enclosing the semiconductor slice and the pixel arrays of the semiconductor slice, and each semiconductor slice having a different seal ring.


Patent
Dalsa | Date: 2014-07-25

A device has planar components forming part of a stack on a support frame, such as a substrate and upper layer, for example a fiber optic scintillator/fiber optic plate, bonded together by an adhesive layer of well-defined thickness. The device is made by providing a trench in a peripheral recess extending in a marginal portion of the support frame. Excess adhesive is applied to one of the planar components, which are then brought together such that the adhesive layer of well-defined thickness is formed between the two components and surplus adhesive is collected in the trench.


A method of making a device having a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame, involves bringing the component and supporting frame together with a layer of adhesive applied between them. The part of the adhesive layer in the shadow of the opaque portions is cured by directing actinic rays obliquely through the openings so that they are reflected internally into the part of the adhesive layer in the shadow of the opaque portions.


An apparatus for compressing a video image file is disclosed. The image file includes line segments having a length of M pixels of N bits and a header of H bits. Each pixel is represented by t bits. The apparatus includes a circuit configured to read a first number of unencoded pixel values in a first line segment and read a second number of unencoded pixel values of a second line segment. The first and second line segments preceded by a header of H bits and each pixel value is represented by t bits. The differences between each of the first and second unencoded pixel values is determined. The differences between each of the first and second unencoded pixel values are encoded only using a smallest number of bits t for a given number of bits for each pixel value in the segment, wherein t is defined as an integer between 1 and N.


An apparatus for compressing a video image file is disclosed. The image file includes line segments having a length of M pixels of N bits and a header of H bits. Each pixel is represented by t bits. The apparatus includes a circuit configured to read a first number of unencoded pixel values in a first line segment and read a second number of unencoded pixel values of a second line segment are read. The first and second line segments preceded by a header of H bits and each pixel value is represented by t bits. The differences between each of the first and second unencoded pixel values is determined. The differences between each of the first and second unencoded pixel values encoded only using a smallest number of bits t for a given number of bits for each pixel value in the segment, wherein t is defined as an integer between 1 and N.


Stand-offs are attached around the periphery of the fiber optic plate (FOP) to ensure a certain minimum thickness between the FOP and the imaging sensor to reduce shear stress and the risk of delamination due to shear stress in an X or Gamma ray detector. A coupling material fills the gap between the FOP and the imaging sensor.


Wirebond protection is provided for imaging tiles in which the imaging sensor and PCB are mounted side-by-side on a tile carrier for use in X or Gamma Ray indirect imaging detectors without use of a glob top encapsulant. A glass cap comprising a bead of adhesive material and a lid is formed to provide an enclosed open-air cavity around the wire bonds. As such, any expansion of the bead material does not produce mechanical stress on the wire bonds.

Loading DALSA collaborators
Loading DALSA collaborators