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Parker E.,Crane Aerospace and Electronics | Narveson B.,Narveson Innovative Consulting | Alderman A.,Anagenesis Inc. | Burgyan L.,LTEC Corporation
IEEE International Workshop on Integrated Power Packaging, IWIPP 2015 | Year: 2015

The Packaging Committee of the Power Sources Manufacturers Association (PSMA) organized and sponsored a special project to study how innovations in 3D packaging either were currently or are projected to be leveraged by the power electronics industry. Phase 1 of this special project resulted in a Technology Report titled '3D Power Packaging' [1] that was prepared under contract by Tyndall Institute of Cork, Ireland and published March 2014. Phase 2 of the special project continued to examine 3D power packaging but with a focus on embedded substrate technologies; it was prepared under contract LTEC Corporation with subcontract to Anagenesis, Inc. and Fraunhofer-Institure and was published March 2015 [2]. The phase 2 report covers a spectrum from active and passive component technologies for embedding, die attach materials and processes, thermal management, and additive manufacturing; however the heart of the report is a chapter on technologies for embedding in PCBs and inorganic substrates. This paper provides an overview of the findings from that report regarding technologies that are currently in production and those forecast to be viable for volume production in the near future. © 2015 IEEE.

News Article | November 12, 2016

The report Global DC-DC Converter Market Research Report- Industry Analysis, Size, Share, Growth, Trends and Forecast 2015-2022 published by The report covers the growth trend and complete market overview. The report is useful for business strategists for gaining a detailed understanding about the market, its value chain, competitor study and detailed company profile. The huge surge in the DC-DC Converter market demand is majorly attributed to the growing focus on new opportunity for power conservation along with the evolution of innovative power-saving architectures and growth of hybrid DC-DC converter for various space applications.  Additionally, rising need for high power by the ICT industry along with the expansion of digital power control & management technologies will further aid in the growth of the market over the coming years. A DC-DC converter is an electromechanical device which acts as a high electric power converter by converting direct current from one voltage range to another. It incorporates an electronic circuit where power levels vary from a very low to a very high voltage such as small batteries to high-voltage power transmission. The rising number of satellite constellations globally and increasing space programs by various space organizations are anticipated to spur market demand over the coming years. However, rising incompetency of these converters to switch-off during no-load circumstances is a major challenge, which may hinder market growth in the near future. The global market has been segmented based on output voltage into 3.3v, 5v, 12v, 15v and others. The 3.3 VDC is a major output voltage segment and is projected to grow at the highest CAGR over the forecast period due to rising innovation in the area of digital power management and control in order to support the power schemes of newly introduced spacecraft & satellites. The market has been further segmented based on output number into single, dual and others. Furthermore, the market has been segmented based on output power and application. The communication is a fastest growing segment and is estimated to witness a double digit growth in the study period. The growth of this segment is attributed to growing number of communication satellites across the globe along with the increasing paid TV market. The rapid technological advancements and recent favorable modifications in the U.S. export administration in the aeronautics & space industry has been the major drivers accounting for the dominance of North America on the global market. Asia Pacific is a fastest growing market and is projected to grow at an outstanding rate over the coming years on account of the rising number of launch of technologically advanced communication satellites along with the expanding paid TV market in the region. Major players assessed in the report are: > Artesyn Embedded Technologies > Bel Fuse Corporation > Cosel Co., Ltd > Crane Aerospace and Electronics > Delta Electronics Inc. > Ericsson > FDK Corporation > General Electric > Murata Manufacturing Co. Ltd. > Texas Instruments > Traco Electronic AG > Vicor Corporation METHODOLOGY: A combination of primary and secondary research has been used to determine the market estimates and forecasts. Sources used for secondary research include (but not limited to) Paid Data Sources, Company Websites, Technical Journals, Annual Reports, SEC Filings and various other industry publications. Specific details on methodology used for this report can be provided on demand. 1. INTRODUCTION 2. EXECUTIVE SUMMARY     3. MARKET ANALYSIS 4. DC-DC CONVERTER MARKET ANALYSIS BY OUTPUT VOLTAGE 5. DC-DC CONVERTER MARKET ANALYSIS BY OUTPUT NUMBER 6. DC-DC CONVERTER MARKET ANALYSIS BY OUTPUT POWER 7. DC-DC CONVERTER MARKET ANALYSIS BY APPLICATION 8. DC-DC CONVERTER MARKET ANALYSIS BY GEOGRAPHY 9. COMPETITIVE LANDSCAPE OF THE DC-DC CONVERTER COMPANIES 10. COMPANY PROFILES OF THE DC-DC CONVERTER INDUSTRY is a global business research reports provider, enriching decision makers and strategists with qualitative statistics. is proficient in providing syndicated research report, customized research reports, company profiles and industry databases across multiple domains.   Our expert research analysts have been trained to map client’s research requirements to the correct research resource leading to a distinctive edge over its competitors. We provide intellectual, precise and meaningful data at a lightning speed.

Ngachin M.,Waste Control Specialists LLC | Galdamez R.G.,Crane Aerospace and Electronics | Gokaltun S.,Florida International University | Sukop M.C.,Florida International University
International Journal of Modern Physics C | Year: 2015

This study describes the behavior of bubbles rising under gravity using the Shan and Chen-type multicomponent multiphase lattice Boltzmann method (LBM) [X. Shan and H. Chen, Phys. Rev. E47, 1815 (1993)]. Two-dimensional (2D) single bubble motions were simulated, considering the buoyancy effect for which the topology of the bubble was characterized by the nondimensional Eötvös (Eo), and Morton (M) numbers. In this study, a new approach based on the "effective buoyancy" was adopted and proven to be consistent with the expected bubble shape deformation. This approach expands the range of effective density differences between the bubble and the liquid that can be simulated. Based on the balance of forces acting on the bubble, it can deform from spherical to ellipsoidal shape with skirts appearing at high Eo number. A benchmark computational case for qualitative and quantitative validation was performed using COMSOL Multiphysics based on the level set method. Simulations were conducted for 1 ≤ Eo ≤ 100 and 3 × 10-6 ≤ M ≤ 2.73 × 10-3. Interfacial tension was checked through simulations without gravity, where Laplace's law was satisfied. Finally, quantitative analyses based on the terminal rise velocity and the degree of circularity was performed for various Eo and M values. Our results were compared with both the theoretical shape regimes given in literature and available simulation results. © 2015 World Scientific Publishing Company.

Wang F.F.,Crane Aerospace and Electronics
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 | Year: 2013

Cadmium plated circular connectors and chromate conversion coated aluminum chassis are widely used on electronic equipment for both civilian and military aerospace applications. This article discusses electrical bonding resistance problems associated with cadmium plated circular connectors and chromate conversion coated aluminum chassis and proposes an innovative way to solve that problem. Copyright © 2013 by ASME.

Wang F.F.,Crane Aerospace and Electronics
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 | Year: 2013

This article is about the application of liquid cooling in high power aerospace electronics. This article discusses liquid cooled cold plate fluid channel layout design strategy based on hand or analytical calculations before the three dimensional thermal model is constructed. Everybody knows how to perform thermal analysis using CFD software; however, CFD software cannot generate three dimension models automatically. Thermal engineers still need to design preliminary models to analyze. CFD software cannot solve the problems for the designer. Computers cannot substitute the human in design. In the end, it is the thermal engineer's education, experience, knowledge, strategic thinking, and know-how that determine the outcome of the design. To simplify the task, sections of the cooling channel are suggested to be designed individually to meet the cooling needs of each individual component that segment of the fluid channel is cooling. The sections of the fluid channel routed directly underneath the heat dissipating components can be connected in parallel or in series. This article will discuss the pros and cons of both design approaches. Pressure drops versus heat transfer are the tradeoffs of the fluid layout design. An example of the analytical pressure drop calculation is provided. This article also provides guidance on calculating the flow rate of each of the cooling sections and the strategy of determining the linear velocity of the liquid. In the discussion, a brief trade study of machined or casted cold plate versus tube-in-plate cold plate design is presented. Positioning of the cold plate to control the internal ambient temperature is also briefly discussed. © 2014 ASME.

Furmanczyk K.,Crane Aerospace and Electronics | Stefanich M.,Crane Aerospace and Electronics
SAE International Journal of Aerospace | Year: 2012

Aircraft electrical power consumption has dramatically increased in recent years. Technological advancements have led to the replacement of traditional hydraulic and pneumatic systems with electrically powered devices. In addition, new functions such as deicing and entertainment systems have been added, which further increases the demand for electrical power. As power needs increase, voltage or current, or both, must be increased. Increased current can be the least desirable result as it leads to larger and heavier wires. To mitigate the issue of wire weight and distribution losses, the latest "More Electric Aircraft" have adopted 230 V ac as the main power bus voltage. However, this presents a problem as a significant amount of existing electrical aircraft equipment (actuators, pumps, etc.) have been designed to use 270 V dc power, which is obtained by a direct rectification of 115 V ac power. Two hundred seventy volts dc cannot be as simply produced from a 230 V ac bus. This paper provides details on new practical ATRU topologies that convert 3-phase 230 V ac into 270 V dc. Designs of 12-pulse and 18-pulse ATRUs are addressed. A design example of 230 V ac to 270 V dc ATRU is covered in the paper. Also, performance results from demonstration hardware, including power quality, regulation, efficiency, and reliability are provided. © 2012 SAE International.

Altshuller D.A.,Crane Aerospace and Electronics
Proceedings of the 2010 American Control Conference, ACC 2010 | Year: 2010

The paper considers the problem of robust stability for a class of linear time-periodic systems with a matrix having a stable constant part. The main result is given in terms of the frequency response of the constant part and is then used to derive simple stability criteria for some special cases, including the Hill's and Mathieu's equations. © 2010 AACC.

Garcia R.C.,Crane Aerospace and Electronics | Sedlmair J.,Crane Aerospace and Electronics
46th International Symposium on Microelectronics, IMAPS 2013 | Year: 2013

In hybrid electronics, it is a standard practice to perform 100% wire bond pull testing to ensure robust wire bonding of the components. The principle behind Mil-STD-883 method 2023.5 compliant wire bond pull testing is to position the hook underneath the wire and either pull until the wire breaks or, alternatively, pull to a predefined force. With high density layouts, small component geometry or staggered wire bonds, it has been a challenge for manufacturing operations to maintain consistency in "manually" placing the wirepull hook on wires with varying height, looping profiles and wire distances. The influence of loop height and wire distance is a significant factor in determining the true wire pull strength. A low wire loop will result in lower measured pull strength, while a higher loop will result in higher pull strength. Therefore, if we can accurately quantify the loop height and profile then we can place the wirepull hook in the optimum position for pulling. In this study we will demonstrate how the "parallelogram of forces" can affect wirepull measurements. With the advent of the current generation of automated wirebond pull testers, we can accurately determine the appropriate correction factor(s) for varying loop heights in order to position the wirepull hook at the precise location necessary for accurate and meaningful results. In addition, with real time yield monitoring, the new pull testers are capable of locating and identifying missing wires that can often be attributed to the high density of today's circuit designs.

Wang F.F.,Crane Aerospace and Electronics
SAE Technical Papers | Year: 2014

This article is about the issues associated with the published thermal data from commercial off the shelf (COTS) component manufacturers. Some of the published electrical component thermal data can be confusing and/or misleading. This article discusses the possibility of wrong design decisions that can be made using published COTS thermal data. There are two major issues of the published thermal data associated with the use of COTS components. One is the published ambient temperature rating. Another is the published thermal resistance. This paper will discuss these two major issues in details and provide mitigation suggestions. Copyright © 2014 SAE International. © 2014 SAE International.

Spencer K.,Crane Aerospace and Electronics
Microwave Journal | Year: 2011

The Multi-Mix micro-multi-function module technology described in this article is being used for highly integrated assemblies. These include frequency converters, T/R modules, beamformers, radiating elements and advanced switch matrices. The belief is that the use of this technology will allow designers greater flexibility and the ability to add further levels of integration in the same footprint currently being utilized. The platform also provides for low loss, highly reliable structures without the sacrifice of cost and size.

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