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Caen, France

Koumoto K.,Nagoya University | Funahashi R.,Japan National Institute of Advanced Industrial Science and Technology | Guilmeau E.,CRISMAT Laboratory | Miyazaki Y.,Tohoku University | And 4 more authors.
Journal of the American Ceramic Society | Year: 2013

Metal oxides (Ca3Co4O9, CaMnO3, SrTiO3, In2O3), Ti sulfides, and Mn silicides are promising thermoelectric (TE) material candidates for cascade-type modules that are usable in a temperature range of 300-1200 K in air. In this paper, we review previous studies in the field of TE materials development and make recommendations for each material regarding future research. Furthermore, the R&D of TE modules composed of metal oxide materials and the prospect of their commercialization for energy harvesting is demonstrated. © 2012 The American Ceramic Society. Source


Ben Salah M.,Presto Engineering | Pasquet D.,CRISMAT Laboratory | Voiron F.,IPDIA Inc | Descamps P.,CRISMAT Laboratory | Levebfre J.-L.,Presto Engineering
IEEE International Symposium on Electromagnetic Compatibility | Year: 2014

This paper presents an original concept of a 3D-PICS High density Integrated Passive Device Technology with P+ guard rings realized in a 300μm depth High Resistivity Silicon Substrate (HRS) in order to reduce significantly the substrate noise coupling. In this paper, a 3D-PICS IPD test chip was studied as the passive part prototype of a System-In-Package chip in combination with RF transceiver operating in the ISM band (863-870 MHz). Various configurations of the passive chip layout (including implementation of guard rings) have been characterized by Direct Power Injection. 3D-PICS electrical performances deduced from two-ports S-parameters are reported, as well as the guard rings efficiency measurements and a compact high frequency model based on S-parameters extraction. Coupling isolation performances of the new integrated PICS components are found satisfactory. © 2014 IEEE. Source


Ben Salah M.,Presto Engineering | Pasquet D.,CRISMAT Laboratory | Voiron F.,IPDIA Inc | Descamps P.,CRISMAT Laboratory | And 2 more authors.
2013 IEEE 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2013 - RWW 2013 | Year: 2013

This paper presents an original concept of a P+ guard ring realized in a 300μm depth High Resistivity Silicon Substrate (HRS) in order to reduce the substrate noise coupling in a 3D-PICS Integrated Passive Device technology. Guard rings have been designed to be a reliable and efficient protection against noise signals propagation. Case study presented in this work illustrates its significant role. In this paper, a 3D-PICS IPD test chip was studied as a first passive part prototype of a System-In-Package chip in combination with RF transceiver operating in the ISM band (863-870 MHz). Various configurations of the passive chip layout (including implementation of guard rings) have been characterized by Direct Power Injection. 3D-PICS electrical performances deduced from two-ports S-parameters are reported, as well as the guard rings efficiency measurements extracted from these S-parameters. Coupling isolation performances of the new integrated PICS components are found satisfactory. © 2013 IEEE. Source


Marinel S.,CRISMAT Laboratory | Savary E.,CRISMAT Laboratory | Gomina M.,CRISMAT Laboratory
Journal of Microwave Power and Electromagnetic Energy | Year: 2010

A specifc TE 10m microwave cavity has been designed to follow-up the shrinkage during the microwave sintering of ceramics powders using an optical based position sensing device. The basic principle consists in measuring the distance from a laser source to the sample surface by means of a triangulation method. The spatial resolution device is around a few micrometers that enables to accurately measure the shrinkage versus time of a microwave irradiated sample. The shrinkage curves have been recorded during the direct microwave sintering of CuO and ZnO. Sintering kinetics has been found extraordinarily fast as only a few seconds are needed to achieve the maximum shrinkage for both materials. This new method is undoubtedly powerful to increase our understanding of microwave sintering and very useful to control the microstructure of microwave sintered ceramics. Source


Savary E.,CRISMAT Laboratory | Marinel S.,CRISMAT Laboratory | Colder H.,CRISMAT Laboratory | Harnois C.,CRISMAT Laboratory | And 2 more authors.
Powder Technology | Year: 2011

Zinc oxide is a widely used material in various applications in electronic, optic, and spintronic fields, in particular. The control of the final properties of ZnO requires the mastering of the final microstructure. To achieve this goal, the grain growth of ZnO has been examined as a function of the sintering conditions, in particular in using a specific microwave sintering method. In order to get nano-sized ZnO powder as a starting material, a liquid route was implemented. The latter is based on the direct precipitation of a zinc oxalate solution. After thermal treatment, pure ZnO powder was obtained with a very narrow grain size distribution, centered at around 20. nm. The sintering of this powder was then carried out in conventional and microwave furnaces. While an important grain growth occurs during the conventional sintering, it is shown that microwave sintering allows us to maintain the grain size at the nano-metric scale. © 2010 Elsevier B.V. Source

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