Dainippon Screen Manufacturing Co. | Date: 2014-03-12
In a substrate processing apparatus, an election head from a position above a substrate held by a substrate holding part to an inspection position above a standby pod disposed outside a cup part. At the inspection position, a processing liquid ejected from the ejection head toward the standby pod is irradiated with planar light emitted from a light emitting part. An imaging part acquires an inspection image including bright dots appearing on the processing liquid, and a determination part determines the quality of the ejection operation of the ejection head on the basis of the inspection image. Accordingly, it is possible to eliminate the influence of reflected light from the substrate and droplets, mist, or the like of the processing liquid having collided with the substrate and to accurately determine the quality of the ejection operation of the ejection head.
Dainippon Screen Manufacturing Co. | Date: 2014-04-09
In a substrate processing apparatus, an ejection surface of an ejection head located at a standby position is immersed in an immersion liquid retained in a reservoir during standby of the ejection head. This prevents drying of a plurality of outlets provided in the ejection head and drying of processing liquid flow passages that communicate with the outlets. It is thus possible to suppress or prevent clogging of the fine outlets. When the ejection head resumes processing on a substrate, the immersion liquid in the reservoir is discharged and then a liquid removing part removes the immersion liquid adhering to the ejection surface. Accordingly, it is possible to prevent the immersion liquid remaining on the ejection surface from dropping and adhering to the substrate (so-called liquid dripping) when, for example, the ejection head is moved to a position above the substrate.
Dainippon Screen Manufacturing Co. | Date: 2014-08-11
A substrate treatment method is provided, which includes a liquid film retaining step of retaining a liquid film of a treatment liquid on a major surface of a substrate, and a heater heating step of locating a heater in opposed relation to the major surface of the substrate to heat the treatment liquid film by the heater in the liquid film retaining step, wherein an output of the heater is changed from a previous output level in the heater heating step.
Dainippon Screen Manufacturing Co. | Date: 2014-08-22
Dainippon Screen Manufacturing Co. | Date: 2014-09-02
A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off a liquid remaining on the substrate, and a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate.